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Huawei MU709 Series Hardware Manual

Huawei MU709 Series Hardware Manual

Hspa+ mini pcie module
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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Issue
04
Date
2015-06-25

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Summary of Contents for Huawei MU709 Series

  • Page 1 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Issue Date 2015-06-25...
  • Page 2 Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.
  • Page 3 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version 2014-09-15 Creation 2014-09-18 3.3.2 Updated section 3.3.2: Reset the Module 2015-02-16 Added the description of MU709s-6 module 2015-06-25...

  • Page 4: Table Of Contents

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Contents Contents 1 Introduction............................ 7 2 Overall Description ........................8 2.1 About This Chapter ........................... 8 2.2 Function Overview..........................8 2.3 Circuit Block Diagram ........................9 3 Description of the Application Interfaces ................11 3.1 About This Chapter ..........................
  • Page 5 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Contents 4.4 Conducted Rx Sensitivity and Tx Power ..................28 4.4.1 Conducted Receive Sensitivity ....................28 4.4.2 Conducted Transmit Power ....................29 4.5 Antenna Design Requirements ...................... 30 4.5.1 Antenna Design Indicators..................... 30 4.5.2 Interference ...........................
  • Page 6 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Contents 8.11 Care and Maintenance ......................... 59 8.12 Emergency Call ..........................59 8.13 Regulatory Information ......................... 59 8.13.1 CE Approval (European Union) ................... 59 8.13.2 FCC Statement ........................60 9 Appendix A Circuit of Typical Interface ................61 10 Appendix B Acronyms and Abbreviations ................

  • Page 7: Introduction

    Introduction This document describes the hardware application interfaces and air interfaces provided by HUAWEI MU709 series (MU709s-2 and MU709s-6) HSPA+ Mini PCIe Module (hereinafter referred to as the MU709 module). This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the MU709 module.

  • Page 8: Overall Description

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the MU709 module and provides:  Function Overview  Circuit Block Diagram 2.2 Function Overview Table 2-1 Features...

  • Page 9: Circuit Block Diagram

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Overall Description Feature Description See the HUAWEI MU709 Series HSPA+ Module AT Command Commands Interface Specification. Application One standard USIM card (Class B and Class C) Interface Audio interface: PCM interface...
  • Page 10 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Overall Description  LGA Module  Control signals  Antenna Connectors Figure 2-1 Circuit block diagram of the MU709 module Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd Issue 04 (2015-06-25)

  • Page 11: Description Of The Application Interfaces

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the MU709 module, including:  Mini PCIe Interface ...
  • Page 12 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Figure 3-1 Sequence of Mini PCIe interface Table 3-1 Pin definitions of the Mini PCIe Interface Pin Name Description Parameter Min. Typ. Max. Comments Type Mini PCI...
  • Page 13 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. Typ. Max. Comments Type Mini PCI HUAWEI Express Standard Description Description CLKREQ# connected UIM_PWR USIM_PWR Power USIM_PW –0.3 1.98 source for R=1.8 V...
  • Page 14 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. Typ. Max. Comments Type Mini PCI HUAWEI Express Standard Description Description Ground UIM_Vpp connected Reserved connected Ground Reserved connected W_DISABLE connected...
  • Page 15 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. Typ. Max. Comments Type Mini PCI HUAWEI Express Standard Description Description Ground USB_D- USB_DM USB signal Ground USB_D+ USB_DP USB signal 3.3Vaux...

  • Page 16: Power Interface

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. Typ. Max. Comments Type Mini PCI HUAWEI Express Standard Description Description 3.3Vaux VCC_3V3 3.3 V DC supply input  P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output;...

  • Page 17: Power Supply Time Sequence

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.3.2 Power Supply Time Sequence Power on Sequence Figure 3-2 Power on timing sequence Parameter Remarks Time (Nominal value) Unit Power Valid to USB D+ high Do not toggle RESIN_N pin during the power on sequence.

  • Page 18: Signal Control Interface

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.4 Signal Control Interface 3.4.1 Overview The signal control part of the interface in the MU709 module consists of the following:  WAKE# Signal  RESIN_N Signal ...

  • Page 19: Resin_N Signal

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Figure 3-4 Connections of the WAKE# pin 3.4.3 RESIN_N Signal The RESIN_N signal is used to reset the module's system. When the module software stops responding, the RESIN_N pin can be pulled down to reset the module hardware.

  • Page 20: Led_Wwan# Signal

    The RESIN_N pin is optional, which can not be connected. 3.4.4 LED_WWAN# Signal MU709 series module provides an LED_WWAN# signal to indicate the work status. This function is disabled by default, it is controlled by AT^LEDCTRL. For details about the command, please refer to...

  • Page 21: Usb Interface

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Figure 3-7 shows the recommended circuits of the LED_WWAN# pin. According to LED feature, you can adjust the LED brightness by adjusting the resistance of resistor Figure 3-7 Driving circuit 3.5 USB Interface...

  • Page 22: Circuit Recommended For The Usb Interface

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.5.2 Circuit Recommended for the USB Interface Figure 3-8 Recommended circuit of USB interface 3.6 USIM Card Interface 3.6.1 Overview The MU709 module provides a USIM card interface complying with the ISO 7816-3 standard and supports both Class B and Class C USIM cards.

  • Page 23: Circuit Recommended For The Usim Card Interface

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. Max. (V) Comments Type USIM_PWR=1.8 Power source –0.3 1.98 for the USIM_PWR external USIM USIM_PWR=3.0 –0.3 card 3.6.2 Circuit Recommended for the USIM Card Interface As the Mini PCIe Adapter is not equipped with a USIM socket, you need to place a USIM socket on the user interface board.

  • Page 24: Audio Interface

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces capacitors are placed between the USIM_DATA and Ground pins, the USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to filter interference from RF signals.

  • Page 25: Circuit Recommended For The Audio Interface

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.7.2 Circuit Recommended for the Audio Interface Figure 3-10 Circuit diagram of the interface of the PCM (MU709 module is used as PCM master) Figure 3-11 Circuit diagram of the interface of the PCM (MU709 is used as PCM slave) MU709 module supports both master and slave mode.

  • Page 26: Nc Pins

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.8 NC Pins The MU709 module has some NC pins. All of NC pins should not be connected. Please keep these pins open. Table 3-8 NC pins Pin No.

  • Page 27: Rf Specifications

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the MU709 module, including:  Operating Frequencies  Conducted RF Measurement  Conducted Rx Sensitivity and Tx Power ...

  • Page 28: Conducted Rf Measurement

    The instrument compensation needs to be set according to the actual cable conditions. 4.3.2 Test Standards Huawei modules meet 3GPP test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed. 4.4 Conducted Rx Sensitivity and Tx Power 4.4.1 Conducted Receive Sensitivity...

  • Page 29: Conducted Transmit Power

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications Typical value (Unit: Band Note dBm) GSM 900 –109 BER Class II < 2.44% GSM 1800 (DCS) –108 BER Class II < 2.44% GSM 1900 (PCS) –108 BER Class II < 2.44% WCDMA Band 1 –109...

  • Page 30: Antenna Design Requirements

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications Band Typical Value (Unit: dBm) Note (Unit: dB) (DCS) 8PSK(1Tx Slot) ±2 GSM 1900 GMSK(1Tx Slot) ±1.5 (PCS) 8PSK(1Tx Slot) ±2 WCDMA Band 1 ±1 WCDMA Band 8 -1.5/+1...
  • Page 31 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications It is recommended that the cable loss is as low as possible, for example, U.FL-LP-088 made by HRS. The following antenna efficiency (free space) is recommended for MU709 module to ensure high radio performance of the module: Efficiency of the primary antenna: ≥...
  • Page 32 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications Polarization The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation. The linear polarization is recommended for the antenna of MU709 module.

  • Page 33: Interference

    The antenna consists of the antenna body and the relevant RF transmission cable. Take the RF transmission cable into account when measuring any of the preceding antenna indicators. Huawei cooperates with various famous antenna suppliers who are able to make  suggestions on antenna design, for example, Amphenol, Skycross, etc.
  • Page 34 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications Antenna Requirements 50 Ω Impedance ≤ 3:1 VSWR absolute max ≤ 2:1 VSWR recommended Table 4-8 MU709s-6 module antenna requirements Antenna Requirements Depending on frequency band(s) provided by the network...

  • Page 35: Electrical And Reliability Features

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features of the interfaces in the MU709 module, including:  Absolute Ratings ...

  • Page 36: Power Supply Features

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Table 5-2 Operating and storage temperatures for the MU709 module Specification Min. Max. Unit Normal working temperatures –20 °C Extended temperatures –30 °C Ambient temperature for storage –40...

  • Page 37: Power Consumption

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features 5.4.2 Power Consumption The power consumptions of MU709 module in different scenarios are respectively listed in Table 5-5 to Table 5-8 . The power consumption listed in this section is tested when the power supply of the MU709 module is 3.3 V, and all of test values are measured at room temperature.
  • Page 38 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Table 5-6 Averaged data transmission DC power consumption of MU709s-2 module (HSPA/WCDMA) Description Band Test Value (Unit: mA) Power Typical WCDMA Band 1 0 dBm Tx Power...
  • Page 39 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Description Band Test Value (Unit: mA) Power (dBm) Band 2 0 dBm Tx Power (1900 MHz) 10 dBm Tx Power 23.5 dBm Tx Power Band 5 0 dBm Tx Power...
  • Page 40 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Description Test Value (Unit: mA) Configuration Typical 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down EDGE 850 1 Up/1 Down...

  • Page 41: Reliability Features

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features  All power consumption test configuration can be referenced by GSM Association Official Document TS.09: Battery Life Measurement and Current Consumption Technique.  Test condition: For Max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in Table 4-5 ;...
  • Page 42 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample size Results Thermal shock  Low temperature: JESD22- 3 pcs/group Visual inspection: ok –40ºC A106-B Function test: ok  High temperature: RF specification: ok 85ºC...
  • Page 43 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample size Results Drop test  0.8 m in height. Drop IEC60068 3 pcs/group Visual inspection: ok the module on the -2-32 Function test: ok...

  • Page 44: Emc And Esd Features

    The following are the EMC design comments:  Attention should be paid to static control in the manufacture, assembly, packaging, handling, storage process to reduce electrostatic damage to HUAWEI module.  RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if the antenna port is protected by TVS (Transient Voltage Suppressor), which is resolved by making some adjustment on RF match circuit.
  • Page 45  Effective shielding measures must be taken on the ESD sensitive materials that are transported or stored outside the EPA. HUAWEI MU709 module does not include any protection against overvoltage. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd...

  • Page 46: Mechanical Specifications

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter mainly describes mechanical specifications of MU709 module, including:  Dimensions and Interfaces  Dimensions of the Mini PCI Express Connector ...

  • Page 47: Dimensions Of The Mini Pci Express Connector

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Figure 6-1 Dimensions of the MU709 module (Unit: mm) 6.3 Dimensions of the Mini PCI Express Connector The Mini PCIe Adapter adopts a standard Mini PCI Express connector that has 52...

  • Page 48: Packaging

    Mechanical Specifications Figure 6-2 Dimensions of the Mini PCI Express connector (Unit: mm) 6.4 Packaging HUAWEI Mini PCIe module uses anti-vibration foam and ESD bag into cartons. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd Issue 04 (2015-06-25)

  • Page 49: Specification Selection For Fasteners

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications 6.5 Specification Selection for Fasteners 6.5.1 Installing the Mini PCIe Adapter on the Main Board To install the Mini PCIe Adapter on the main board, do the following: Step 1 Insert the Mini PCIe Adapter into the Mini PCI Express connector on the main board.
  • Page 50 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Step 2 Press downwards to fix the Mini PCIe Adapter in the module slot. Step 3 Use a screwdriver to fix the Mini PCIe Adapter on the main board with two screws provided in the Mini PCIe Adapter packing box.

  • Page 51: Romoving The Mini Pcie Adapter From The Main Board

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications  Insert the antenna connectors vertically into the antenna interfaces of the Mini PCIe Adapter. Do not press or squeeze the antenna cable or damage the connectors. Otherwise, the ...

  • Page 52: Antenna Plug

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Step 3 Slide backwards the two clips to release the Mini PCIe Adapter from the slot. Then, lift up the Mini PCIe Adapter. 6.6 Antenna Plug Figure 6-3 Mating the plug Align the mating tool or the mating end of the tool over the plug end of the cable assembly.

  • Page 53: Thermal Design Guide

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Place the plug cable assembly (held in the tool) over the corresponding receptacle. Assure that the plug and receptacle are aligned press-down perpendicular to the mounting surface until both connectors are fully mated.
  • Page 54 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications dimensions (W x D) of the thermal conductive material are 38 mm x 28 mm (1.50 in. x 1.10 in.), and its height depends on the height of the Mini PCIe connector you use and the method for installing the Mini PCIe.
  • Page 55 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications If you do not take the preceding heat dissipation measures, the overheat protection mechanism is triggered due to overheated Mini PCIe and the network connection is terminated when the Mini PCIe keeps working in enclosed space with a 70ºC temperature and a big current for a...

  • Page 56: Certifications

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Certifications Certifications 7.1 About This Chapter This chapter gives a general description of certifications of MU709 module. 7.2 Certifications Table 7-1 shows certifications of the MU709 module have been implemented. For more demands, please contact us for more details about this information.

  • Page 57: Safety Information

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.

  • Page 58: Traffic Security

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Safety Information  Area indicated with the "Power off bi-direction wireless equipment" sign  Area where you are generally suggested to stop the engine of a vehicle 8.4 Traffic Security ...

  • Page 59: Laws And Regulations Observance

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Safety Information 8.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 8.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device.

  • Page 60: Fcc Statement

    Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd...

  • Page 61: Appendix A Circuit Of Typical Interface

    HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface VCC From Host Wake the host VCC _3 V3 W AK E# VCC_3V3 G ND 1 Open drain,active low...

  • Page 62: Appendix B Acronyms And Abbreviations

    HUAWEI MU709 Series HSPA+ Mini PCIe Module 9BAppendix B Acronyms and Hardware Guide Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP Third Generation Partnership Project Auxiliary China Compulsory Certification European Conformity Direct Current EDGE Enhanced Data Rate for GSM Evolution...
  • Page 63 HUAWEI MU709 Series HSPA+ Mini PCIe Module 9BAppendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Printed Circuit Board Radio Frequency Restriction of the Use of Certain Hazardous RoHS Substances Transient Voltage Suppressor UMTS Universal Mobile Telecommunications System...

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Mu709s-2Mu709s-6

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