Table of Contents
Advertisement
4.2 Oscillation Circuit
The S1C60N03 Series has a built-in oscillation circuit that generates the operating clock of the CPU and
the peripheral circuit. Either crystal oscillation or CR oscillation can be selected for the oscillation circuit
by mask option.
4.2.1 Crystal oscillation circuit
The crystal oscillation circuit can be selected by mask option. The oscillation frequency (fosc) is 32.768
kHz (Typ.).
Figure 4.2.1.1 shows the configuration of the crystal oscillation circuit.
As Figure 4.2.1.1 indicates, the crystal oscillation circuit can be configured simply by connecting the
crystal oscillator X'tal (Typ. 32.768 kHz) between the OSC1 and OSC2 terminals and the trimmer capaci-
tor C
(5–25 pF) between the OSC1 and V
G
Note: The OSC1 and OSC2 terminals on the board should be shielded with the V
4.2.2 CR oscillation circuit
The CR oscillation circuit can also be selected by mask option. The oscillation frequency (fosc) is 65 kHz
(Typ.).
Figure 4.2.2.1 shows the configuration of the CR oscillation circuit.
As Figure 4.2.2.1 indicates, the CR oscillation circuit can be configured simply by connecting the resistor
R
between terminals OSC1 and OSC2 since capacity (C
CR
See Chapter 6, "Electrical Characteristics" for R
S1C60N03 TECHNICAL MANUAL
CHAPTER 4: PERIPHERAL CIRCUITS AND OPERATION (Oscillation Circuit)
V
DD
OSC1
C
G
X'tal
OSC2
Fig. 4.2.1.1 Configuration of crystal oscillation circuit
terminals.
DD
OSC1
C
CR
OSC2
Fig. 4.2.2.1 Configuration of CR oscillation circuit
CR
CPU
and peripheral circuits
C
D
V
DD
CPU
and peripheral circuits
) is built-in.
CR
value.
EPSON
(+ side).
DD
11
Advertisement
Table of Contents
