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APPENDIX C
C.1 Usage
(1) When mounting NQPACK144SD on target system
<1>
Coat the tip of the four projections (points) at the bottom of the NQPACK144SD with two-component type
epoxy adhesive (cure time longer than 30 min.) and bond the NQPACK144SD to the target system. If not
bonded properly, the pad of the printed circuit board may peel off when the emulator is removed from the
target system. If the lead of the NQPACK144SD is not aligned with the pad of the target system easily,
perform step <2> to adjust the position.
<2>
To adjust the position, insert the guide pins for position adjustment (NQGUIDE) provided with
NQPACK144SD into the pin holes on the upper side of NQPACK144SD (refer to Figure C-1).
The diameter of a hole is φ = 1.0 mm.
DIMENSIONS).
<3>
After setting the HQPACK144SD, solder the NQPACK144SD to the target system. By following this
sequence, adherence of flux or solder sputtering to contact pins of the NQPACK144SD can be avoided.
Recommended soldering conditions... Reflow:
<4>
Remove the guide pins.
Remark NQPACK144SD: Connector for target connection
HQPACK144SD: Cover for device installation
44
CONNECTORS FOR TARGET CONNECTION
There are three non-through holes (refer to APPENDIX A
Partial heating:
Figure C-1. Mounting NQPACK144SD
Target system
User's Manual U14700EJ2V0UM
240°C, 20 seconds max.
240°C, 10 seconds max. (per pin row)
HQPACK144SD
Guide pins
(NQGUIDE)
NQPACK144SD
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