HP BladeSystem c3000 Manual
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HP BladeSystem c3000 Manual

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HP BladeSystem c3000 Enclosure
technology brief, 2nd edition
Abstract.............................................................................................................................................. 3
Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 3
Managing the c3000 enclosure ............................................................................................................ 5
Onboard Administrator..................................................................................................................... 5
Integrated Lights-Out 2 for c-Class server blades .................................................................................. 9
Insight Display ................................................................................................................................. 9
Onboard Administrator cabling ....................................................................................................... 10
Enclosure link cabling ..................................................................................................................... 11
Enclosure-based DVD ROM................................................................................................................. 12
Enclosure KVM Module ...................................................................................................................... 12
Interconnect options and infrastructure.................................................................................................. 13
Interconnect modules ...................................................................................................................... 15
Server blades ................................................................................................................................ 16
Storage and other option blades...................................................................................................... 16
Mezzanine cards ........................................................................................................................... 17
Virtual Connect .............................................................................................................................. 18
Fabric connectivity and port mapping............................................................................................... 18
c3000 bay-to- bay crosslinks ........................................................................................................... 21
HP Thermal Logic technologies ............................................................................................................ 22
Active Cool fans ............................................................................................................................ 23
HP PARSEC architecture.................................................................................................................. 24
Thermal Logic for the server blade.................................................................................................... 26
Power supplies and enclosure power subsystem................................................................................. 27
Detecting component insertion and removal..................................................................................... 5
Identifying components ................................................................................................................. 6
Managing power and cooling ....................................................................................................... 6
Controlling components................................................................................................................. 6
User interfaces for Onboard Administrator ...................................................................................... 8
Security ....................................................................................................................................... 8
Role-based user accounts............................................................................................................... 8
Device bay crosslinks.................................................................................................................. 21
Interconnect bay crosslinks .......................................................................................................... 22
Parallel...................................................................................................................................... 24
Redundant and scalable.............................................................................................................. 25
Pooled power configuration and power redundancy options ........................................................... 29
Dynamic Power Saver mode ........................................................................................................ 30
HP Power Regulator for ProLiant ................................................................................................... 31
Power Capping for each server blade........................................................................................... 31
Power meter .............................................................................................................................. 31

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Summary of Contents for HP BladeSystem c3000

  • Page 1: Table Of Contents

    HP BladeSystem c3000 Enclosure technology brief, 2nd edition Abstract.............................. 3 Overview of HP BladeSystem c3000 Enclosure ..................3 Managing the c3000 enclosure ......................5 Onboard Administrator........................5 Detecting component insertion and removal..................5 Identifying components ......................... 6 Managing power and cooling ....................... 6 Controlling components.........................
  • Page 2 HP BladeSystem Power Sizer ....................... 31 Summary ............................32 Appendix. Fan, power supply, and device bay population guidelines............33 For more information.......................... 38 Call to action ............................ 38...

  • Page 3: Abstract

    Abstract The HP BladeSystem c3000 Enclosure is the next generation in an evolution of the entire rack- mounted infrastructure. The c3000 enclosure is designed for remote sites, small and medium-sized businesses, and data centers with special power and cooling constraints. This technology brief provides an overview of the HP BladeSystem c3000 Enclosure, Thermal Logic power and cooling technologies, and interconnect options.
  • Page 4 • Onboard Administrator (OA) management module • DVD drive • Optional KVM enclosure module for connecting the c3000 to an in-rack KVM switch or HP TFT 7600 Rack Mount Keyboard/Monitor Both c-Class enclosures have common critical components such as servers, interconnects, mezzanine cards, storage blades, power supplies, and fans.

  • Page 5: Managing The C3000 Enclosure

    In rear Managing the c3000 enclosure The HP BladeSystem c3000 Enclosure has extensive embedded management capabilities based on the Onboard Administrator, Integrated Lights-Out 2 (iLO 2) management processors integrated on the server blades, and interconnect module management processors such as the HP Virtual Connect Manager.

  • Page 6: Identifying Components

    A separate microcontroller controls power to interconnect modules. Once components are granted power, the Onboard Administrator begins thermal management with Thermal Logic. The Thermal Logic feature in the BladeSystem c3000 enclosure minimizes fan subsystem power consumption by reading temperature sensors across the entire enclosure and changing fan speed in different zones to minimize power consumption and maximize cooling efficiency.
  • Page 7 Figure 3. Management communications between Onboard Administrator and other components in an HP BladeSystem c3000 Enclosure c3000 internal management interfaces The Onboard Administrator has several hardware interfaces to each bay in the c3000 enclosure to provide management communications between the Onboard Administrator and all components in the enclosure.

  • Page 8: User Interfaces For Onboard Administrator

    Updating firmware, including server BIOS firmware, NIC and mezzanine BIOS firmware, and iLO 2 firmware, is possible using HP System Update Manager or the blade firmware update maintenance CD. These utilities can be connected to all the server blades in the enclosure using the Onboard Administrator enclosure DVD feature.

  • Page 9: Integrated Lights-Out 2 For C-Class Server Blades

    Thus, the administrator can use single sign-on to log in to a single Onboard Administrator and use the web GUI to graphically view and manage the HP BladeSystem c-Class components in up to four linked enclosures. For example, an IT administrator could automatically propagate management commands—such as changing the enclosure power mode—throughout the linked enclosures.

  • Page 10: Onboard Administrator Cabling

    The standard Onboard Administrator module is preinstalled in a front-loading tray that also houses the HP BladeSystem Insight Display. The Onboard Administrator module contains a serial connector for connection to a PC with a null-modem RS232 serial cable. A USB connector is also available for future USB connectivity.

  • Page 11: Enclosure Link Cabling

    Figure 6. HP BladeSystem c3000 Onboard Administrator link module Enclosure link cabling The Onboard Administrator link module contains two enclosure link ports to allow any active Onboard Administrator module to access linked enclosures. On a standalone enclosure or upper enclosure in a series of linked enclosures, the upper enclosure link-up port functions as a service port for temporary connection to a PC with a CAT5 patch cable.

  • Page 12: Enclosure-Based Dvd Rom

    Enclosure-based DVD ROM The HP BladeSystem c3000 Enclosure has an optional CD/DVD ROM drive that installs in the front of the enclosure. The Insight Display and Onboard Administrator allow system administrators to connect and disconnect the media device to one or multiple servers at a time. In addition, a browser-based console is available through the iLO functionality of each server blade.

  • Page 13: Interconnect Options And Infrastructure

    Figure 7. Optional c3000 KVM Module – KVM menu screen Interconnect options and infrastructure A key component of the c3000 enclosure is the I/O infrastructure—essentially, a NonStop signal midplane that provides the internal wiring between the server or storage blades and the interconnect modules.
  • Page 14 Figure 8. Diagram of the HP BladeSystem c3000 signal midplane By taking advantage of the similar four-wire differential transmit and receive mechanism, the NonStop signal midplane can support either network-semantic protocols (such as Ethernet, Fibre Channel, and InfiniBand) or memory-semantic protocols (PCIe), using the same signal traces.

  • Page 15: Interconnect Modules

    Ethernet and Fibre Channel pass-thru modules are available when direct one-to-one connections between servers and LAN or SAN are required. HP Ethernet and Fibre Channel Pass-Thru Modules provide 16-port, transparent, 1:1 port connectivity between the server and an external switch.

  • Page 16: Server Blades

    Module ports do auto-negotiate. Server blades Server blades for the BladeSystem c3000 enclosure are built according to c-Class standard form- factors referred to as half-height and full-height. The enclosure can hold either full-height or half-height server blades or a combination of the two.

  • Page 17: Mezzanine Cards

    HP offers a variety of mezzanine card options to provide connectivity to outside networks and storage. HP ProLiant c-Class server blades use two types of mezzanine cards to connect to the various interconnect fabrics such as Fibre Channel, Ethernet, serial-attached SCSI, or InfiniBand. Type I (x4) and Type II (x8) mezzanine cards differ only in the amount of power allocated to them by the server and in the physical space they occupy on the server blade.

  • Page 18: Virtual Connect

    Virtual Connect With c-Class architecture, HP introduced a new type of interconnect technology: Virtual Connect. As it is implemented in the c-Class architecture, Virtual Connect technology provides virtualized server I/O connections to the Ethernet (LAN) or Fibre Channel (SAN) networks. Virtual Connect technology virtualizes the server-edge so that networks can communicate with pools of HP BladeSystem servers rather than in a conventional one-to-one relationship.
  • Page 19 Figure 10. HP BladeSystem c3000 interconnect bay numbering For interconnect bay mapping purposes, it does not matter in which device bay a server blade is installed. The mezzanine connectors always connect to the same interconnect bays. Because the connections between the device bays and the interconnect bays are hard-wired through the NonStop signal midplane, the server mezzanine cards must be matched to the appropriate type of interconnect module.
  • Page 20 • NIC 3 — Interconnect bay 1 port 1 • NIC 4 — Interconnect bay 1 port 9 Figure 11. Port mapping for HP BladeSystem c3000 full-height server blades to interconnect bays Half-height server blades connect to a single power and signal connector on the NonStop signal midplane.

  • Page 21: C3000 Bay-To- Bay Crosslinks

    Figure 12 lists the available configurations for half-height devices installed in device bay N (1–8). Figure 12. Port mapping for HP BladeSystem c3000 half-height server blades to interconnect bays Port mapping differs slightly between full-height and half-height server blades due to the support for additional mezzanine cards on the full-height version.

  • Page 22: Interconnect Bay Crosslinks

    Figure 13. HP BladeSystem c3000 device bay crosslinks as indicated by the arrows Interconnect bay crosslinks Interconnect bay crosslinks are wired between adjacent interconnect bay pairs as indicated by the arrows in the c3000 enclosure rear view (Figure 14). The crosslink connectivity is identical in the c3000 Tower enclosure.

  • Page 23: Active Cool Fans

    HP has 20 patents pending for its Active Cool fan technology and its implementation. HP Active Cool fans can cool eight server blades using as little as 100 watts of power. Active Cool fans use ducted fan technology with a high-performance motor and impeller (Figure 15) to deliver high CFM at high pressure.

  • Page 24: Hp Parsec Architecture

    The Active Cool fans provide cooling for their own zone and redundant cooling for the rest of the enclosure. To ensure scalability, HP designed both the fans and the power supplies with enough capacity to meet the needs of compute, storage, and I/O components well into the future.

  • Page 25: Redundant And Scalable

    Figure 16. HP BladeSystem c3000 self-sealing enclosure Redundant and scalable BladeSystem c3000 enclosures ship with four installed fans that provide redundancy and support up to four half-height devices in device bays 1, 2, 5, and 6, or two full-height server blades in device bays 1 and 2.

  • Page 26: Thermal Logic For The Server Blade

    For example, in the HP BladeSystem BL460c server blade using Intel® Xeon® processors, HP was able to use a smaller, high-efficiency processor heat sink than in rack-mount servers. These heat sinks have vapor chamber bases, thinner fins, and tighter fin pitch than previous designs.

  • Page 27: Power Supplies And Enclosure Power Subsystem

    HP BladeSystem environment. Power supplies and enclosure power subsystem The HP BladeSystem c3000 Enclosure ships with two power supplies; however, up to six power supplies can be installed (Figure 19) depending on the AC redundancy level required and the number of devices installed in the enclosure.
  • Page 28 PDU (Figure 20). HP recommends using HP BladeSystem Power Sizer to determine the number of power supplies needed in the c3000 and to determine the UPS capacity requirement. See the For more information section at the end of this document for a link to the HP BladeSystem Power Sizer.

  • Page 29: Pooled Power Configuration And Power Redundancy Options

    Because this power design has no zones, it facilitates both N+N and N+1 power modes, which future-proofs the enclosure for higher power requirements, if needed. Looking forward at least five years, HP believes there is sufficient power capacity to handle future power-hungry devices.

  • Page 30: Dynamic Power Saver Mode

    Figure 21. Redundant HP BladeSystem c3000 power supplies connected to an HP R5500 UPS Connecting to PDUs with AC redundancy to each rack In an N+N AC redundancy configuration, the total power available in the power pool equals the amount from the A or B side, whichever contains fewer power supplies. In this configuration, N power supplies are used to provide power, and the same number are used to provide redundancy.

  • Page 31: Hp Power Regulator For Proliant

    BladeSystem enclosure. HP BladeSystem Power Sizer The HP BladeSystem Power Sizer is a tool that assists facilities teams and IT staff in sizing their power and cooling infrastructures to meet the needs of an HP BladeSystem solution. The BladeSystem Power Sizer is based on actual component-level power measurements of a system stressed to maximum capability.

  • Page 32: Summary

    Summary The HP BladeSystem c3000 Enclosure is the next generation of a new modular computing architecture that consolidates and simplifies infrastructure, reduces operational cost, and delivers IT services more effectively. The c3000 enclosure is designed for remote sites, small and medium-sized businesses, and data centers with special power and cooling constraints.

  • Page 33: Appendix. Fan, Power Supply, And Device Bay Population Guidelines

    Appendix. Fan, power supply, and device bay population guidelines Figure A-1. Fan population guidelines for HP BladeSystem c3000 Enclosure. For correct operation, fans and server blades must be installed in the correct fan bays. The Onboard Administrator will ensure that fans and server/storage blades are correctly placed before allowing systems to power on.
  • Page 34 Figure A-2. Power supply population guidelines for HP BladeSystem c3000 Enclosure Table A-1. Power supply placement for HP BladeSystem c3000 Enclosure Number of power supplies Power supply bays used 1 and 4 1, 2, 4, and 5 All power supply bays filled Table A-2.
  • Page 35 Figure A-3. Full-height server blade device bay numbering for HP BladeSystem c3000 Enclosure. Full--height servers should be populated from bottom to top (rack) or left to right (tower) when viewing from the front of the enclosure. With four fans, only the bottom or left two device bays can be used; with six fans, all device bays can be used.
  • Page 36 CAUTION To prevent improper cooling or thermal damage, do not operate the server blade or the enclosure unless all device bays are populated with either a component or a blank. Figure A-5. The c3000 enclosure is divided by sheet metal panels into two full-height zones. Zone 1 and Zone 2 are divided in half by a removable shelf to accommodate a maximum of eight half-height device bays per enclosure.
  • Page 37 4 and 8, and one full-height server blade in device bay 3/7. A companion blade (HP StorageWorks SB40c Storage Blade, HP PCI Expansion Blade, or HP StorageWorks Ultrium 448c Tape Blade) can be installed in either of the paired device bays (1/2, 3/4, 5/6, or 7/8) with a half-height server blade installed in the other paired device bay.

  • Page 38: For More Information

    TechCom@HP.com © 2007, 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty.

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