Technical Specifications - Seco Q7-A75-J User Manual

Module with nxp i.mx6 processor
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2.2 Technical Specifications

Processors
®
NXP i.MX6 Family, based on ARM
-
i.MX6S Solo - Single core up to 1GHz
-
i.MX6DL Dual Lite - Dual core up to 1GHz per core
Memory
Up to 1GB DDR3L onboard (up to 512MB with i.MX 6Solo)
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL
Supports 2 independent displays
Video Interfaces
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18/24 bit interface
HDMI Interface
Video Resolution
LVDS, resolution up to 1920x1200
HDMI, resolution up to 1080p
Mass Storage
Onboard eMMC Drive, up to 8 GB*
SD/MMC/SDIO interface
Internal SPI Flash for booting
PCI Express
1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
* Please consider that for HDD and Flash Disk manufacturers, 1GB = 10^9 Byte.
Some OS (like, for example, Windows) intends 1GB = 1024^3 byte, so global
capacity shown for Disk Properties will be less than expected. Please also consider
that a portion of disk capacity will be used by internal Flash Controller for Disk
management, so final capacity will be lower.
CORTEX-A9 processors
®
ES2.0 3D
Networking
FastEthernet (10/100 Mbps) interface
USB
1 x USB OTG interface
1 x USB2.0 Host interface
Audio
'
I2S / AC
97 Audio interface
Other Interfaces
On the card edge connector, many pins can be used as General Purpose I/Os or to
implement some (*) of the following extra functionalities:
-
Additional SD interface
-
Up to 4 UARTs
-
CAN interface
-
Watchdog(s)
-
I2C interfaces
-
PWM outputs
-
SPI interface
-
Additional Audio interface
(*) not all the combinations are allowed simultaneously
Power Management Signals
Power supply voltage: +5V
± 5%
DC
Optional Low Power RTC
Operating temperature:
0°C ÷ +60°C **
"
Dimensions: 40 x70 mm (1.57
x 2.76
** Temperatures indicated are the maximum temperature that the
heatspreader / heatsink can reach in any of its parts. This means that it is
'
customer
s responsibility to use any passive cooling solution along with an
application-dependent cooling system, capable to ensure that the
heatspreader / heatsink temperature remains in the range above indicated.
Please also check paragraph 4.1
"
)

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