Soldering Guidelines; Equipment Connection - Texas Instruments TPS7A52EVM-031 User Manual

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2.1.12 J12
6 × 1 header, can be used as test points for LDO inputs and outputs.
2.1.13 TP1 – VIN
Input test point.
2.1.14 TP2 – VEN
Input sense test point.
2.1.15 TP3 – PG
PG test point.
2.1.16 TP4 – VOUT
Enable test point.
2.1.17 TP5 – VBIAS
Output test point.
2.1.18 TP6 – GND
Ground sense test point near input.
2.1.19 TP7 – GND
Ground sense test point near output.
2.1.20 TP8 – GND
Ground sense test point near Bias.
2.1.21 TP9 – GND
Ground sense test point.
2.2

Soldering Guidelines

To avoid damaging the integrated circuit (IC), use a hot-air system for any solder rework to modify the
EVM for the purpose of repair or other application reasons.
2.3

Equipment Connection

Use the following steps when connecting the equipment:
1. Set the input and bias power supplies to 6.5 V (maximum), and turn the power supplies off.
2. Connect the positive voltage lead from the input power supply to VIN at the J1 or J2 connector of the
EVM.
3. Connect the ground lead from the input power supply to GND at the J8 connector of the EVM.
4. Connect a 0-A to 4-A load between OUT and GND. The connector used depends on the desired
output current.
5. Disable the output by floating J3.
SBVU058 – December 2019
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TPS7A52EVM-031 Evaluation Module
EVM Setup
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