Texas Instruments SimpleLink CC2652RB Manual page 67

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RGZ0048A
PIN 1 INDEX AREA
1 MAX
0.05
0.00
44X 0.5
2X
5.5
PIN1 ID
(OPTIONAL)
SEE LEAD OPTION
NOTES:
1.
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2.
This drawing is subject to change without notice.
3.
The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
7.1
B
6.9
2X 5.5
5.15±0.1
13
12
1
48
SYMM
PLASTIC QUADFLAT PACK- NO LEAD
A
7.1
6.9
C
SEATING PLANE
0.08 C
24
25
SEE SIDE WALL
SYMM
36
48X 0.30
37
48X 0.5
0.3
www.ti.com
PACKAGE OUTLINE
VQFN - 1 mm max height
(0.1) TYP
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS
(0.45) TYP
CHAMFERED LEAD
CORNER LEAD OPTION
(0.2) TYP
DETAIL
0.18
0.1
C A B
0.05
C
4219044/C 09/2020

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