Mitsubishi Electric KD Series User Manual page 29

Contact image sensor for web surface inspection
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2-4 Features of scanning pixels
【 Sensor IC spectral sensitivity 】
【 Pixel alignment of Sensor ICs 】
84.67(typ.)
42.33 42.33
1
2
Capture image on this line
TM-XG537C
unit : μm
36
・・・
3
4
304
COPYRIGHT © 2020 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.
【 Sensor IC spectral sensitivity 】
This product comprises a monochrome ICs. The Sensor
ICs spectral sensitivity is described on the left.
【 Pixel alignment of Sensor ICs 】
The plural Sensor ICs are assembled in a line on a sensor
board in this product. The numbers of Sensor ICs for each
length are as follows;
309 mm size : 24 chips
617 mm size : 48 chips
926 mm size : 72 chips
Each sensor chip has 304 pixels.
At the edge of Sensor ICs, complying with a
semiconductor design rule and keeping a dicing area are
necessary.
Therefore the gap between neighboring Sensor ICs is not
600 dpi, and is designated to be 300 dpi (84μm) pitch and
controlled ± 15μm tolerance.
Due to the fact that between the sensor IC are arranged in
300dpi pitch The missing of one pixel called the missing
pixel.
Additionally, a function of Interpolation that can insert a
pixel data created by neighboring pixels data for each gap
between neighboring Sensor ICs is available on this
product.
29

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