Table Of Contents; Servicing Notes - Sony XM-GS100 Service Manual

XM-GS100

TABLE OF CONTENTS

1. SERVICING NOTES
2. GENERAL
..................................................................
3. DISASSEMBLY
3-1. Disassembly Flow ...........................................................
3-2. Bottom Plate Block .........................................................
3-3. MAIN Board Block ........................................................
3-4. MAIN Board ...................................................................
3-5. CONTROL Board Block ................................................
4. DIAGRAMS
4-1. Printed Wiring Board
- MAIN Board (Component Side) (Suffi x-11) - .............
4-2. Printed Wiring Board
- MAIN Board (Conductor Side) (Suffi x-11) - ............... 10
4-3. Printed Wiring Board
- MAIN Board (Component Side) (Suffi x-12) - ............. 11
4-4. Printed Wiring Board
- MAIN Board (Conductor Side) (Suffi x-12) - ............... 12
4-5. Schematic Diagram - MAIN Board (1/2) - ..................... 13
4-6. Schematic Diagram - MAIN Board (2/2) - ..................... 14
4-7. Printed Wiring Boards - CONTROL/LED Boards - ....... 15
4-8. Schematic Diagram - CONTROL/LED Boards - ........... 16
5. EXPLODED VIEWS
5-1. Heat Sink (Main) Section ............................................... 17
5-2. MAIN Board Section ...................................................... 18
5-3. CONTROL Board Section .............................................. 19
6. ELECTRICAL PARTS LIST ............................ 20
Accessories are given in the last of the electrical parts list.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
2
.............................................

SERVICING NOTES

UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
2
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
3
: LEAD FREE MARK
Unleaded solder has the following characteristics.
5
• Unleaded solder melts at a temperature about 40 °C higher
5
than ordinary solder.
6
Ordinary soldering irons can be used but the iron tip has to be
6
applied to the solder joint for a slightly longer time.
7
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
9
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CONFIRMING THE OPERATION
Please confi rm the car audio unit works even if REM output is not
connected when you connect this unit with the car audio unit by
the HIGH LEVEL input.
MAIN BOARD DISCRIMINATION
In this unit, the MAIN board has been changed in the midway of
production.
Repair after distinguishing each type unit to doing the repair refer-
ring to the following.
- MAIN Board (Component Side) -
SECTION 1
Suffix-11 : 1-885-849-11
Suffix-12 : 1-885-849-12