Cypress EZ-BLE CYBLE-222014-01 Manual
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Cypress EZ-BLE CYBLE-222014-01 Manual

Creator module
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Please note that Cypress is an Infineon Technologies Company.
The document following this cover page is marked as "Cypress" document as this is the
company that originally developed the product. Please note that Infineon will continue
to offer the product to new and existing customers as part of the Infineon product
portfolio.
Continuity of document content
The fact that Infineon offers the following product as part of the Infineon product
portfolio does not lead to any changes to this document. Future revisions will occur
when appropriate, and any changes will be set out on the document history page.
Continuity of ordering part numbers
Infineon continues to support existing part numbers. Please continue to use the
ordering part numbers listed in the datasheet for ordering.
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Summary of Contents for Cypress EZ-BLE CYBLE-222014-01

  • Page 1 Please note that Cypress is an Infineon Technologies Company. The document following this cover page is marked as “Cypress” document as this is the company that originally developed the product. Please note that Infineon will continue to offer the product to new and existing customers as part of the Infineon product portfolio.
  • Page 2 The CYBLE-222014-01 is a turnkey solution and includes onboard crystal oscillators, chip antenna, passive Functional Capabilities components, and Cypress PSoC 4 Bluetooth LE. Refer to the Up to 15 capacitive sensors for buttons or sliders with ■ PSoC 4 Bluetooth LE...
  • Page 3 - Pin Mapping Differences Between the PSoC 4 BLE Silicon Datasheet ❐ ■ EZ-BLE™ Creator Evaluation Board (CYBLE-222014-EVAL) Application notes: Cypress offers a number of Bluetooth LE ■ and the BLE Pioneer Kit (CY8CKIT-042-BLE) application notes covering a broad range of topics, from basic KBA97095 - EZ-BLE™...
  • Page 4 CYBLE-222014-01 Two Easy-To-Use Design Environments to Get You Started Quickly ® PSoC Creator™ Integrated Design Environment (IDE) PSoC Creator is an Integrated Design Environment (IDE) that enables concurrent hardware and firmware editing, compiling and debugging of PSoC 3, PSoC 4, PSoC 5LP, PSoC 4 Bluetooth LE and EZ-BLE module systems with no code size limitations. PSoC peripherals are designed using schematic capture and simple graphical user interface (GUI) with over 120 pre-verified, production-ready PSoC Components™.

  • Page 5: Table Of Contents

    System Resources ............ 23 Products ..............39 Environmental Specifications ........29 PSoC® Solutions ............39 Environmental Compliance ........29 Cypress Developer Community ......... 39 RF Certification ............29 Technical Support ............. 39 Safety Certification ............ 29 Document Number: 002-11186 Rev. *I...

  • Page 6: Overview

    Module Dimensions and Drawing Cypress reserves the right to select components (including the appropriate Bluetooth LE device) from various vendors to achieve the Bluetooth LE module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained.
  • Page 7 CYBLE-222014-01 Figure 1. Module Mechanical Drawing Top View (View from Top) Side View Bottom View (Seen from Bottom) Note 1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended Host PCB Layout”...

  • Page 8: Pad Connection Interface

    To maximize RF performance, the host layout should follow these recommendations: 1. The ideal placement of the Cypress Bluetooth LE module is in a corner of the host board with the chip antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. Refer to...

  • Page 9: Recommended Host Pcb Layout

    CYBLE-222014-01 Recommended Host PCB Layout Figure Figure Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBLE-222014-01. Dimensions are in millimeters unless otherwise noted. Pad length of 0.91 mm (0.455 mm from center of the pad on either side) shown in Figure 6 is the minimum recommended host pad length.
  • Page 10 CYBLE-222014-01 Table 3 provides the center location for each solder pad on the CYBLE-222014-01. All dimensions are referenced to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 6.

  • Page 11: Digital And Analog Capabilities And Connections

    8. When using the capacitive sensing functionality, Pad 21 (P4.0) must be connected to a C capacitor (located off of Cypress Bluetooth LE Module). The value of this capacitor is 2.2 nF and should be placed as close to the module as possible.

  • Page 12: Power Supply Connections And Recommended External Components

    CYBLE-222014-01 Power Supply Connections and Recommended External Components Power Connections External Component Recommendation The CYBLE-222014-01 contains two power supply connections, In either connection scenario, it is recommended to place an VDD and VDDR. The VDD connection supplies power for both external ferrite bead between the supply and the module digital and analog device operation.
  • Page 13 CYBLE-222014-01 The CYBLE-222014-01 schematic is shown in Figure Figure 9. CYBLE-222014-01 Schematic Diagram Document Number: 002-11186 Rev. *I Page 12 of 39...

  • Page 14: Critical Components List

    Antenna Design Table 6 details the chip antenna used in the CYBLE-222014-01 module. The specifications listed are according to the vendor’s datasheet. The Cypress module performance improves many of these characteristics. For more information, see Table Table 6. Chip Antenna Specifications...

  • Page 15: Electrical Specification

    CYBLE-222014-01 Electrical Specification Table 7 details the absolute maximum electrical characteristics for the Cypress Bluetooth LE module. Table 7. CYBLE-222014-01 Absolute Maximum Ratings Parameter Description Units Details/Conditions Analog, digital, or radio supply relative to V –0.5 – Absolute maximum DDD_ABS Direct digital core voltage input relative to V –0.5...
  • Page 16 CYBLE-222014-01 Table 9. CYBLE-222014-01 DC Specifications (continued) Parameter Description Units Details/Conditions Execute from flash; CPU at 12 MHz – – – T = –40 °C to 85 °C T = 25 °C, Execute from flash; CPU at 24 MHz – –...

  • Page 17: Gpio

    CYBLE-222014-01 Table 10. AC Specifications Parameter Description Units Details/Conditions 1.71 V V 5.5 V CPU frequency – Wakeup from Sleep mode – – µs Guaranteed by characterization SLEEP 24-MHz IMO. Guaranteed by Wakeup from Deep-Sleep mode – – µs DEEPSLEEP characterization Wakeup from Hibernate mode –...
  • Page 18 CYBLE-222014-01 Table 12. GPIO AC Specifications Parameter Description Units Details/Conditions Rise time in Fast-Strong mode – 3.3-V V = 25 pF RISEF LOAD Fall time in Fast-Strong mode – 3.3-V V = 25 pF FALLF LOAD Rise time in Slow-Strong mode –...

  • Page 19: Xres

    CYBLE-222014-01 XRES Table 15. XRES DC Specifications Parameter Description Units Details/Conditions Input voltage HIGH threshold 0.7 × V – – CMOS input Input voltage LOW threshold – – 0.3 × V CMOS input Pull-up resistor k – PULLUP Input capacitance –...
  • Page 20 CYBLE-222014-01 Table 19. SAR ADC AC Specifications Details/ Parameter Description Units Conditions A_PSRR Power-supply rejection ratio – – Measured at 1-V reference A_CMRR Common-mode rejection ratio – – A_SAMP Sample rate – – Msps 806 Ksps for More Part Numbers devices Fsarintref SAR operating speed without external ref.

  • Page 21: Digital Peripherals

    CYBLE-222014-01 Digital Peripherals Timer Table 20. Timer DC Specifications Parameter Description Units Details/Conditions Block current consumption at 3 MHz – – µA 16-bit timer TIM1 Block current consumption at 12 MHz – – µA 16-bit timer TIM2 Block current consumption at 48 MHz –...
  • Page 22 CYBLE-222014-01 Pulse Width Modulation (PWM) Table 24. PWM DC Specifications Parameter Description Units Details/Conditions Block current consumption at 3 MHz – – µA 16-bit PWM PWM1 Block current consumption at 12 MHz – – µA 16-bit PWM PWM2 Block current consumption at 48 MHz –...

  • Page 23: Serial Communication

    CYBLE-222014-01 Serial Communication Table 28. Fixed I C DC Specifications Parameter Description Units Details/Conditions Block current consumption at 100 kHz – – µA – I2C1 Block current consumption at 400 kHz – – µA – I2C2 Block current consumption at 1 Mbps –...

  • Page 24: Memory

    CYBLE-222014-01 Memory Table 36. Flash DC Specifications Parameter Description Units Details/Conditions Erase and program voltage 1.71 – – Number of Wait states at 32–48 MHz – – CPU execution from flash WS48 Number of Wait states at 16–32 MHz – –...
  • Page 25 CYBLE-222014-01 Voltage Monitors (LVD) Table 42. Voltage Monitor DC Specifications Parameter Description Units Details/Conditions LVI_A/D_SEL[3:0] = 0000b 1.71 1.75 1.79 – LVI1 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 – LVI2 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 – LVI3 LVI_A/D_SEL[3:0] = 0011b 1.95 2.00 2.05...
  • Page 26 CYBLE-222014-01 Internal Main Oscillator Table 45. IMO DC Specifications Parameter Description Units Details/Conditions IMO operating current at 48 MHz – – 1000 µA – IMO1 IMO operating current at 24 MHz – – µA – IMO2 IMO operating current at 12 MHz –...
  • Page 27 CYBLE-222014-01 Table 50. Bluetooth LE Subsystem (continued) Details/ Parameter Description Units Conditions Adjacent channel interference – RF-PHY Specification Wanted signal at –67 dBm and Interferer (RCV-LE/CA/03/C) at FRX ±1 MHz Adjacent channel interference – –29 – RF-PHY Specification Wanted signal at –67 dBm and Interferer (RCV-LE/CA/03/C) at FRX ±2 MHz Adjacent channel interference...
  • Page 28 CYBLE-222014-01 Table 50. Bluetooth LE Subsystem (continued) Details/ Parameter Description Units Conditions F1AVG Average frequency deviation for RF-PHY Specification 11110000 pattern (TRM-LE/CA/05/C) Eye opening = F2AVG/F1AVG – – RF-PHY Specification (TRM-LE/CA/05/C) FTX, ACC Frequency accuracy –150 – RF-PHY Specification (TRM-LE/CA/06/C) FTX, MAXDR Maximum frequency drift –50...
  • Page 29 CYBLE-222014-01 Table 50. Bluetooth LE Subsystem (continued) Details/ Parameter Description Units Conditions On-air data rate – 1000 – kbps IDLE2TX Bluetooth LE.IDLE to Bluetooth LE. TX – µs transition time IDLE2RX Bluetooth LE.IDLE to Bluetooth LE. RX – µs transition time RSSI Specifications RSSI, ACC RSSI accuracy...

  • Page 30: Environmental Specifications

    Environmental Specifications Environmental Compliance This Cypress Bluetooth LE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant.

  • Page 31: Regulatory Information

    The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP2005.

  • Page 32: Ised

    The Original Equipment Manufacturer (OEM) must ensure that ISED labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the ISED Notice above. The IC identifier is 7922A-2005. In any case, the end product must be labeled in its exterior with "Contains IC: 7922A-2005"...

  • Page 33: Mic Japan

    CYBLE-222014-01 MIC Japan CYBLE-222014-01 is certified as a module with type certification number 203-JN0495. End products that integrate CYBLE-222014-01 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. KC Korea CYBLE-222014-01 is certified for use in Korea with certificate number MSIP-CRM-Cyp-2005.

  • Page 34: Packaging

    CYBLE-222014-01 Packaging Table 52. Solder Reflow Peak Temperature Maximum Time at Peak Module Part Number Package Maximum Peak Temperature No. of Cycles Temperature CYBLE-222014-01 22-pad SMT 260 °C 30 seconds Table 53. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package CYBLE-222014-01 22-pad SMT...
  • Page 35 CYBLE-222014-01 Figure 12 details reel dimensions used for the CYBLE-222014-01. Figure 12. Reel Dimensions The CYBLE-222014-01 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-222014-01 is detailed in Figure Figure 13. CYBLE-222014-01 Center of Mass Document Number: 002-11186 Rev.

  • Page 36: Ordering Information

    BLE = BLE Product Family Company ID: CY = Cypress For additional information and a complete list of Cypress Semiconductor Bluetooth LE products, contact your local Cypress sales representative. To locate the nearest Cypress office, visit our website. U.S. Cypress Headquarters Address 198 Champion Court, San Jose, CA 95134 U.S.

  • Page 37: Acronyms

    CYBLE-222014-01 Acronyms Acronym Description Bluetooth Low Energy Bluetooth SIG Bluetooth Special Interest Group European Conformity Canadian Standards Association direct memory access electromagnetic interference electrostatic discharge Federal Communications Commission GPIO general-purpose input/output Industry Canada integrated design environment Korea Certification Ministry of Internal Affairs and Communications (Japan) printed circuit board receive QDID...

  • Page 38: Document History Page

    Table 18 to add Note 10 to specify under what conditions the maximum number of ADC channels can be achieved. Completing Sunset Review. 5709580 04/24/2017 Updated the Cypress Logo and Copyright. 6006702 12/27/2017 Updated reel dimensions in Figure 10 Figure Completing Sunset Review.
  • Page 39 CYBLE-222014-01 Document History Page (continued) Document Title: CYBLE-222014-01, EZ-BLE™ Creator Module Document Number: 002-11186 Submission Revision Description of Change Date 7135290 05/07/2021 Updated General Description: Updated description. Updated Module Description: Updated description. Updated hyperlinks. Updated Two Easy-To-Use Design Environments to Get You Started Quickly: Updated PSoC®...

  • Page 40: Sales, Solutions, And Legal Information

    ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products.

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