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HP Z2 SFF G5 Product End-Of-Life Disassembly Instructions

HP Z2 SFF G5 Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Z2 SFF G5 Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries, excluding Li-Ion batteries.
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
EL-MF877-00
Template Revision C
Last revalidation date 09-May-2018
Notes
With a surface greater than 10 sq cm
All types including standard alkaline, coin or button style
batteries
Battery(ies) are attached to the product by (check all
that apply with an "x" inside the "[ ]"):
[
[X] snaps
[
[
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Acbel 260W EPA92 PSU
Power Cord
HPI instructions for this template are available at
HP's Sustainability
Contact.
] screws
] adhesive
] other. Explain
EL-MF877-01
Quantity of
items
included in
product
2
1
1
1
Page 1

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Summary of Contents for HP Z2 SFF G5

  • Page 1 Marketing Name / Model [List multiple models if applicable.] HP Z2 SFF G5 Workstation Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Quantity of items Item Description Notes included in product Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances...
  • Page 3 29. Use PH1 screwdriver to remove FG screw 30. Disconnect fan connector and inlet connector 31. Use PH1 screw driver to remove PCB1 screw 32. Use PH1 screwdriver to remove AC inlet & Fan screw 33. Heat the solder of the Electrolytic Capacitors of greater than 2.5cm in diameter or height and Remove it 3.2 Optional Graphic.
  • Page 4 Step7 Disconnect all cables from MB Step8 Remove the driver cage from Chassis EL-MF877-00 Page 4 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 5 Step 9 Disconnect system fan cable from MB Step 10 Disconnect cooler fan cable from MB Step 11 Remove the Fan duct from cooler Step 12 Use T-15 screwdriver to loose the screws and remove cooler EL-MF877-00 Page 5 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 6 Step 13 Use PH1 screwdriver to loose the screws and remove Step 14 Separate the fan from cooler the fan Step 15 Remove memory from MB Step 16 Rotate the handle and open it up EL-MF877-00 Page 6 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 7 Step 17 Remove the CPU from the board Step 18 Remove the battery from the system board Step 19 Remove speaker from Chassis Step 20 Remove WLAN M.2 Card EL-MF877-00 Page 7 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 8 Step 21 Use T-15 screwdriver remove the screws on the PSU Step 22 Disconnect the PSU cable from the MB Chassis Step 23 Use T-15 screwdriver to loose the screws of MB from Step 24 Remove MB from chassis board EL-MF877-00 Page 8 Template Revision C...
  • Page 9 Step 25 Press the PSU’s latch on chassis Step 26 Remove the PSU from chassis Step 27 Use PH1 screwdriver to remove screw for the PSU Step 28 Remove cover EL-MF877-00 Page 9 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 10 Step 29 Use PH1 screwdriver to remove FG screw Step 30 Disconnect fan connector and inlet connector Step 31 Use PH1 screw driver to remove PCB1 screw Step 32 Use PH1 screwdriver to remove AC inlet & Fan screw Step 33 Heat the solder of the Electrolytic Capacitors of greater than 2.5cm in diameter or height and Remove it EL-MF877-00 Page 10...