Emc And Esd Features - Huawei MC509 Hardware Manual

HUAWEI MC509 CDMA Mini PCIe Module
Hardware Guide
Item
Shock test
Drop test
ESD with DVK (or
embedded in the
host)
ESD
Groups ≥ 2

5.6 EMC and ESD Features

The following are the EMC design comments:


Issue 03 (2014-12-26)
Test Condition
Half-sine wave shock

Peak acceleration:

30Grms
Shock duration: 11 ms

Operation mode:

working with service
connected
Test duration: 6 axial

directions. 3 shocks for
each axial direction.
0.8 m in height. Drop

the module on the
marble terrace with
one surface facing
downwards, Six
surfaces should be
tested.
Operation mode: no

power, no package
Contact and Air

discharges: 10 positive
and 10 negative
applied
Contact Voltage: ±2

kV, ±4 kV
Air Voltage : ±2 kV, ±4

kV, ±8 kV
Operation mode:

working with service
connected
Attention should be paid to static control in the manufacture, assembly, packaging,
handling and storage process to reduce electrostatic damage to HUAWEI
module.
RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustment on RF match circuit.
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Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
Standard Sample
size
IEC60068- 3 pcs/group
2-27
JESD-B10
4-C
IEC60068- 3 pcs/group
2-32
IEC61000- 2 pcs
4-2
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
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