Cypress EZ-BLE CYBLE-222005-00 Manual

Cypress EZ-BLE CYBLE-222005-00 Manual

Creator module

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EZ-BLE™ PRoC™ Module
General Description
The Cypress CYBLE-222005-00 is a fully certified and qualified
module supporting Bluetooth
communication. The CYBLE-222005-00 is a turnkey solution
and includes onboard crystal oscillators, chip antenna, passive
components, and Cypress PSoC 4 BLE. Refer to the PSoC 4
BLE
datasheet
for additional details on the capabilities of the
PSoC 4 BLE device used on this module.
The CYBLE-222005-00 supports a number of peripheral
functions
(ADC,
timers,
communication protocols (I
programmable architecture. The CYBLE-222005-00 includes a
royalty-free BLE stack compatible with Bluetooth 4.1 and
provides up to 16 GPIOs in a small 10 × 10 × 1.80 mm package.
The CYBLE-222005-00 is a complete solution and an ideal fit for
applications requiring BLE wireless connectivity.
Module Description
Module size: 10.0 mm ×10.0 mm × 1.80 mm (with shield)
Drop-in compatible with
additional V
input
REF
256-KB flash memory, 32-KB SRAM memory
Up to 16 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z analog, HI-Z digial, or strong output
Bluetooth 4.1 qualified single-mode module
QDID:
79920
Declaration ID:
D029884
Certified to FCC, ISED, MIC, KC, and CE regulations
FCC ID: WAP2005
IC ID: 7922A-2005
MIC ID: 203-JN0495
KC ID: MSIP-CRM-Cyp-2005
Industrial temperature range: –40 °C to +85 °C
32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
Watchdog timer with dedicated internal low-speed oscillator
(ILO)
Two-pin SWD for programming
Power Consumption
TX output power: –18 dbm to +3 dbm
Received signal strength indicator (RSSI) with 1-dB resolution
TX current consumption of 15.6 mA (radio only, 0 dbm)
RX current consumption of 16.4 mA (radio only)
Cypress Semiconductor Corporation
Document Number: 002-00214 Rev. *H
Low Energy (BLE) wireless
counters,
PWM)
and
2
C, UART, SPI) through its
CYBLE-022001-00
and includes
198 Champion Court
EZ-BLE™ Creator Module
Low power mode support
Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on
Hibernate: 150 nA with SRAM retention
Stop: 60 nA with XRES wakeup
Functional Capabilities
Up to 15 capacitive sensors for buttons or sliders with
best-in-class signal-to-noise ration (SNR) and liquid tolerance
12-bit,
1-Msps
sample-and-hold (S/H), and channel sequencer
serial
Two serial communication blocks (SCBs) supporting I
(master/slave), SPI (master/slave), or UART
Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
2
I
S master interface
Bluetooth Low Energy protocol stack supporting generic
access profile (GAP) Central, Peripheral, Observer, or
Broadcaster roles
Switches between Central and Peripheral roles on-the-go
Standard Bluetooth Low Energy profiles and services for
interoperability
Custom profile and service for specific use cases
Benefits
The CYBLE-222005-00 module is provided as a turnkey
solution, including all necessary hardware required to use BLE
communication standards.
Proven, qualified, and certified hardware design ready to use
Small footprint (10 × 10 mm × 1.80 mm), perfect for space
constrained applications
Reprogrammable architecture
Fully certified module eliminates the time needed for design,
development and certification processes
Bluetooth SIG qualified with QDID and Declaration ID
Flexible communication protocol support
PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
BLE application
San Jose
CYBLE-222005-00
SAR ADC
with
internal
,
CA 95134-1709
408-943-2600
Revised March 12, 2018
reference,
2
C

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Summary of Contents for Cypress EZ-BLE CYBLE-222005-00

  • Page 1 The CYBLE-222005-00 is a turnkey solution and includes onboard crystal oscillators, chip antenna, passive Functional Capabilities components, and Cypress PSoC 4 BLE. Refer to the PSoC 4 Up to 15 capacitive sensors for buttons or sliders with ■ datasheet...
  • Page 2 - Pin Mapping Differences Between the PSoC 4 BLE Silicon Datasheet ❐ ■ EZ-BLE™ Creator Evaluation Board Application notes: Cypress offers a number of BLE application ■ (CYBLE-222005-EVAL) and the BLE Pioneer Kit notes covering a broad range of topics, from basic to advanced (CY8CKIT-042-BLE) level.
  • Page 3: Table Of Contents

    Serial Communication ..........21 Products ..............38 Memory ..............22 PSoC® Solutions ............38 System Resources ............ 22 Cypress Developer Community ......... 38 Environmental Specifications ........28 Technical Support ............. 38 Environmental Compliance ........28 RF Certification............28 Safety Certification ............ 28 Environmental Conditions .........
  • Page 4: Overview

    Module Dimensions and Drawing Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs...
  • Page 5 CYBLE-222005-00 Figure 1. Module Mechanical Drawing Top View (View from Top) Side View Bottom View (Seen from Bottom) Note 1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended Host PCB Layout”...
  • Page 6: Pad Connection Interface

    To maximize RF performance, the host layout should follow these recommendations: 1. The ideal placement of the Cypress BLE module is in a corner of the host board with the chip antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. Refer to...
  • Page 7: Recommended Host Pcb Layout

    CYBLE-222005-00 Recommended Host PCB Layout Figure Figure Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBLE-222005-00. Dimensions are in millimeters unless otherwise noted. Pad length of 0.91 mm (0.455 mm from center of the pad on either side) shown in Figure 6 is the minimum recommended host pad length.
  • Page 8 CYBLE-222005-00 Table 3 provides the center location for each solder pad on the CYBLE-222005-00. All dimensions are referenced to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 6.
  • Page 9: Digital And Analog Capabilities And Connections

    7. When using the capacitive sensing functionality, Pad 22 (P4.0) must be connected to a C capacitor (located off of Cypress BLE Module). The value of this capacitor is 2.2 nF and should be placed as close to the module as possible.
  • Page 10: Power Supply Connections And Recommended External Components

    CYBLE-222005-00 Power Supply Connections and Recommended External Components Power Connections External Component Recommendation The CYBLE-222005-00 contains two power supply connections, In either connection scenario, it is recommended to place an VDD and VDDR. The VDD connection supplies power for both external ferrite bead between the supply and the module digital and analog device operation.
  • Page 11 CYBLE-222005-00 The CYBLE-222005-00 schematic is shown in Figure Figure 9. CYBLE-222005-00 Schematic Diagram Document Number: 002-00214 Rev. *H Page 11 of 38...
  • Page 12: Critical Components List

    Antenna Design Table 6 details the chip antenna used in the CYBLE-222005-00 module. The specifications listed are according to the vendor’s datasheet. The Cypress module performance improves many of these characteristics. For more information, see Table Table 6. Chip Antenna Specifications...
  • Page 13: Electrical Specification

    CYBLE-222005-00 Electrical Specification Table 7 details the absolute maximum electrical characteristics for the Cypress BLE module. Table 7. CYBLE-222005-00 Absolute Maximum Ratings Parameter Description Units Details/Conditions Analog, digital, or radio supply relative to V –0.5 – Absolute maximum DDD_ABS Direct digital core voltage input relative to V –0.5...
  • Page 14 CYBLE-222005-00 Table 9. CYBLE-222005-00 DC Specifications (continued) Parameter Description Units Details/Conditions Execute from flash; CPU at 12 MHz – – – T = –40 °C to 85 °C T = 25 °C, Execute from flash; CPU at 24 MHz – –...
  • Page 15: Gpio

    CYBLE-222005-00 Table 10. AC Specifications Parameter Description Units Details/Conditions 1.71 V V 5.5 V CPU frequency – Wakeup from Sleep mode – – µs Guaranteed by characterization SLEEP 24-MHz IMO. Guaranteed by Wakeup from Deep-Sleep mode – – µs DEEPSLEEP characterization Wakeup from Hibernate mode –...
  • Page 16 CYBLE-222005-00 Table 12. GPIO AC Specifications Parameter Description Units Details/Conditions Rise time in Fast-Strong mode – 3.3-V V = 25 pF RISEF LOAD Fall time in Fast-Strong mode – 3.3-V V = 25 pF FALLF LOAD Rise time in Slow-Strong mode –...
  • Page 17: Xres

    CYBLE-222005-00 XRES Table 15. XRES DC Specifications Parameter Description Units Details/Conditions Input voltage HIGH threshold 0.7 × V – – CMOS input Input voltage LOW threshold – – 0.3 × V CMOS input Pull-up resistor k – PULLUP Input capacitance –...
  • Page 18 CYBLE-222005-00 Table 18. SAR ADC AC Specifications (continued) Details/ Parameter Description Units Conditions A_SNR Signal-to-noise ratio (SNR) – – = 10 kHz A_BW Input bandwidth without aliasing – – A_SAMP/2 A_INL Integral nonlinearity. V = 1.71 V to 5.5 V, –1.7 –...
  • Page 19: Digital Peripherals

    CYBLE-222005-00 Digital Peripherals Timer Table 19. Timer DC Specifications Parameter Description Units Details/Conditions Block current consumption at 3 MHz – – µA 16-bit timer TIM1 Block current consumption at 12 MHz – – µA 16-bit timer TIM2 Block current consumption at 48 MHz –...
  • Page 20 CYBLE-222005-00 Table 24. PWM AC Specifications Parameter Description Units Details/Conditions Operating frequency – PWMFREQ Pulse width (internal) 2 × T – – PWMPWINT Pulse width (external) 2 × T – – PWMEXT Kill pulse width (internal) 2 × T – –...
  • Page 21: Serial Communication

    CYBLE-222005-00 Serial Communication Table 27. Fixed I C DC Specifications Parameter Description Units Details/Conditions Block current consumption at 100 kHz – – µA – I2C1 Block current consumption at 400 kHz – – µA – I2C2 Block current consumption at 1 Mbps –...
  • Page 22: Memory

    CYBLE-222005-00 Memory Table 35. Flash DC Specifications Parameter Description Units Details/Conditions Erase and program voltage 1.71 – – Number of Wait states at 32–48 MHz – – CPU execution from flash WS48 Number of Wait states at 16–32 MHz – –...
  • Page 23 CYBLE-222005-00 Voltage Monitors (LVD) Table 41. Voltage Monitor DC Specifications Parameter Description Units Details/Conditions LVI_A/D_SEL[3:0] = 0000b 1.71 1.75 1.79 – LVI1 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 – LVI2 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 – LVI3 LVI_A/D_SEL[3:0] = 0011b 1.95 2.00 2.05...
  • Page 24 CYBLE-222005-00 Internal Main Oscillator Table 44. IMO DC Specifications Parameter Description Units Details/Conditions IMO operating current at 48 MHz – – 1000 µA – IMO1 IMO operating current at 24 MHz – – µA – IMO2 IMO operating current at 12 MHz –...
  • Page 25 CYBLE-222005-00 Table 49. BLE Subsystem (continued) Details/ Parameter Description Units Conditions Adjacent channel interference – RF-PHY Specification Wanted signal at –67 dBm and Interferer (RCV-LE/CA/03/C) at FRX ±1 MHz Adjacent channel interference – –29 – RF-PHY Specification Wanted signal at –67 dBm and Interferer (RCV-LE/CA/03/C) at FRX ±2 MHz Adjacent channel interference...
  • Page 26 CYBLE-222005-00 Table 49. BLE Subsystem (continued) Details/ Parameter Description Units Conditions F1AVG Average frequency deviation for RF-PHY Specification 11110000 pattern (TRM-LE/CA/05/C) Eye opening = F2AVG/F1AVG – – RF-PHY Specification (TRM-LE/CA/05/C) FTX, ACC Frequency accuracy –150 – RF-PHY Specification (TRM-LE/CA/06/C) FTX, MAXDR Maximum frequency drift –50 –...
  • Page 27 CYBLE-222005-00 Table 49. BLE Subsystem (continued) Details/ Parameter Description Units Conditions CHBW Channel spacing – – On-air data rate – 1000 – kbps IDLE2TX BLE.IDLE to BLE. TX transition time – µs IDLE2RX BLE.IDLE to BLE. RX transition time – µs RSSI Specifications RSSI, ACC...
  • Page 28: Environmental Specifications

    Environmental Specifications Environmental Compliance This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification...
  • Page 29: Regulatory Information

    The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP2005.
  • Page 30: Ised

    The Original Equipment Manufacturer (OEM) must ensure that ISED labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the ISED Notice above. The IC identifier is 7922A-2005. In any case, the end product must be labeled in its exterior with "Contains IC: 7922A-2005".
  • Page 31: Mic Japan

    CYBLE-222005-00 MIC Japan CYBLE-222005-00 is certified as a module with type certification number 203-JN0495. End products that integrate CYBLE-222005-00 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. KC Korea CYBLE-222005-00 is certified for use in Korea with certificate number MSIP-CRM-Cyp-2005.
  • Page 32: Packaging

    CYBLE-222005-00 Packaging Table 51. Solder Reflow Peak Temperature Maximum Time at Peak Module Part Number Package Maximum Peak Temperature No. of Cycles Temperature CYBLE-222005-00 22-pad SMT 260 °C 30 seconds Table 52. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package CYBLE-222005-00 22-pad SMT...
  • Page 33 CYBLE-222005-00 Figure 12 details reel dimensions used for the CYBLE-222005-00. Figure 12. Reel Dimensions The CYBLE-222005-00 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-222005-00 is detailed in Figure Figure 13. CYBLE-222005-00 Center of Mass Document Number: 002-00214 Rev.
  • Page 34: Ordering Information

    BLE = BLE Product Family Company ID: CY = Cypress For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales representative. To locate the nearest Cypress office, visit our website. U.S. Cypress Headquarters Address 198 Champion Court, San Jose, CA 95134 U.S.
  • Page 35: Acronyms

    CYBLE-222005-00 Acronyms Acronym Description Bluetooth Low Energy Bluetooth SIG Bluetooth Special Interest Group European Conformity Canadian Standards Association electromagnetic interference electrostatic discharge Federal Communications Commission GPIO general-purpose input/output Industry Canada integrated design environment Korea Certification Ministry of Internal Affairs and Communications (Japan) printed circuit board receive QDID...
  • Page 36: Document History Page

    CYBLE-222005-00 Document History Page Document Title: CYBLE-222005-00 EZ-BLE™ Creator Module Document Number: 002-00214 Orig. of Submission Revision Description of Change Change Date 4953407 10/08/2015 Preliminary datasheet for CYBLE-222005-00 module. 5060713 01/07/2016 Updated General Description to add reference and link to PSoC BLE silicon datasheet and include Declaration ID number.
  • Page 37 Table 17 to add Note 10 to specify under what conditions the maximum number of ADC channels can be achieved. 5709580 GNKK 04/24/2017 Updated the Cypress logo and copyright information. 6002363 12/22/2017 Updated reel dimensions in Figure 10 Figure 6087229 03/12/2018 Updated document title as “EZ-BLE™...
  • Page 38: Sales, Solutions, And Legal Information

    ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products.
  • Page 39 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Cypress Semiconductor CYBLE-222005-00...

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