Module Is Easy To Damage; Ber(Bit Error Rate) Is High; Production Guidance; Reflow Soldering Temperature - Ebyte E70-433NW3S0 User Manual

Chengdu Ebyte Electronic Technology Co,;Ltd

11.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
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Please check the stability of power source, the voltage cannot fluctuate too much.
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Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
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Please avoid using modules under too high or too low temperature.
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11.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
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channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
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The extension line and feeder quality are poor or too long, so the bit error rate is high;
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12.Production guidance

12.1. Reflow Soldering Temperature

Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（TL）Maintained Above（TL）
Peak temperature（Tp）
Average ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
Chengdu Ebyte Electronic Technology Co,;Ltd
Copyright ©2012–2019，
Profile Feature Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
E70-433NW30S user manual
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
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