Lan8740A Phy Daughter Board Bill Of Materials - Microchip Technology PIC32MZ User Manual

B.2

LAN8740A PHY DAUGHTER BOARD BILL OF MATERIALS

TABLE B-2:
Reference
C1, C3, C7, C8 Cap, Ceramic, 1 µF, 16V X5R
C2, C4, C5, C6 Cap, Ceramic, 0.1 µF, 50V X7R
C9
C10, C11,
C12, C13
C14
FB1
J1
@J1
J2
R1, R2, R3,
R4, R6, R8
R5, R16
R7
R11, R12,
R13, R14
R15
R17, R18,
R19, R20
R21, R22
R23
U1
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LAN8740A PHY DAUGHTER BOARD BILL OF MATERIALS
Description
CAP 470 µF 50V CERAMIC X7R 0603
CAP CER 12 µF 50V 5% NPO 0603
CAP CER 0.022 µF 50V 20% X7R 0603
FERRITE CHIP 600 OHM 500 mA 0805
TWO CONN HEADER .050" 12 POS PCB GOLD Sullins Connector Solutions
TWO CONN HEADER .050" 3 POS PCB GOLD
CONN MAGJACK 1 PORT 100 BASE-TX
RES 4.70K OHM 1/10W 1% 0603 SMD
RES 10K OHM 1/10W 1% 0603 SMD
RES 1.50K OHM 1/10W 1% 0603 SMD
RES 33 OHM 1/10W 1% 0603 SMD
RES 12.1K OHM 1/10W 1% 0603 SMD
RES TF 1/10W 49.9 OHM 1% 0603
RES TF 1/10W 249 OHM 1% 0603
RES 0.0 OHM 1/4W 0805 SMD
TX/RX Ethernet 32-pin QFN
Bill of Materials
Manufacturer
TDK Corporation
TDK Corporation
Yageo
Yageo
Murata Electronics North America GRM188R71H223MA01D
TDK Corporation
Sullins Connector Solutions
Pulse Electronics Corporation
Panasonic - ECG
Stackpole Electronics Inc.
Vishay Dale
Stackpole Electronics Inc.
Stackpole Electronics Inc.
Stackpole Electronics Inc.
Stackpole Electronics Inc.
Yageo
Microchip Technology Inc.
Part No.
C1608X5R1C105K
C1608X7R1H104M
CC0603KRX7R9BB471
CC0603JRNPO9BN120
MMZ2012Y601B
GRPB121VWVN-RC
GRPB031VWVN-RC
J3011G21DNL
ERJ-3EKF4701V
RMCF0603FT10K0
CRCW06031K50FKEA
RMCF0603FT33R0
RMCF0603FT12K1
RMCF0603FG49R9
RMCF0603FG249R
RC0805JR-070RL
LAN8740A
DS70005230B-page 31