Appendix Cconnectors For Target Connection; Use - NEC IE-703002-MC User Manual

APPENDIX C CONNECTORS FOR TARGET CONNECTION
C.1 Use
(1) When mounting the NQPACK100SD in target system
<1> Coat the tips of the four projections at the bottom of the NQPACK100SD with a two-component type epoxy
adhesive (cure time longer than 30 minutes), and bond the NQPACK100SD to the target system. If not
bonded correctly, the pad of the print board may peel off when removing the IE-703002-MC.
If the lead of the NQPACK100SD does not match the pad of the target system easily, perform step <2> to
adjust the position.
<2> Insert the guide pins provided with the NQPACK100SD into the pin holes at the upper side of the
NQPACK100SD to adjust the position (refer to Figure C-1).
There are three 1.0 mm diameter non-through holes (refer to APPENDIX A PACKAGE DRAWINGS).
<3> After setting the HQPACK100SD, solder the NQPACK100SD onto the target system. By following this
sequence, flux or solder sputtering and adhering to contact pins of the NQPACK100SD can be avoided.
Recommended soldering conditions
<4> Remove the guide pins.
Remark NQPACK100SD: Connector for target connection
HQPACK100SD: Cover for device installation
Reflow:
Partial heating: 240°C, 10 sec. max. (per pin)
Figure C-1. Mounting of NQPACK100SD
Target system
User's Manual U11595EJ5V0UM
240°C, 20 sec. max.
HQPACK100SD
Guide pins
(NQGUIDE)
NQPACK100SD
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