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The Texas Instruments' Tiva™ C Series TM4C123G LaunchPad concept is an extremely low-cost,
expandable evaluation system for TI microcontrollers. This concept began with the tremendously
successful MSP430™ LaunchPad which introduced a large number of engineers to the TI
of microcontrollers
success by introducing the Tiva C Series TM4C123G LaunchPad featuring the Tiva C Series
TM4C123GH6PM
Build your own BoosterPack and take advantage of
sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers
a variety of avenues for you to reach potential customers with your solutions.
This document briefly discusses the design and architecture of the LaunchPad platform and presents
practical guidelines for application developers to build their own BoosterPacks for use with any of the
available TI MCU LaunchPad
currently available for each LaunchPad kit, visit the
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References and Schematics
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LaunchPad BoosterPack Compatibility Summary
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J1 Connector
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J2 Connector
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J3 Connector
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J4 Connector
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Tiva C Series LaunchPad Jumper List
Tiva, MSP430 are trademarks of Texas Instruments.
Stellaris is a registered trademark of Texas Instruments.
Cortex is a trademark of ARM Limited.
ARM is a registered trademark of ARM Limited.
All other trademarks are the property of their respective owners.
SPMU288A - August 2012 - Revised April 2013
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Tiva™ C Series EK-TM4C123GXL LaunchPad:
BoosterPack Development Guide
(MCUs). The Tiva Series of 32-bit ARM
microcontroller.
kits. For more information about the LaunchPad, or about the BoosterPacks
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Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development
Copyright © 2012-2013, Texas Instruments Incorporated
SPMU288A - August 2012 - Revised April 2013
Cortex™-M4 MCU family expands that
®
Texas Instruments' website
LaunchPad site
at www.ti.com.
Contents
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List of Tables
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Development Guide
MSP430 family
to help promote it! From
Guide
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Related Manuals for Texas Instruments Tiva C Series
Summary of Contents for Texas Instruments Tiva C Series
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Page 1: Table Of Contents
(MCUs). The Tiva Series of 32-bit ARM Cortex™-M4 MCU family expands that ® success by introducing the Tiva C Series TM4C123G LaunchPad featuring the Tiva C Series TM4C123GH6PM microcontroller. Build your own BoosterPack and take advantage of Texas Instruments’ website... -
Page 2: Launchpad And Boosterpack Expansion Concept And Overview
The Texas Instruments’ Tiva C Series TM4C123G LaunchPad concept is an extremely low-cost, expandable evaluation system for TI's Tiva C Series of ARM microcontrollers. This concept began with the tremendously successful MSP430™ LaunchPad which introduced a large number of engineers to the TI MSP430 family of microcontrollers. - Page 3 This development guide provides necessary design information for developers who want to create BoosterPacks that extend the functionality of the Tiva C Series or Stellaris LaunchPads using either the original BoosterPack Interface or the BoosterPack XL Interface. Figure 1 shows a photo of the Tiva C Series LaunchPad.
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Page 4: Boosterpack Functional Interface
Tiva C Series MCU peripherals are routed to each of the interface pins. The J1 connector is located on the far left side of the Tiva C Series LaunchPad. The J2 connector is located on the far right side of the TM4C123G LaunchPad. Software is used to configure the TM4C123GH6PM pin for one of the functions found in the tables. -
Page 5: Boosterpack Xl Functional Interface
Table 4 Table 5 show the Tiva C Series peripherals that are routed to each pin of the Tiva C Series- only BoosterPack XL Interface pins. J3 is the inner left BoosterPack XL Interface header. J4 is the inner right BoosterPack XL Interface header. Software is used to configure the TM4C123GH6PM pin for one of the functions found in the tables. -
Page 6: Launchpad Power Interface
Additional power and ground pins are available through labeled pins located in the extreme lower corners of the Tiva C Series LaunchPad. These pins are connected to the same 3.3 V, 5 V, and ground connections as the pins on the BoosterPack Interface and the BoosterPack XL Interface. -
Page 7: Special Consideration For Shared Pins
(2,54-mm) grid. Dimensions to these signals are provided for convenience. These signals are subject to change or move across revisions of the Tiva C Series LaunchPad or future LaunchPads. It is recommended that BoosterPacks use only the BoosterPack Interface and BoosterPack XL Interface. Use of other pins and signals is acceptable, but these pins and signals can change at any time. -
Page 8: Boosterpack Design Guidelines
BoosterPacks are not restricted in width and may extend as much as desired left and right of the Tiva C Series LaunchPad. • For BoosterPacks with RF antennas, place the antenna to the left or right of the Tiva C Series LaunchPad for minimal interference and signal attenuation. •... - Page 9 TivaWare for C Series Driver Library User’s Manual (literature number SPMU298). • TPS73633 Low-Dropout Regulator with Reverse Current Protection Data Sheet (literature number SBVS038) Schematics This section contains the complete schematics for the Tiva C Series LaunchPad board. • Microcontroller, USB, Expansion, Buttons, and LED • Power Management •...
- Page 10 CON_110_100 CON_110_100 +VBUS USR_SW1 LED_R DTC114EET1G +VBUS USR_SW2 CON_110_100 CON_110_100 WAKE RGB_LED_0404_COMA LED_G DTC114EET1G TEXAS INSTRUMENTS DESIGNER REVISION DATE 2/20/2013 PROJECT TIVA MICROCONTROLLERS Tiva TM4C123G LaunchPad 108 WILD BASIN ROAD, SUITE 350 LED_B DTC114EET1G AUSTIN TX, 78746 DESCRIPTION www.ti.com Microcontroller, USB, Expansion, Buttons and LED FILENAME PART NO.
- Page 11 1.0uF +VBUS +3.3V TLV803 TARGETRST RESET ICDI_RST OMIT this SVS Section for Tiva. Errata Fixed DESIGNER REVISION DATE TEXAS INSTRUMENTS 2/20/2013 PROJECT TIVA MICROCONTROLLERS Tiva Launchpad 108 WILD BASIN ROAD, SUITE 350 AUSTIN TX, 78746 DESCRIPTION www.ti.com Power Management FILENAME PART NO.
- Page 12 10pF 10pF VDDC VDDC TM4C123G 0.1uF 0.1uF 2.2uF 1.0uF DESIGNER REVISION DATE TEXAS INSTRUMENTS 2/20/2013 PROJECT TIVA MICROCONTROLLERS Tiva TM4C123G LaunchPad 108 WILD BASIN ROAD, SUITE 350 DESCRIPTION AUSTIN TX, 78746 In Circuit Debug Interface www.ti.com FILENAME PART NO. SHEET EK-TM4C123GXL Rev A.sch...
- Page 13 Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.
- Page 14 FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
- Page 15 Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp...
- Page 16 FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated...
- Page 17 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
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