Quectel EG12 Series Hardware Design page 10

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FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 75
FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 75
FIGURE 41: SPACE FACTOR OF MATING PLUGS (UNIT: MM) .................................................................... 76
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ................. 84
FIGURE 43: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS' PCB)
................................................................................................................................................................... 84
FIGURE 44: MODULE TOP AND SIDE DIMENSIONS .................................................................................... 86
FIGURE 45: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 87
FIGURE 46: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 88
FIGURE 47: TOP VIEW OF THE MODULE ...................................................................................................... 89
FIGURE 48: BOTTOM VIEW OF THE MODULE .............................................................................................. 89
FIGURE 49: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 91
FIGURE 50: TAPE SPECIFICATIONS.............................................................................................................. 92
FIGURE 51: REEL SPECIFICATIONS.............................................................................................................. 93
EG12_Hardware_Design
LTE-A Module Series
EG12 Hardware Design
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