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Managing Power and Feature Utilization
An NI sbRIO device that heavily utilizes all of its performance and features consumes and
dissipates substantially more power than an idle device.
Consider the following options for reducing the die junction temperature.
•
Design for additional thermal cooling that can appropriately dissipate power
•
Reduce device feature utilization
Note
Your final validation must consider software and hardware utilization that is
representative of the final deployment conditions.
Note
Refer to the Power Requirements section of the NI sbRIO-9637
Specifications on
power requirement for each input rail on the sbRIO device with worst-case silicon
manufacturing process and maximum junction temperatures. For a more accurate
estimate of the power consumption for a specific application, NI recommends that
you directly measure the power the sbRIO device consumes when running your
application in an environment that is representative of the intended use case.
Mounting Recommendations for Maximizing Thermal
Performance
Thermal performance of the NI sbRIO device can be maximized by implementing the
following recommendations.
•
Directly mount a thermal solution such as the Thermal Kit for NI sbRIO-9607/9627/9637
(153901-02) to a thermally conductive surface such as a metal enclosure wall or plate, as
shown in the
material such as thermal grease should be used to maximize the heat transfer from the
heat spreader to the enclosure or plate.
If design limitations prevent this solution, you can alternatively attach a heat sink or other
thermal solution as shown in the
section. This solution takes advantage of natural convection or forced cooling provided
by a fan.
•
Mount the NI sbRIO device vertically with respect to gravity to take advantage of natural
convection cooling.
•
Mount the NI sbRIO device below and away from other heat-dissipating components.
Note
Placing the NI sbRIO device within a system or enclosure will also influence
thermal performance.
The following figure shows good, better, and best thermal mounting solutions for the
sbRIO-9637.
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Mounting on a Panel or Plate with Conduction Path
Mounting on a Panel or Plate with Convection Path
for specifications that approximate the maximum
NI sbRIO-9637 User Manual | © National Instruments | 13
section. An interface
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