Huawei MC509 Hardware Manual page 38

HUAWEI MC509 CDMA Mini PCIe Module
Hardware Guide
Item
Damp heat cycling
Temperature
shock
Salty fog test
Sine vibration
Issue 03 (2014-12-26)
Test Condition
High temperature:

55ºC
Low temperature: 25ºC

Humidity: 95% ±3%

Operation mode:

working with service
connected
Test duration: 6 cycles;

12 h+12 h/cycle
Low temperature:

–40ºC
High temperature:

85ºC
Temperature change

interval: < 20s
Operation mode: no

power, no package
Test duration: 100

cycles; 15 Min+15
Min/cycle
Temperature: 35°C

Density of the NaCl

solution: 5% ± 1%
Operation mode: no

power, no package
Test duration:
Spraying interval: 8 h

Duration of exposing

the module to the
temperature of 35°C:
16 h
Frequency range: 5 Hz

to 200 Hz
Acceleration: 1Grms

Frequency scan rate:

0.5 oct/min
Operation mode:

working with service
connected
Test duration: 3 axial

directions. 2 h for each
axial direction.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
Standard Sample
size
IEC60068- 3 pcs/group
2-30
JESD22-A
101-B
IEC60068- 3 pcs/group
2-14
JESD22-A
104-C
IEC60068- 3 pcs/group
2-14
JESD22-A
107-B
IEC60068- 3 pcs/group
2-6
JESD22-B
103-B
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
38