Service Precautions; Notes On Soldering; Notes On Replacing; Service Notice - PIONEER DJ TSP-16 Service Manual

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1. SERVICE PRECAUTIONS

1.1 NOTES ON SOLDERING

• For environmental protection, lead-free solder is used on the printed circuit boards mounted in this unit.
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Be sure to use lead-free solder and a soldering iron that can meet specifications for use with lead-free solders for repairs
accompanied by reworking of soldering.
Do NOT use a soldering iron whose tip temperature cannot be controlled.

1.2 NOTES ON REPLACING

The part listed below is difficult to replace as a discrete component part.
It the failure of suspected that are listed in the table, replace whole ASSY.
ASSY Name
Ref No.
IC201
IC202
B
IC501
IC502
IC502
IC800
IC2000
MAIN ASSY IC2300
IC2301
IC3800
S200
JA2600
C
JA3200
JA3201
JA4100
IC5400
IC6000
IO ASSY
IC6600
VR5200
MVR ASSY VR6800
USBA ASSY JA7600
D
IC7100
LCD ASSY IC7101
S9321
CDC ASSY IC7700

1.3 SERVICE NOTICE

Calibration of performance pad
• Performance pad was calibrated when the product is produced. If a relevant part is replaced with a new one, be sure to
carry out the calibration.
• For the method of calibration, refer to "PAD CALIBRATION MODE" in "6.1 TEST MODE".
• If you forget to carry out the calibration, power for tapping the performance pad and degree of sound volume when
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the sampler velocity mode is turned ON vary depending on the pad.
• Calibration execution data is memorized in the MAIN ASSY. Be sure to carry out the calibration when the MAIN ASSY is
replaced new one.
About PADB ASSY of sensors (Pressure sensitive)
• Don`t touch the black parts of the PADB ASSY (side-A) and black mat parts of the Sensor (16 pieces each, which are
pressure sensitive ) with your bare hands.
Clear the dust between the PADB ASSY, Sheet, Sensor and Button (DEB2037) by air blast when you assemble the sensor.
About SEQ1 ASSY, SEQ2 ASSY and BAR ASSY
• Clear the dust between inside of the Cap, Buttons and PCBs by air blast to remove the foreign particles when you assemble
SEQ1 ASSY, SEQ2 ASSY or BAR ASSY.
About the NAND:Flash ROM IC(IC2601) in the MAIN ASSY
• Replacement of the NAND (IC2601) in the MAIN ASSY is not possible during service, because writing of the MAC address
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on the production line is required. Therefore, the NAND (IC2601) are not supplied as a service part. If the NAND is defective,
replace the whole MAIN ASSY.
Caution: Control Panel and Chassis unit in the state that has wire does not open 180 degrees.
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Parts that is Difficult to Replace
Part No.
MM3543BH DC/DC CONVERTER
MM3543BH DC/DC CONVERTER
NJW4155GM1-A DC/DC CONVERTER
MM3543BH DC/DC CONVERTER
TPS2557DRB USB POWER SW
MMPF0100F0AEP POWER MANAGEMENT IC
MCIMX6Q5EYM10AD MAIN uCOM
K4B4G1646D-BCMA DDR3-RAM
K4B4G1646D-BCMA DDR3-RAM
THGBMHG6C1LBAWL eMMC
ASG1102 POWER SW
AKN7115 LAN TERMINAL (RJ-45)
DKN1188 MIDI IN TERMINAL (DIN)
DKN1188 MIDI OUT/THRU TERMINAL (DIN)
DKN1237 USB-B TERMINAL
AK4458VN MULTI -OUT DAC
AK4452VN SEND DAC
AK4452VN HEADPHONE DAC
DCS1133 INPUT LEVEL VOLUME
DCS1134 MAIN OUT VOLUME
JA7600 USB-A TERMINAL
R1290K103A DC/DC CONVERTER
BD81A04EFV-M DC/DC CONVERTER
DSX1080 ROTARY SELECTOR (ENCODER)
AD7147ACPZ500RL7 CDC (CAPACITANCE SENSORS IC)
TSP-16
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Function
IC with heat-pad
IC with heat-pad
IC with heat-pad
IC with heat-pad
IC with heat-pad
IC with heat-pad
BGA
BGA
BGA
BGA
Terminal part with through-hole
Terminal part with through-hole
Terminal part with through-hole
Terminal part with through-hole
Terminal part with through-hole
IC with heat-pad
IC with heat-pad
IC with heat-pad
Terminal part with through-hole
Terminal part with through-hole
Terminal part with through-hole
IC with heat-pad
IC with heat-pad
Terminal part with through-hole
IC with heat-pad
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Remarks
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