Quectel EC200T Series Hardware Design page 7

5.2. Power Supply Requirements .................................................................................................
5.3. I/O Requirements ..................................................................................................................
5.4. RF Characteristics ................................................................................................................
5.5. ESD Characteristics ..............................................................................................................
5.6. Operation and Storage Temperatures ...................................................................................
5.7. Current Consumption ............................................................................................................
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Dimensions and Packaging ............................................................................................................
6.1. General Description ..............................................................................................................
6.2. Mechanical Dimensions of EC200T Series Mini PCIe ...........................................................
6.3. Standard Dimensions of Mini PCI Express ............................................................................
6.4. Packaging Specifications ......................................................................................................
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Appendix References .....................................................................................................................
EC200T_Series_Mini_PCIe_Hardware_Design
LTE Standard Module Series
EC200T Series Mini PCIe Hardware Design
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