Huawei MU509-1 Manuals

Manuals and User Guides for Huawei MU509-1. We have 1 Huawei MU509-1 manual available for free PDF download: Hardware Manual

Huawei MU509-1 Hardware Manual

Huawei MU509-1 Hardware Manual (94 pages)

HSDPA LGA Module

Brand: Huawei | Category: Control Unit | Size: 1 MB

Table of Contents

Table of Contents
8
1 Introduction

11
2 Overall Description

12
- About this Chapter
  12
- Function Overview
  12
- Circuit Block Diagram
  14
- Application Block Diagram
  16
3 Description of the Application Interfaces

17
- About this Chapter
  17
- LGA Interface
  17
- Power Interface
  26
  - Overview
    26
  - VBAT Interface
    27
  - VCOIN Interface
    28
  - Output Power Supply Interface
    30
- Signal Control Interface
  30
  - Overview
    30
  - Input Signal Control Pins
    31
  - Output Signal Control Pin
    34
  - WAKEUP_IN Signal
    37
  - WAKEUP_OUT Signal
    38
- UART Interface
  39
  - Overview
    39
  - Circuit Recommended for the UART Interface
    40
- USB Interface
  40
- SIM Card Interface
  41
  - Overview
    41
  - Circuit Recommended for the SIM Card Interface
    42
- Audio Interface
  44
  - Analogue Audio
    44
  - Digital Audio
    45
  - Primary Mode
    46
- General Purpose I/O Interface
  47
- JTAG Interface
  47
- RF Antenna Interface
  48
- NC Pins
  48
4 RF Specifications

49
- About this Chapter
  49
- Antenna Installation Guidelines
  49
- Operating Frequencies
  49
- Conducted RF Measurement
  50
  - Test Environment
    50
  - Test Standards
    50
- Conducted Rx Sensitivity and Tx Power
  50
  - Conducted Receive Sensitivity
    50
  - Conducted Transmit Power
    51
- Antenna Design Requirements
  52
  - Antenna Design Indicators
    52
  - Interference
    53
  - GSM/WCDMA Antenna Requirements
    54
  - Radio Test Environment
    54
5 Electrical and Reliability Features

56
- About this Chapter
  56
- Extreme Operating Conditions
  56
- Operating and Storage Temperatures and Humidity
  57
- Electrical Features of Application Interfaces
  57
- Power Supply Features
  58
  - Input Power Supply
    58
  - Power Consumption
    59
- Reliability Features
  69
- EMC and ESD Features
  71
6 Process Design

74
- About this Chapter
  74
- Storage Requirement
  74
- Moisture Sensitivity
  74
- Dimensions and Interfaces
  75
- Packaging
  76
- Label
  77
- Customer PCB Design
  79
  - PCB Surface Finish
    79
  - PCB Pad Design
    79
  - Solder Mask
    79
  - Requirements on PCB Layout
    80
- Assembly Processes
  80
  - General Description of Assembly Processes
    80
  - Stencil Design
    80
  - Reflow Profile
    81
- Specification of Rework
  82
  - Process of Rework
    82
  - Preparations of Rework
    83
  - Removing of the Module
    83
  - Welding Area Treatment
    83
  - Module Installation
    84
  - Specifications of Rework
    84
7 Certifications

85
- About this Chapter
  85
8 Safety Information

87
- Interference
  87
- Medical Device
  87
- Area with Inflammables and Explosives
  87
- Traffic Security
  88
- Airline Security
  88
- Safety of Children
  88
- Environment Protection
  88
- WEEE Approval
  88
- Rohs Approval
  88
- Laws and Regulations Observance
  89
- Care and Maintenance
  89
- Emergency Call
  89
- Regulatory Information
  89
  - CE Approval (European Union)
    89
  - FCC Statement
    90
9 Appendix A Circuit of Typical Interface

91
10 Appendix B Acronyms and Abbreviations

92

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