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Prepared (also subject responsible if other)
EAB/FJB/GM Peter Schurmann
BMR46 series PoL Regulators
BMR46 series PoL Regulators
Approved
EAB/FJB/GM [Ksenia Harrisen]
Input 4.5-14 V, Output up to 50 A / 165 W
Input 4.5-14 V, Output up to 50 A / 165 W
Soldering Information - Surface Mounting and Hole
Mounting through Pin in Paste Assembly (Laydown
version)
The product is intended for forced convection or vapor phase
reflow soldering in SnPb or Pb-free processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PWB and it is also recommended
to minimize the time in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
General reflow process specifications
Average ramp-up (T
)
PRODUCT
Typical solder melting (liquidus)
temperature
Minimum reflow time above T
L
Minimum pin temperature
Peak product temperature
Average ramp-down (T
)
PRODUCT
Maximum time 25°C to peak
Temperature
T
PRODUCT
T
minimum
PIN
T
L
Time in preheat
/ soak zone
Time 25°C to peak
Minimum Pin Temperature Recommendations
Pin number 2B is chosen as reference location for the
minimum pin temperature recommendation since this will likely
be the coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
of the solder melting temperature, (T
more than 60 seconds and a peak temperature of 220°C is
recommended to ensure a reliable solder joint.
For dry packed products only: depending on the type of solder
paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be used,
if the products are kept in a controlled environment (dry pack
handling and storage) prior to assembly.
Checked
See §1
SnPb eutectic
Pb-free
3°C/s max
3°C/s max
T
183°C
221°C
L
60 s
60 s
T
210°C
235°C
PIN
T
225°C
260°C
PRODUCT
6°C/s max
6°C/s max
6 minutes
8 minutes
maximum
Pin
profile
Product
profile
Time in
reflow
) in excess
PIN
, 183°C for Sn63Pb37) for
L
Ericsson Internal
PRODUCT SPEC.
No.
5/1301-BMR 464 0002 Uen
Date
2013-10-31
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
excess of the solder melting temperature (T
SnAgCu solder alloys) for more than 60 seconds and a peak
temperature of 245°C on all solder joints is recommended to
ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PWB near pin 10B is chosen as reference
location for the maximum (peak) allowed product temperature
(T
) since this will likely be the warmest part of the
PRODUCT
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT
Pb-free solder processes
For Pb-free solder processes, the product is qualified for MSL 3
according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT
Dry Pack Information
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case the
products have been stored in an uncontrolled environment and
no longer can be considered dry, the modules must be baked
according to J-STD-033.
Time
Thermocoupler Attachment
Pin 2B for measurement of minimum Pin (solder joint)
temperature T
PIN
Technical Specification
Technical Specification
1/28701-BMR 464 Rev.B
1/28701-BMR 464 Rev.B
July 2019
July 2019
Rev
Reference
B
Template rev. J
© Flex
© Flex
, 217 to 221°C for
L
must not exceed 225 °C at any time.
must not exceed 260 °C at any time.
Pin 10B for measurement of maximum
Product temperature T
1 (4)
74
) in
PIN
PRODUCT
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