Related Manuals for Microchip Technology SAM Series
Summary of Contents for Microchip Technology SAM Series
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Page 1: Pic32Mz, Pic32Mx, Pic32Mm, Pic32Mk, Pic32C, And Sam Devices
Basic 32-Bit MCU Design and Troubleshooting Checklist PIC32MZ, PIC32MX, PIC32MM, PIC32MK, PIC32C, and SAM Devices Manual DS70005439B-page 1 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 2: Table Of Contents
11. Serial Data Corruption Errors........................33 11.1. Impedance Matching........................33 11.2. Ground Loops..........................35 11.3. SPI/SQI............................36 11.4. SD Host Controller (SDHC)......................39 11.5. UART............................41 11.6. USB............................43 11.7. CAN FD............................47 Manual DS70005439B-page 2 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 3 The Microchip Website..........................73 Product Change Notification Service......................73 Customer Support............................73 Microchip Devices Code Protection Feature....................73 Legal Notice..............................74 Trademarks..............................74 Quality Management System........................75 Worldwide Sales and Service........................76 Manual DS70005439B-page 3 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 4: Frequently Asked Questions (Faqs)
Problem 31: The SD Card cannot be accessed. Problem 32: Why is the UART data corrupted? Problem 33: Why is the first UART byte always wrong after a power-up or wake from sleep? Manual DS70005439B-page 4 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 5 Problem 40: Why is the SAR ADC results not consistent and/or accurate? Problem 41: Why does the I C com link not work? Problem 42: An ETHERNET connection cannot be established. Manual DS70005439B-page 5 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 6: List Of Figures
Typical SAM / PIC32CM SAR ADC Block Diagram Illustration. S and Push Button Protection Design Illustration. C Protection Design Illustration. Power Source Input Protection Illustration. ETHERNET RMII Design Example Illustration. Manual DS70005439B-page 6 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 7 Analog Versus Digital Ground Layout Placement. Grounding Recommendations for External Connectors. Printed Circuit Board Layout Examples. Current Loops in the PCB Design Illustration. High Speed Signal Termination Scope Plot Illustration. Manual DS70005439B-page 7 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 8: List Of Tables
CAN FD Bit Time Registers. Example I C Level Shifter Logic Truth Table. Ethernet Magnetics Selection Criteria. PCB Trace Impedance Calculation Example: Typical Trace Thicknesses Based on Copper Weight. Manual DS70005439B-page 8 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 9: List Of Equations
C1 = C2 = ((2 * MFG C spec) - C - (2 * PCB capacitance)). LOAD LOAD Equation 3: PCB signal series termination resistor(s) value = {[(VDD-VOH(min)) / IOH(max)] - Trace Impedance}. Manual DS70005439B-page 9 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 10: Introduction
Complete the information review noted in the “completed” column in the Design and Trouble Shooting Menu Chapter 1, prior to submitting an issue. Microchip Client Support Services www.microchip.com/clientsupport Microchip Technical Support Services microchipsupport.force.com/s/ Manual DS70005439B-page 10 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 11: Basic 32-Bit Mcu Design And Troubleshooting Menu Checklist
STEP 2: Use this checklist to reference applicable sections of interest. STEP 3: Complete the information review noted in the “completed” column of this table, prior to submitting an issue. Manual DS70005439B-page 11 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 12: Mcu Start-Up Problems
VPOR specification to guarantee a proper Power-on-Reset (POR). Therefore all MCUs have VDD ramp rate specifications, sometimes including even ramp down rates to cover partial transitory power loss due to power grid fluctuations. Figure 7-1. VDD Ramp Rate Violation Example Manual DS70005439B-page 12 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 13: Power Bypassing
All capacitors ceramic w/ESR ≤ 1 Ohm ideally. • All caps located on same side of the PCB as the MCU, except with packages, such as BGA where interior package pins are not accessible. Manual DS70005439B-page 13 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 14 PIC32 MX/MM/MK/MZ VUSB3V3 1. VCAP Pin only present on PIC32MX/PIC32MM family. 2. VCORE & VDDR1V8 Pin only present on PIC32MZxxDAxx family. 3. If External +VREF utilized. Return to Checklist Manual DS70005439B-page 14 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 15: Power Sequencing
7-1, 7-5B, and 7-6). Note: Even the same regulator part number will ramp up at different rates depending on the load and bulk capacitance of the power bus. Return to Checklist Manual DS70005439B-page 15 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 16: I/O Pin Current Injection From Remote Circuits
Power sequencing in the interconnected PCB network • Ground loops which are covered later Figure 7-5. I/O Pin Current Injection Remote PCB_1 Power Power Supply C Supply A Remote PCB_2 Power Supply B Manual DS70005439B-page 16 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 17 MCU reset pin in the configuration shown in the following figure. Method 2: Same concept and net result of Method 1, except using the MCU PCB VOUT as remote PCB regulator ENABLE signal. Manual DS70005439B-page 17 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 18: Crystal Oscillators
B2 errata concerning restricted operating frequency versus Flash WS (i.e., wait states as defined in PRECON.PFMWS). Manual DS70005439B-page 18 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 19 The automatic gain control will be better described as a gain attenuator in that for the selected user, the gain setting will attenuate it to achieve the lowest power level to sustain oscillation. Return to Checklist Manual DS70005439B-page 19 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 20 FET probe with ≤ 2 pF for good results. A standard Oscilloscope 10-12 pF probe will load and attenuate the crystal giving inaccurate results. XTAL = 1M OSC2 OSC1 Manual DS70005439B-page 20 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 21: Clock Switching
If the IESO HDW clock switch is successful, the final clock will be the one defined by FNOSC in the configuration words. Otherwise, if the SW clock switch is successful then the clock source is defined by the NOSC bits in the OSCCON register. Manual DS70005439B-page 21 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 22 Write SPLLCON.PLLICLK to select FRC as input to the PLL. Perform the OSCCON unlock sequence. Write NOSC = SPLL and OSWEN = 1 to perform the OSCCON clock switch. Return to Checklist Manual DS70005439B-page 22 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 23: Unexpected Resets
– (VREG1_V (min)+0.15)) TRIP DROPOUT R2 = (V (min) * 10k) / (V 30Ω TRIP (min) R1=10K NOTE: Round R2 down to 1 decimal point RU1J002YNTCL Transistor T1 BCW32LT1G Manual DS70005439B-page 23 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 24: Nmi And Exception Events
MCU. The most common results of an ESD, EMI, or EFT event are as follows: • MCU and system Resets • MCU Lockups • Component failure Manual DS70005439B-page 24 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 25 PCB. PCB ESD tests only allow for AIR DISCHARGE, an electrical arc discharges directly above the PCB, usually 1 inch. Return to Checklist Manual DS70005439B-page 25 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 26: Debug Issues
Do not use multiplexing on active PGCx/PGDx: They are dedicated for communications to MPLAB ICD 4/ RealIce. • Do not use capacitors on PGCx/PGDx: They will prevent fast transitions on data and clock lines during programming and debug communications. Manual DS70005439B-page 26 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 27 Pin Cable ICD4 RJ-45 RJ-45 RJ-11 RJ-11 JTAG / SWD 8 Pin Cable ICD4 RJ11 Cable MCU RJ11 Cable ICD4 RJ45 Target MCU RJ45 (Male Conn) (Male Conn) Signal (Female Conn) (Female Conn) (6) Pin RJ11 (6) Pin RJ11 (8) Pin RJ11 (8) Pin RJ11 TMS / SWDIO TCK / SWTCLK / PGC TDO / SWO / PGD NMCLR (#MCLR) Manual DS70005439B-page 27 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 28: Jtag/Swd
MCU PCB (RJ45 Conn) NMCLR NMCLR / NRST MI0805J102R-10 TDO / SWO TDO / SWO TCK / SWDCLK TCK / SWDCLK TMS / SWDIO TMS / SWDIO RESET SUPERVISOR Manual DS70005439B-page 28 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 29 If MCU system clock source is not working (POSC, XOSC, XOSC32, FRC and so on) your debugger will not function. Check clocks sources and user clock configurations. Return to Checklist Manual DS70005439B-page 29 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 30: Pcb Mcu Connections
VUSB3V3, not the VDD. The standard USB signals in the list above are dedicated pins and not multiplexed with any other alternate function or I/O. The USBID and VBUSON functions have alternate functions and I/O mapping capabilities. Manual DS70005439B-page 30 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 31: Mclr#/Resetn
ADC time at a reasonable ADC throughput rate. The effective ADC sample/hold RC sampling time now is simply the ADC internal R . Internal ADC R is generally between 2-5k. R1 is a SAMPLE SAMPLE SAMPLE non-factor now. Manual DS70005439B-page 31 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 32 MCU VBAT Input Pin Bypassing VDDx VBAT ADC IN_0 VDDx Equivalent Circuit Capacitor charge ratio = VDDx = 0.22uf / 3pf = 73,333:1 ADC IN_0 I/O PIN VDDx Return to Checklist Manual DS70005439B-page 32 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 33: Serial Data Corruption Errors
= 33 Ohms Note: Too much termination resistance will impact the slew rate and speed of the signal to the point that the signal no longer meets specified timing requirements. Manual DS70005439B-page 33 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 34 PIC32MK have I/O output pin slew rate control features. By attenuating the rise and fall times you can improve signal integrity and eliminate data transceiver errors. Return to Checklist Manual DS70005439B-page 34 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 35: Ground Loops
PCB logic ground is relative to AC Neutral Logic Ground = 0.013 Ω =94mv =3.5mv 2’, 18 AGW Ground Loop Current = (V3 ) / R = (0.094 – 0.0035) / 0.013 = 6.9 amps Manual DS70005439B-page 35 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 36: Spi/Sqi
There is also a difference in the maximum speed that the SPI can achieve depending on the following:: Use the dedicated SPI SCLK pin functions as opposed to the PPS remappable SCLK in PIC32MX/ CAUTION PIC32MM/PIC32MZ/ PIC32MK families for higher speeds. Manual DS70005439B-page 36 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 37 RESET#/HOLD#/SIO3 QSCK - SQICLK SCLK #CS - SQICS0 23K640 VSS - GND 64Kb SPI SRAM NOTE: #HOLD See appropriate MCU power bypassing circuit configuration SCLK illustrations in section 2.2 Manual DS70005439B-page 37 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 38 AN2587 - EMI, EMC, EFT, and ESD Circuit Design Consideration for 32-bit Microcontrollers, or on any of the 32-bit product web pages, which are available under the tab Documentation > Application Notes. Return to Checklist Manual DS70005439B-page 38 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 39: Sd Host Controller (Sdhc)
Try reducing the SD Card CLK frequency to slow down the data access rate. If this solves the problem, then there may be a PCB trace length and/or an impedance matching issue relative to the data rates that are expected. Manual DS70005439B-page 39 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 40 In addition, they should be located as close to the (Preferred) external SD card connector as possible. Manual DS70005439B-page 40 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 41: Uart
START bit is what synchronizes the sampling bit clock of the UART receiver. However, by the time the MCU can wake from sleep and re-enable the clocks, the receiver bit sampling is no longer in phase with the external transmitted Tx data. Manual DS70005439B-page 41 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 42 (see Ground Loops), while not effecting signal VIL/VIH and VOL/VOH levels. • Transient voltage suppressors on the UART signal lines entering and leaving the local system complete the protection Manual DS70005439B-page 42 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 43: Usb
Based on the enumeration, the host will either raise the power delivery to 500 mA or continue at 100 mA. If the downstream device draws more power than either the Host Manual DS70005439B-page 43 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 44 Image 3 represents a typical impedance mismatch issue either due to PCB layout, component selection that is in contact with the D+ and D- signal, or the use of a non-certified USB cable. Manual DS70005439B-page 44 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 45 Do not route USB traces under or near crystals, oscillators, clock signal generators, switching regulators, mounting holes, magnetic devices, or IC’s that use or duplicate clock signals. Note: Refer to the Complete PCB Layout Guidelines. Manual DS70005439B-page 45 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 46 AN2587 - EMI, EMC, EFT, and ESD Circuit Design Consideration for 32-bit Microcontrollers, or on any of the 32-bit product web pages under the tab Documentation > Application Notes. Return to Checklist Manual DS70005439B-page 46 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 47: Can Fd
Microcontrollers, or on any of the 32bit product web pages under Documentation Tab > Application Notes. Return to Checklist 11.7 CAN FD Problem 37: Why is the CAN sending message errors? Manual DS70005439B-page 47 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 48 The maximum CAN data rate error percentage must also consider the clock source inaccuracy + Jitter % error. Check all of the above for proper configuration for the actual data rate versus the expected data rate and % error. Manual DS70005439B-page 48 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 49 Ensure that terminated cables are not mixed with CAN terminated circuit nodes. When connecting multiple CAN devices that already have termination, non-terminated cables are required. Figure 11-13. Typical CAN Network Manual DS70005439B-page 49 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 50 ≥ TVS I spec VREN NOTE: LBUS LBUS All LIN circuit MI0805J102R-10 capacitors 5 Ω MI0805J102R-10 NOTE: 50v or 100v 1/4W MI0805J102R-10 1k ohms @ 100Mhz DC=0.15Ω, 1A Manual DS70005439B-page 50 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 51 AN2587 - EMI, EMC, EFT, and ESD Circuit Design Consideration for 32-bit Microcontrollers, or on any of the 32-bit product web pages under the tab Documentation > Application Notes. Return to Checklist Manual DS70005439B-page 51 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 52: Adc
VDDANA or sunk by GNDANA creates a ripple noise in the analog domain and additional challenges especially when trying to measure low-level signals in the double digit milli-volt range. Manual DS70005439B-page 52 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 53 = 2πfL AGND = 35ma H = PCB board Thickness = 1.57 mm = 2π10Mhz253.4nh Analog Ground PCB Trace T = 1 oz copper trace Thickness = 0.03556 mm = 15.92Ω W = PCB copper trace Width = 0.8 mm (31mils) = (3.29ma * 15.92Ω) GNDDROP L = PCB copper trace Length = 101.6 mm (4”) = 52.3mv Inductance = 15.96 nh AGND = 35ma H = PCB board Thickness = 1.57 mm = 2πfL = 2π10Mhz 15.96 nh T = 1 oz copper trace Thickness = 0.03556 mm Analog PCB Ground Plane W = PCB copper trace Width = 12.7 mm ( ½ ”) = 1 Ω = 3.29ma * 1Ω) L = PCB copper trace Length = 101.6 mm (4”) GNDDROP = 3.3mv PCB Inductance Calculator: https://spok.ca/index.php/resources/tools/106‐traceindcalc Manual DS70005439B-page 53 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 54: Vref Accuracy
– Assumption: Ground plane W = 76.2 mm , L= 101.6 mm, ADC-to-Sensor ~50.8 mm – Ground current 200-1000 mA – Therefore: 25 mv ≤ VRGND ≤ 120 mv Manual DS70005439B-page 54 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 55 Separate the analog and digital grounds and connect them only at the nearest point to the power source to CAUTION minimize the ground IR drops. Manual DS70005439B-page 55 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 56 GCLK_ADCx INTFLAG.RESRDY DAC ≤ AIN: RESULT Bit Up = 1 (Result Ready) UP / DWN n=1-8 CLOCK ADCx CTRLA.PRESCALER[n] CTRLA.SLAVEEN CLOCK ADC Host Voltage References System Return to Checklist Manual DS70005439B-page 56 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 57: I 2 S And Push Button Protection Illustration
Push Button 1k series resistors and 0.1 µF caps form an ESD RC low-pass filter and a hardware push button denouncer • ESD protection on ground, audio in, and audio out signals Return to Checklist Manual DS70005439B-page 57 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 58: I2C
SDA/SCL in nominal 3.3V MCU’s, the user must consider a level shifter as depicted in the following figure to be compatible with respect to the external I C node operating voltage levels. Important: VDD2 must be ≥ VDD1 Manual DS70005439B-page 58 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 59: Key I C Protection Design Points
3.3v Low Voltage side I 2 C Node (MCU) 5v High voltage side I 2 C node 3.3v I 2 C node side 5v I 2 C node side 0.3v 3.3v Return to Checklist Manual DS70005439B-page 59 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 60: Inlet Power Protection Illustration
DC power inlet, from the AC to DC supplies as possible. AP3211KTR-G1 10nf 4.7uh Shielded 10UF, 25V 4.5‐>12vdc MI1206L501R-10 NRS5020T4R7MMGJ 10% X7R ESR < 1 VDD = 3.3v @ 1.5A DB2L33500L1 Return to Checklist Manual DS70005439B-page 60 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 61: Ethernet
The unused cable pairs (pins 4, 5, 7, and 8 on the RJ45 connector) must be properly terminated for common mode considerations. These terminations must be routed with heavy, short traces and as close as possible to the RJ45 connector. Manual DS70005439B-page 61 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 62 Ideally, the LAN device should then be placed as close as possible to the magnetics. If this is not possible, the RJ45 connector and magnetics must remain in close proximity. The LAN device then can be located somewhat remotely from the RJ45 or magnetics area. Return to Checklist Manual DS70005439B-page 62 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 63 Differential TX and RX pairs must be constructed as 100 Ohm, controlled impedance pairs from MCU to ethernet controller, and ethernet controller to PHY. The signal distance between the components ≤ 2.5 inches. Manual DS70005439B-page 63 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 64: Comprehensive Pcb Layout Guidelines And Recommendations
Use separate digital and analog grounds when appropriate and do not connect the ground planes together except at power ground (i.e., closest to the respective input power regulator). Figure 17-2. Analog Versus Digital Ground Layout Placement Manual DS70005439B-page 64 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 65 EMC/EMI antenna parts in most designs. Locating them on the same edge of the board makes it much easier to control the common-mode voltage that may drive one connector relative to another. Manual DS70005439B-page 65 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 66 Note: In the figures the ground plane is always continuous under all the high-speed signal connections of the peripheral connector, but the connector case is isolated to the outer AC chassis plane. Manual DS70005439B-page 66 © 2022 Microchip Technology Inc. and its subsidiaries...
- Page 67 1.8 volts, then it is generally desirable to minimize the high-frequency coupling between these planes. Putting the voltage planes on the same layer will ensure that there is no overlap. It will also help to Manual DS70005439B-page 67 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 68: Pcb Bypassing
– Layer 3 power plane – Layer 4 signal Note: It is strongly recommended for all high-speed Ethernet LAN designs and minimum requirements to meet most EMC, EMI, and EFT requirements. Manual DS70005439B-page 68 © 2022 Microchip Technology Inc. and its subsidiaries... - Page 69 2-Layer PCB Top View HS Signal Signal Layer 1 GND Plane L2 PWR Plane L3 Current Loop AREA Signal L4 Current Loop AREA HS Signal 4-Layer PCB Edge View Length X Manual DS70005439B-page 69 © 2022 Microchip Technology Inc. and its subsidiaries...
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Page 70: Pcb Signal Integrity Concerns
Step 2: Once the trace impedance is calculated by entering the PCB trace information then: Method 1 of 2: (Ball Park method) PCB signal series termination resistor(s) value = {[(VDD-VOH(min)) / IOH(max)] - Trace Impedance} = {[(3.3-2.4) /10 ma] – 54.6 Ohms} Manual DS70005439B-page 70 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 71: Pcb Trace Considerations
5-10 mils in length. Trace connections must be as wide as possible to lower inductance. This will include any power ferrite beads feeding power planes, fuses feeding power planes, and so on. Return to Checklist Manual DS70005439B-page 71 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 72: Revision History
Updated throughout the document all product naming to reflect the addition of the PIC32MM product line. Added the following figures to the ADC: • Figure1 • Figure2 Revision A - September 2020 This is the initial released version of this document. Manual DS70005439B-page 72 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 73: The Microchip Website
Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Manual DS70005439B-page 73 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 74: Legal Notice
The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. -
Page 75: Quality Management System
Quality Management System For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality. Manual DS70005439B-page 75 © 2022 Microchip Technology Inc. and its subsidiaries... -
Page 76: Worldwide Sales And Service
Tel: 46-31-704-60-40 Tel: 631-435-6000 Sweden - Stockholm San Jose, CA Tel: 46-8-5090-4654 Tel: 408-735-9110 UK - Wokingham Tel: 408-436-4270 Tel: 44-118-921-5800 Canada - Toronto Fax: 44-118-921-5820 Tel: 905-695-1980 Fax: 905-695-2078 Manual DS70005439B-page 76 © 2022 Microchip Technology Inc. and its subsidiaries...
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