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Product End-of-Life Disassembly Instructions
:
Storage
Product Category
Marketing Name / Model
[List multiple models if applicable.]
HPE Cray Cls 4U 106-18TB SAS Drive Encl
HPE Cray Cls 4U 106-10TB SAS Drive Encl
HPE Cray Cls 4U 106-12TB SAS Drive Encl
HPE Cray Cls 4U 106-14TB SAS Drive Encl
HPE Cray Cls 4U 106-16TB SAS Drive Encl
HPE Cray CS E1000 20TB 4U106 FIO HDD Encl
HPE Cray Cls 4U 106-24TB SAS Drive Encl
HPE Cray CS E1000 10TB 4U106 SED HDD Encl
HPE Cray CS E1000 16TB 4U106 SED HDD Encl
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HPE products to remove components and materials requiring selective treatment,
as defined by Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic
Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
MF877-00
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
With a surface greater than 10 sq cm.
1 in each of 2 I/O modules (IOMs)
1 in each of 2 power cooling modules
1 in 24-HDD baseplane in each of 4 PCBAs
1 in 10-HDD baseplane
1 in each of 4 expander riser cards
1 in each of 8 expanders
1 in each of 2 passthrough cards
1 in EBOD PCBA
1 in midplane PCBA
All types including standard alkaline and lithium
coin or button style batteries
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
Includes background illuminated displays with
gas discharge lamps
MF877-01
Quantity
of items
included
in
product
25 max
0
0
0
Page 1

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Summary of Contents for HP Cray Cls 4U 106-18TB

  • Page 1 Product Category Marketing Name / Model [List multiple models if applicable.] HPE Cray Cls 4U 106-18TB SAS Drive Encl HPE Cray Cls 4U 106-10TB SAS Drive Encl HPE Cray Cls 4U 106-12TB SAS Drive Encl HPE Cray Cls 4U 106-14TB SAS Drive Encl...
  • Page 2 Quantity of items Item Description Notes included product Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring Count varies depending on PSU model 2 or 9 greater than 2.5 cm in diameter or height External electrical cables and cords 1 power cord for each of 2 power supplies.
  • Page 3 10. Disassemble each IOM. See the IOM disassembly procedure. 11. Disassemble each rear fan. See the rear fan disassembly procedure. 12. Disassemble each controller fan. See the controller fan disassembly procedure. 13. Disassemble the chassis. See the chassis disassembly procedure. 3.2 Optional Graphic.
  • Page 4 2. Remove the three screws and the LED connector from the marked locations, and then remove the PCA from the enclosure. MF877-00 Page 4 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 5 MF877-00 Page 5 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 6 Bel Power PSU – RMN: SPASGAT-02 1. Remove the three casing screws shown by the red circles in the images below. Free the crimps marked by the yellow boxes using a protruding tool and then pull up the top cover. MF877-00 Page 6 Template Revision C, 30-July-2018...
  • Page 7 MF877-00 Page 7 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 8 2. Remove the LED connector from the connector marked in the image. MF877-00 Page 8 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 9 3. Remove the four screws from the bottom of the enclosure as marked in the image by the red circles to remove the PCA from the PSU. MF877-00 Page 9 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 10 3.2.2 IOM disassembly procedure 1. Remove the EMI Gasket from the metal base. 2. Remove the casing screws using a Philips #1 bit and pull the top cover in the direction shown by the red arrows. MF877-00 Page 10 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 11 3. Use a Philips #1 bit to remove the four screws connecting the PCBA to the metal enclosure. 4. Slide the PCBA away from the PSU in the direction shown by the red arrows. MF877-00 Page 11 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 12 5. Remove the heatsink by removing its pushpin. To remove a pushpin, compress it from the top and use pliers to pull out the other end. MF877-00 Page 12 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 13 3.2.3 Rear fan disassembly procedure 1. Remove the connector from the frame by pushing the connector as shown by the arrows in the image below. 2. Remove the six screws as shown in the image below using a Phillips #1 bit. Then pull out the metal frame as shown by the arrow.
  • Page 14 3. Remove the four screws as shown in the image below using a Phillips #1 bit. Then remove the fan latch lid as shown by the red arrow. MF877-00 Page 14 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 15 4. Remove the eight rubber isolators shown in the image below. Then gently remove the fan module from the metal housing as shown by the red arrow. MF877-00 Page 15 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 16 5. Remove the fan handle by removing the two screws attached to the sheet metal using a Phillips #2 bit. 3.2.4 Controller fan disassembly procedure 1. Remove the connector from the fan's sheet metal by sliding the connector in the direction shown by the red arrow, and then by pushing it inside in the direction shown by the green arrow.
  • Page 17 2. Remove the two screws located at the positions marked by the red circles in the image below. 3. Remove the eight screws between the outlet sheet metal and the fan unit using a Phillips #2 bit (screws not shown). MF877-00 Page 17 Template Revision C, 30-July-2018...
  • Page 18 4. Separate the fan from the metal sheets. 5. Remove the fan handle by using a Phillips #2 bit to remove the two screws marked below. MF877-00 Page 18 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 19 3.2.5 Chassis disassembly procedure 1. Remove the top cover and then remove all the disk drives and controller fans from the chassis. 2. Remove the PSUs, rear fans, and controllers from the chassis using the latches marked in the image below. MF877-00 Page 19 Template Revision C, 30-July-2018...
  • Page 20 3. Remove all eight expander cards marked by the red circles. Pull the plastic handles the direction as shown by the red arrows in the second image. 4. To remove the cable guide by hand or by using a tool, slide the metal plate in the direction shown by the red arrow.
  • Page 21 5. Remove the screws connecting the CML shelf using Philips #1 bit as shown by the red circles. 6. Remove each fan connection cable from the chassis by pushing the connector in the direction shown by the green arrow and then removing the connector from the power midplane marked by the red circle. 7.
  • Page 22 8. Remove the ribbon cable connecting the midplane to the IOM passthrough card. 9. Use a Philips #1 bit to remove the six screws marked in the image below to remove the PSU divider assembly from the base chassis. MF877-00 Page 22 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP...
  • Page 23 10. Use a Philips #1 bit to remove the three screws marked in the image below from the bottom of the chassis to remove the PSU divider. 11. Use a Philips #1 bit to remove the two screws from the top side of the divider assembly to remove the divider. 12.
  • Page 24 13. Use a Phillips #2 bit to remove the seven screws from the left edge side of the base chassis to remove the drive bay wall from the base chassis. MF877-00 Page 24 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 25 14. Use a Phillips #2 bit to remove the two screws connecting the drive bay to the front base chassis to remove the drive bay wall from the base chassis. 15. Use a Phillips #2 bit to remove the 34 screws from the drive bay connecting the drive bay PCBA marked in the image below to remove the drive bay wall from the base chassis.
  • Page 26 16. Remove the drive bay wall assembly from the base chassis by pulling it upward as shown below. 17. Rotate the slide support bar from the drive bay assembly at a 45-degree angle to the horizontal plane until the bar moves freely and then pull the bar as shown below. MF877-00 Page 26 Template Revision C, 30-July-2018...
  • Page 27 18. To disassemble the wall bay assembly, remove the screws (marked in red) connecting the metal plate using a Philips #2 and Philips #1 bits. 19. To remove the top stabilizer from the walls, slide the stabilizer as shown in the direction shown below. Repeat this step for all walls.
  • Page 28 20. Remove the top insulation sheet in the direction shown by the red arrows. 21. Remove the 12 screws (red circled) in the image from the 24-HDD baseplane using a Philips #2 bit. Then remove the eight screws (yellow circled) connecting the 24-HDD baseplane PCBA to the buss bar using a Philips #2 bit.
  • Page 29 22. Slide the 24-HDD baseplanes as marked by red arrows to remove them from the expander riser cards. 23. Remove the three screws circled red below from the base chassis using a Philips #2 bit. 24. Remove the high-speed connector cable marked with red arrows and the connector connecting the 10-HDD baseplane to the EBOD PCBA marked with green arrows.
  • Page 30 25. Remove the foam divider fitted into PEM holes. 26. Remove the high-speed cable connecting the passthrough card and 10-HDD baseplane by pulling the cable from the connector as shown by the red arrow. MF877-00 Page 30 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 31 27. Remove the passthrough front PCBA by using a Phillips #1 bit to remove the four screws circled red. 28. Remove the front passthrough card connecting connector by pulling up the PCBA as shown by the red arrow. MF877-00 Page 31 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at...
  • Page 32 29. Remove the four standoffs by hand or by using a wrench. 30. Remove the high-speed cable connector by pulling it as shown by the red arrow and remove the second passthrough card by pulling up the PCBA as shown by the green arrow. MF877-00 Page 32 Template Revision C, 30-July-2018...
  • Page 33 31. Use a Phillips #1 bit to remove the four screws on the PEMs. 32. Remove the cables from the expander riser card as shown in the image below. MF877-00 Page 33 Template Revision C, 30-July-2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877-01...
  • Page 34 33. Remove the EBOD PCBA by using a Phillips #1 bit to remove the six screws (circled red) and using a Phillips #2 bit to remove the two screws (circled yellow). 34. Remove the midplane PCBA by using a Phillips #2 bit to remove the five screws (circled red) connecting base sheet metal and the eight screws (circled yellow) connecting the buss bar.
  • Page 35 35. Remove the expander riser card from the base metal chassis by using a T10 bit to remove the six screws (circled red) from the expander riser card. Repeat this step for all the remaining expander riser cards and remove all the PCBAs from the chassis. 36.
  • Page 36 38. If the rails are mounted from inside chassis: Remove the three screws marked below from the inside chassis and slide as indicated by the green arrows to release from the T pins. If the rails are mounted externally: Remove the five screws from the marked position that holds the inner rail, then slide as indicated by the green arrows to release from the T pins.