Technical Specifications - Seco Qseven CQ7-D03 User Manual

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2.2 Technical Specifications

Supported Modules
®
®
Qseven
Rel. 2.1 modules
Mass Storage interfaces
microSD Slot
Video Interfaces
LVDS Single/Dual Channel 18-/24-bit
HDMI Connector
Audio
Optional Line Out + Mic In combo TRRS audio jack with I2S Audio Codec
USB
1 x USB 2.0 Host port on Type-A socket
1 x USB 3.0 Host ports on Type-A socket shared with USB 2.0 OTG Client
1 x USB 2.0 OTG port on micro-AB socket shared with USB 3.0 Host
1 x USB 2.0 Host port on internal connector
1 x USB 2.0 Host port on M.2 Socket 1 KeyE Slot
1 x USB 2.0 Host port on mini-PCIe Slot
PCIe
1 x PCIe x1 lane on M.2 Socket 1 Key E Slot
1 x PCIe x1 lane on Mini-PCIe Slot
Networking
1 x Gigabit Ethernet connectors
1 x Mini-PCIe Slot for WWAN Modem Modules, connected to on-board microSIM
slot
Serial Ports
Optional 4-wires RS-232 / RS-422 / RS-485 configurable serial port on pin
header
Debug UART on pin header (shared with USB Debug Serial)
USB Debug Serial on micro-AB socket (shared with Debug UART on pin header)
Other Interfaces
1 x M.2 Socket 1 Key E Slot for a M.2 NPU or a WiFI/BT module
CQ7-D59
CQ7-D59 - Rev. First Edition: 1.0 - Last Edition: 1.0 - Author: A.R. - Reviewed by M.B. Copyright © 2021 SECO S.p.A.
Optional 1 x CAN port on pin header
1 x 40 pin connector for I2C, SPI and General Purpose I/O, pinout compatible
with the Raspberry Pi - GPIO Connector
1 x LED driver connector
FAN connector configurable for 3 or 4 wires and +12V or +5V
microSIM Slot for miniPCIe Modem
Debug USB port on micro-AB socket
MFG connector for JTAG programming of Qseven® module
Power supply voltage: 12V
through USB Type-C connector
DC
Coin cell battery Holder for CMOS and RTC
Operating temperature: 0°C ÷ +70°C (Commercial temperature range)
Dimensions: 101.6 x 101.6 mm, embedded NUC
* Temperature ranges indicated mean that all components available onboard
are certified for working with a Tcase included in these temperature ranges.
This means that it is customer
Tcases remain in the range above indicated. Please also check paragraph
4.1.
TM
form factor
'
s responsibility to ensure that all components
'
14

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