Module Is Easy To Damage; Ber(Bit Error Rate) Is High; Production Guidance; Reflow Soldering Temperature - Ebyte E28-2G4M12 Series User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.
Manual

6.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
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Please check the stability of power source, the voltage cannot fluctuate too much.
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Please make sure antistatic measure are taken when installing and using, high frequency devices have
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electrostatic susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
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Please avoid using modules under too high or too low temperature.
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6.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency
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and channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
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The extension line and feeder quality are poor or too long, so the bit error rate is high;
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Production guidance

7.

7.1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
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Curve characteristics
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid phase line
Peak temp.
Aveage ramp-down rate
Time to peak temperature
for 25℃
E28-2G4M12S User
Sn-Pb Assembly Pb-Free Assembly
Sn63/Pb37 Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec 60-120 sec
3℃/second max 3℃/second max
183℃
60-90 sec 30-90 sec
220-235℃ 230-250℃
6℃/second max 6℃/second max
max 6 minutes max 8 minutes
150℃
200℃
217℃
1-
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