Cypress CYBLE-212019-00 Manual

Cypress CYBLE-212019-00 Manual

Ez-ble creator module
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EZ-BLE Creator Module
General Description
The CYBLE-212019-00 is a Bluetooth
wireless module solution. The CYBLE-212019-00 is a turnkey
solution and includes onboard crystal oscillators, trace antenna,
passive components, and the Cypress PSoC 4 BLE. Refer to the
PSoC 4 BLE
datasheet
for additional details on the capabilities
of the PSoC 4 BLE device used on this module.
The CYBLE-212019-00 supports a number of peripheral
functions
(ADC,
timers,
communication protocols (I
programmable architecture. The CYBLE-212019-00 includes a
royalty-free BLE stack compatible with Bluetooth 4.1 and
provides up to 23 GPIOs in a 14.52 × 19.20 × 2.00 mm package.
The CYBLE-212019-00 is fully certified and qualified and is an
ideal fit for cost sensitive applications. The CYBLE-212019-00 is
drop-in compatible with the CYBLE-012011-00 EZ-BLE Creator
Module.
Module Description
Module size: 14.52 mm × 19.20 mm × 2.00 mm (with shield)
Castelated solder pad connections for ease-of-use
256-KB flash memory, 32-KB SRAM memory
Up to 23 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z analog, HI-Z digital, or strong output
Bluetooth 4.1 single-mode module
QDID:
81503
Declaration ID:
D030315
Certified to FCC, ISED, MIC, KC, and CE regulations
Industrial temperature range: –40 °C to +85 °C
32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
Watchdog timer with dedicated internal low-speed oscillator
(ILO)
Two-pin SWD for programming
Power Consumption
TX output power: –18 dbm to +3 dbm
Received signal strength indicator (RSSI) with 1-dB resolution
TX current consumption of 15.6 mA (radio only, 0 dbm)
RX current consumption of 16.4 mA (radio only)
Cypress Semiconductor Corporation
Document Number: 002-09764 Rev. *I
Low Energy (BLE)
counters,
PWM)
and
serial
2
C, UART, SPI) through its
198 Champion Court
EZ-BLE Creator Module
Low power mode support
Deep Sleep: 1.3
A with watch crystal oscillator (WCO) on
Hibernate: 150 nA with SRAM retention
Stop: 60 nA with GPIO (P2.2) or XRES wakeup
Functional Capabilities
Up to 22 capacitive sensors for buttons or sliders with
best-in-class signal-to-noise ration (SNR) and liquid tolerance
12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
Two serial communication blocks (SCBs) supporting I
(master/slave), SPI (master/slave), or UART
Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
LCD drive supported on all GPIOs (common or segment)
Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
2
I
S master interface
Bluetooth Low Energy protocol stack supporting generic
access profile (GAP) Central, Peripheral, Observer, or
Broadcaster roles
Switches between Central and Peripheral roles on-the-go
Standard Bluetooth Low Energy profiles and services for
interoperability
Custom profile and service for specific use cases
Benefits
The CYBLE-212019-00 module is provided as a turnkey
solution, including all necessary hardware required to use BLE
communication standards.
Proven hardware design ready to use
Cost optimized for applications without space constraint
Reprogrammable architecture
Fully certified module eliminates the time needed for design,
development and certification processes
Bluetooth SIG qualified with QDID and Declaration ID
Flexible communication protocol support
PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
BLE application
,
San Jose
CA 95134-1709
CYBLE-212019-00
2
C
408-943-2600
Revised October 31, 2019

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Summary of Contents for Cypress CYBLE-212019-00

  • Page 1 The CYBLE-212019-00 is a turnkey Stop: 60 nA with GPIO (P2.2) or XRES wakeup ❐ solution and includes onboard crystal oscillators, trace antenna, passive components, and the Cypress PSoC 4 BLE. Refer to the Functional Capabilities PSoC 4 BLE datasheet...
  • Page 2 PSoC 4 BLE Silicon Datasheet ❐ ■ EZ-BLE™ Creator Evaluation Board Application notes: Cypress offers a number of BLE application ■ (CYBLE-212019-EVAL) and the BLE Pioneer Kit notes covering a broad range of topics, from basic to advanced (CY8CKIT-042-BLE) - KBA10896 level.
  • Page 3: Table Of Contents

    System Resources ............ 23 Products ..............39 Environmental Specifications ........29 PSoC® Solutions ............39 Environmental Compliance ........29 Cypress Developer Community ......... 39 RF Certification ............29 Technical Support ............. 39 Safety Certification ............ 29 Document Number: 002-09764 Rev. *I...
  • Page 4: Overview

    Module Dimensions and Drawing Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs...
  • Page 5 CYBLE-212019-00 Figure 1. Module Mechanical Drawing Top View (View from Top) Side View Bottom View (Seen from Bottom) Note 1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on...
  • Page 6: Pad Connection Interface

    To maximize RF performance, the host layout should follow these recommendations: 1. The ideal placement of the Cypress BLE module is in a corner of the host board with the trace antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. Refer to...
  • Page 7: Recommended Host Pcb Layout

    PCB layout pattern for the CYBLE-212019-00. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad on either side) shown in Figure 6 is the minimum recommended host pad length.
  • Page 8 CYBLE-212019-00 Table 3 provides the center location for each solder pad on the CYBLE-212019-00. All dimensions are referenced to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 6.
  • Page 9: Digital And Analog Capabilities And Connections

    Table 4 lists the solder pads on CYBLE-212019-00, the BLE device port-pin, and denotes whether the function shown is available for each solder pad. Each ✓ connection is configurable for a single option shown with a Table 4.
  • Page 10: Power Supply Connections And Recommended External Components

    Power Supply Connections and Recommended External Components Power Connections External Component Recommendation The CYBLE-212019-00 contains two power supply connections, In either connection scenario, it is recommended to place an VDD and VDDR. The VDD connection supplies power for both external ferrite bead between the supply and the module digital and analog device operation.
  • Page 11 CYBLE-212019-00 Figure 8. Recommended Host Schematic for an Independent Supply Option Two Ferrite Bead Option (Seen from Bottom) Document Number: 002-09764 Rev. *I Page 11 of 39...
  • Page 12 CYBLE-212019-00 The CYBLE-212019-00 schematic is shown in Figure Figure 9. CYBLE-212019-00 Schematic Diagram Document Number: 002-09764 Rev. *I Page 12 of 39...
  • Page 13: Critical Components List

    56-pin QFN PSoC 4 BLE Crystal 24.000 MHz, 12PF Crystal 32.768 kHz, 12.5PF Antenna Design Table 6 details trace antenna used in the CYBLE-212019-00 module. For more information, see Table Table 6. Trace Antenna Specifications Item Description Frequency Range 2400–2500 MHz Peak Gain 0.5-dBi typical...
  • Page 14: Electrical Specification

    Table 9 through Table 48 list the module level electrical characteristics for the CYBLE-212019-00. All specifications are valid for –40 °C  T  85 °C and T  100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted.
  • Page 15 CYBLE-212019-00 Table 9. CYBLE-212019-00 DC Specifications (continued) Parameter Description Units Details/Conditions Execute from flash; CPU at 12 MHz – – – T = –40 °C to 85 °C T = 25 °C, Execute from flash; CPU at 24 MHz –...
  • Page 16: Gpio

    CYBLE-212019-00 Table 10. AC Specifications Parameter Description Units Details/Conditions 1.71 V V 5.5 V CPU frequency – Wakeup from Sleep mode – – Guaranteed by characterization SLEEP  24-MHz IMO. Guaranteed by Wakeup from Deep-Sleep mode – – DEEPSLEEP characterization Wakeup from Hibernate mode –...
  • Page 17: Xres

    CYBLE-212019-00 Table 12. GPIO AC Specifications Parameter Description Units Details/Conditions Rise time in Fast-Strong mode – 3.3-V V = 25 pF RISEF LOAD Fall time in Fast-Strong mode – 3.3-V V = 25 pF FALLF LOAD Rise time in Slow-Strong mode –...
  • Page 18 CYBLE-212019-00 Temperature Sensor Table 17. Temperature Sensor Specifications Parameter Description Units Details/Conditions Temperature-sensor accuracy –5 ±1 °C –40 °C to +85 °C SENSACC SAR ADC Table 18. SAR ADC DC Specifications Parameter Description Units Details/Conditions A_RES Resolution – – bits –...
  • Page 19 CYBLE-212019-00 Table 19. SAR ADC AC Specifications (continued) Parameter Description Units Details/Conditions Differential nonlinearity. V = 1.71 V to A_DNL –1 – = 1 V to V 5.5 V, 500 ksps A_THD Total harmonic distortion – – –65 = 10 kHz...
  • Page 20: Digital Peripherals

    CYBLE-212019-00 Digital Peripherals Timer Table 20. Timer DC Specifications Parameter Description Units Details/Conditions Block current consumption at 3 MHz – – 16-bit timer TIM1  Block current consumption at 12 MHz – – 16-bit timer TIM2 Block current consumption at 48 MHz –...
  • Page 21 CYBLE-212019-00 Pulse Width Modulation (PWM) Table 24. PWM DC Specifications Parameter Description Units Details/Conditions Block current consumption at 3 MHz – – PWM1  Block current consumption at 12 MHz – – 16-bit PWM PWM2 Block current consumption at 48 MHz –...
  • Page 22: Serial Communication

    CYBLE-212019-00 Serial Communication Table 28. Fixed I C DC Specifications Parameter Description Units Details/Conditions Block current consumption at 100 kHz – – – I2C1 Block current consumption at 400 kHz – – – I2C2  Block current consumption at 1 Mbps –...
  • Page 23: Memory

    CYBLE-212019-00 Memory Table 36. Flash DC Specifications Parameter Description Units Details/Conditions Erase and program voltage 1.71 – – Number of Wait states at 32–48 MHz – – WS48 Number of Wait states at 16–32 MHz – – CPU execution from flash WS32 Number of Wait states for 0–16 MHz...
  • Page 24 CYBLE-212019-00 Voltage Monitors (LVD) Table 42. Voltage Monitor DC Specifications Parameter Description Units Details/Conditions LVI_A/D_SEL[3:0] = 0000b 1.71 1.75 1.79 – LVI1 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 – LVI2 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 – LVI3 LVI_A/D_SEL[3:0] = 0011b 1.95...
  • Page 25 CYBLE-212019-00 Internal Main Oscillator Table 45. IMO DC Specifications Parameter Description Units Details/Conditions IMO operating current at 48 MHz – – 1000 – IMO1 IMO operating current at 24 MHz – – – IMO2  IMO operating current at 12 MHz –...
  • Page 26 CYBLE-212019-00 Table 50. BLE Subsystem (continued) Parameter Description Units Details/Conditions Adjacent channel interference RF-PHY Specification Wanted signal at –67 dBm and Interferer – (RCV-LE/CA/03/C) at FRX ±1 MHz Adjacent channel interference RF-PHY Specification Wanted signal at –67 dBm and Interferer –...
  • Page 27 CYBLE-212019-00 Table 50. BLE Subsystem (continued) Parameter Description Units Details/Conditions RF-PHY Specification Eye opening = F2AVG/F1AVG – – (TRM-LE/CA/05/C) RF-PHY Specification FTX, ACC Frequency accuracy –150 – (TRM-LE/CA/06/C) RF-PHY Specification FTX, MAXDR Maximum frequency drift –50 – (TRM-LE/CA/06/C) RF-PHY Specification...
  • Page 28 CYBLE-212019-00 Table 50. BLE Subsystem (continued) Parameter Description Units Details/Conditions IDLE2TX BLE.IDLE to BLE. TX transition time – –  IDLE2RX BLE.IDLE to BLE. RX transition time – – RSSI Specifications RSSI, ACC RSSI accuracy – ±5 – – RSSI, RES RSSI resolution –...
  • Page 29: Environmental Specifications

    Environmental Specifications Environmental Compliance This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBLE-212019-00 module will be certified under the following RF certification standards at production release.
  • Page 30: Regulatory Information

    FCC NOTICE: The device CYBLE-212019-00 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
  • Page 31: Ised

    The Original Equipment Manufacturer (OEM) must ensure that ISED labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the ISED Notice above. The IC identifier is 7922A-2011. In any case, the end product must be labeled in its exterior with “Contains IC: 7922A-2011”...
  • Page 32: Mic Japan

    CYBLE-212019-00 MIC Japan CYBLE-212019-00 is certified as a module with type certification number 203-JN0509. End products that integrate CYBLE-212019-00 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module.
  • Page 33: Packaging

    CYBLE-212019-00. Figure 10. CYBLE-212019-00 Tape Dimensions Figure 11 details the orientation of the CYBLE-212019-00 in the tape as well as the direction for unreeling. Figure 11. Component Orientation in Tape and Unreeling Direction Document Number: 002-09764 Rev. *I...
  • Page 34 Figure 12 details reel dimensions used for the CYBLE-212019-00. Figure 12. Reel Dimensions The CYBLE-212019-00 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-212019-00 is detailed in Figure Figure 13. CYBLE-212019-00 Center of Mass (Seen from Top) Document Number: 002-09764 Rev.
  • Page 35: Ordering Information

    Order Increment (OI) – – The CYBLE-212019-00 is offered in tape and reel packaging. The CYBLE-212019-00 ships with a maximum of 500 units/reel. Part Numbering Convention The part numbers are of the form CYBLE-FATT##-SB where the fields are defined as follows.
  • Page 36: Acronyms

    CYBLE-212019-00 Acronyms Document Conventions Table 56. Acronyms Used in this Document Units of Measure Acronym Description Table 57. Units of Measure Bluetooth Low Energy Symbol Unit of Measure Bluetooth °C degree Celsius Bluetooth Special Interest Group kilovolt European Conformity milliamperes...
  • Page 37: Document History Page

    Table 4 to add additional information with respect to the functional capabilities for each solder pad. 5137880 04/20/2016 Updated Document Title to read as “CYBLE-212019-00, EZ-BLE™ Creator Module”. Updated to new template. 5418947 08/30/2016 Changed status from Preliminary to Final.
  • Page 38 CYBLE-212019-00 Document History Page (continued) Document Title: CYBLE-212019-00 EZ-BLE Creator Module Document Number: 002-09764 Submission Revision Description of Change Date 5996958 03/08/2018 Updated Document Title. Updated “PRoC™” references to “Creator”. Updated “PRoC BLE” references to “PSoC 4 BLE”. Updated Module...
  • Page 39: Sales, Solutions, And Legal Information

    “Critical Component” means any component of a High-Risk Device whose failure to perform can be reasonably expected to cause, directly or indirectly, the failure of the High-Risk Device, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from any use of a Cypress product as a Critical Component in a High-Risk Device.

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