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Wireless modules
EG18-EA
Hardware design
Quectel EG18-EA Hardware Design
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Contents
Table of Contents
Bookmarks
Table of Contents
About the Document
Table of Contents
Contents
Introduction
Safety Information
Product Concept
General Description
Key Features
Functional Diagram
Evaluation Board
Application Interfaces
Pin Assignment
Pin Description
Operating Modes
Power Saving
Sleep Mode
UART Application
USB Application with USB Remote Wakeup Function
USB Application with USB Suspend/Resume and RI Function
USB Application Without USB Suspend Function
Airplane Mode
Power Supply
Power Supply Pins
Decrease Voltage Drop
Reference Design for Power Supply
Monitor the Power Supply
Turn on and off Scenarios
Turn on the Module through PWRKEY
Turn off the Module
Turn off the Module through PWRKEY
Turn off the Module through at Command
Reset the Module
U)SIM Interfaces
USB Interface
UART Interfaces
Main UART Interface
Debug UART Interface
BT UART Interface
UART Application
SPI Interface
PCM and I2C Interfaces
ADC Interfaces
Network Status Indication
Operation Status Indication
RI Behaviors
Pcie Interface
Root Complex Mode
Endpoint Mode
SDIO Interface
Antenna Tuner Control Interfaces
USB_BOOT Interface
Gpios
GNSS Receiver
General Description
GNSS Performance
Layout Guidelines
Antenna Interfaces
Main/Rx-Diversity/Mimo Antenna Interfaces
Pin Definition
Operating Frequencies
Reference Design of RF Antenna Interfaces
GNSS Antenna Interface
Pin Definition
GNSS Frequency
Reference Design of GNSS Antenna Interface
Reference Design of RF Layout
Antenna Installation
Antenna Requirements
Recommended RF Connector for Antenna Installation
Electrical, Reliability and Radio Characteristics
Absolute Maximum Ratings
Power Supply Ratings
Operation and Storage Temperatures
Current Consumption
EG18-EA Current Consumption
EG18-NA Current Consumption
RF Output Power
RF Receiving Sensitivity
EG18-EA Receiving Sensitivity
EG18-NA Receiving Sensitivity
Electrostatic Discharge
Thermal Considerations
Mechanical Dimensions
Mechanical Dimensions of the Module
Recommended Footprint
Design Effect Drawings of the Module
Storage, Manufacturing and Packaging
Storage
Manufacturing and Soldering
Packaging
Appendix A References
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U)Sim Interfaces
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EG18
Hardware Design
LTE-A Module Series
Rev. EG18_Hardware_Design_V1.1
Date: 2019-12-21
Status: Released
www.quectel.com
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