Parallax BASIC Stamp 2e Programming Manual page 23

Figure 1.15: BASIC Stamp Super
Carrier Board (Rev. A) (shown with
BS2-IC properly inserted) (27130)
Figure 1.16: Prototype area of the
BASIC Stamp Super Carrier Board
(Rev. A) (black lines indicate
interconnected solder pads)
1: Introduction to the BASIC Stamps
Vss
Vin
Rocklin, CA - USA
In the prototype area, upper and lower rows as well as two inner columns
of solder pads are connected to Vdd and Vss to provide easy access to
power. IC's measuring from 0.3" to 0.7" in width can straddle the center
power rails similar to a breadboard. The right-most column of solder pads
is offset to accommodate components like RJ-11 and DB9 connectors.
BASIC Stamp Programming Manual 2.0c • www.parallaxinc.com • Page 21
C2
+
J1
C1 Pwr
Vin
Vss
J3
PCO
PCI
C3
Vdd
Rst
C4
P0
P1
P2
J2
P3
P4
P5
P6
P7
TM
Reset
3.25" (94mm)
4" (102mm)
4.25" (107mm)
Vss
Vdd
P15
P14
P13
P12
P11
P10
P9
P8
P7
P6
P5
P4
P3
P2
P1
P0
Vdd
Rev A
Need Tech Support?
Send email to:
stamptech@parallaxinc.com
Vss
Vss
Vdd
P15
P14
P13
P12
P11
P10
P9
P8
P7
P6
P5
P4
P3
P2
P1
P0
Vdd Vss
®
Basic Stamp Super Carrier
www.parallaxinc.com (916) 624-8333 ©1999
1.4" (36mm)
Vss
Vss