ECS NEATSX User Manual page 19

Physical Organization
The NEATsx's memory subsystem is divided into two parts
which are in turn have two sections. The sections are called banks.
There are four banks on the board, each with a capacity of two nine-
chip sets. Two of the banks are for DIP DRAM chips, and two are for
SIP modules. The banks are numbered 0, 1,2, and 3, but their desig­
nations depend on the setting of jumper JP6. The figures below show
the possible bank designations.
SIP RAM
banks
(the banks
run vertically)
Hardware Specifications
Bank 3 ( 1 )
DIP RAM
banks
BankO
Bank 1
NEATsx memory bank organization
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