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Huawei MU709s-2 Hardware Manual

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HUAWEI MU709s-2 HSPA+ Mini PCIe Module
Hardware Guide
Issue
0.1
Date
2014-06-03

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Summary of Contents for Huawei MU709s-2

  • Page 1 HUAWEI MU709s-2 HSPA+ Mini PCIe Module Hardware Guide Issue Date 2014-06-03...
  • Page 2 Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.

  • Page 3: Revision History

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version 2014-06-03 This is a draft version, and some chapters are still with "TBD". Huawei Proprietary and Confidential Issue 0.1 (2014-06-03)

  • Page 4: Table Of Contents

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Contents Contents 1 Introduction............................ 7 2 Overall Description ........................8 2.1 About This Chapter ........................... 8 2.2 Function Overview..........................8 2.3 Circuit Block Diagram ........................9 3 Description of the Application Interfaces ................10 3.1 About This Chapter .........................
  • Page 5 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Contents 4.5.1 Antenna Design Indicators..................... 27 4.5.2 Interference ........................... 30 4.5.3 GSM/WCDMA Antenna Requirements .................. 30 5 Electrical and Reliability Features ................... 31 5.1 About This Chapter ......................... 31 5.2 Absolute Ratings ..........................31 5.3 Operating and Storage Temperatures ....................
  • Page 6 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Contents 9 Appendix A Circuit of Typical Interface ................54 10 Appendix B Acronyms and Abbreviations ................55 Huawei Proprietary and Confidential Issue 0.1 (2014-06-03) Copyright © Huawei Technologies Co., Ltd.

  • Page 7: Introduction

    Introduction Introduction This document describes the hardware application interfaces and air interfaces provided by MU709s-2 Mini PCIe Module (hereinafter referred to as the MU709s-2 module). This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the MU709s-2 module.

  • Page 8: Overall Description

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the MU709s-2 module and provides:  Function Overview  Circuit Block Diagram 2.2 Function Overview Table 2-1 Features...

  • Page 9: Circuit Block Diagram

    WWAN MAIN antenna connector x1 connector WWAN AUX antenna connector x1 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the MU709s-2 Mini PCIe Adapter. The major functional unit of the Mini PCIe Adapter contains the following parts:  DCDC Circuit ...

  • Page 10: Description Of The Application Interfaces

    RF Antenna Connector  NC Pins 3.2 Mini PCIe Interface The MU709s-2 module uses a Mini PCIe interface as its external interface. For details about the module and dimensions, see "Dimensions and Interfaces". Huawei Proprietary and Confidential Issue 0.1 (2014-06-03)
  • Page 11 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Figure 3-1 shows the sequence of pins on the interface of the Mini PCIe Adapter. Figure 3-1 Sequence of Mini PCIe interface Bottom Table 3-1 shows the pin definitions of the Mini PCIe Interface.
  • Page 12 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Type Mini PCI HUAWEI Pin Min. Typ. Max. Express Description Standard Description CLKREQ# Not connected Power source for UIM_PWR UIM_PWR Class C -0.3 1.98...
  • Page 13 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Type Mini PCI HUAWEI Pin Min. Typ. Max. Express Description Standard Description Active-low 1.17 PERn0 Not connected 3.3 V DC supply 3.3Vaux VCC_3V3 input.

  • Page 14: Power Sources And Grounds

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Type Mini PCI HUAWEI Pin Min. Typ. Max. Express Description Standard Description clock -0.3 0.45 LED_WPAN Not connected Reserved PCM_DOUT PCM I/F data 1.35...

  • Page 15: Power Supply Time Sequence

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Table 3-2 Power and ground specifications Pin Name Pin No. Min.(V) Typ .(V) Max..(V) VCC_3V3 2, 24, 39, 41and 52 4, 9, 15, 18, 21, 26, 27, 29,...

  • Page 16: Wake# Signal

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Figure 3-3 Power off timing sequence 3.5 WAKE# Signal WAKE# pin (signal that the module uses to wake up the host) supports software control. This signal is used for 3G module to wake up the host. It is designed as an OC gate, so it should be pulled up by the host and it is active-low.

  • Page 17: Resin_N Signal

    RESIN_N pin should below 50 mV. The MU709s-2 module supports hardware reset function. If the software of the MU709s-2 module stops responding, you can reset the hardware through the RESIN_N signal as shown in Figure 3-6 .

  • Page 18: W_Disable# Signal

    The W_DISABLE# signal is provided to allow users to disable wireless communications of the module. T he software version is planning . 3.8 LED_WWAN# Signal MU709s-2 provides a LED_WWAN# signal to indicate the work status. Table 3-3 State of the LED_WWAN# pin Operating Status LED_WWAN# No service/Restricted service Outputs: low(0.1s)-high (0.1s)-low...

  • Page 19: Usb Interface

    Figure 3-7 Driving circuit 3.9 USB Interface The MU709s-2 module is compliant with USB 2.0 protocol. The USB interface is powered directly from the VBAT supply. The USB input/output lines are compatible with the USB 2.0 signal specifications. Figure 3-8 shows the circuit of the USB interface.

  • Page 20: Usim Card Interface

    Figure 3-8 Recommended circuit of USB interface 3.10 USIM Card Interface 3.10.1 Overview The MU709s-2 module provides a USIM card interface complying with the ISO 7816-3 standard and supports both Class B and Class C USIM cards. Table 3-5 USIM card interface signals...

  • Page 21: Audio Interface

    Ground pin of the ESD protection component is well connected to the power Ground pin that supplies power to the PCIe Adapter. 3.11 Audio Interface The MU709s-2 module provides one PCM digital audio interface. Table 3-6 lists the signals on the digital audio interface. Huawei Proprietary and Confidential Issue 0.1 (2014-06-03)
  • Page 22 0.45 The MU709s-2 module interface enables communication with an external codec to support linear format. Figure 3-10 Circuit diagram of the interface of the PCM (MU709s-2 module is used as PCM master)  PCM_SYNC: Output when PCM is in master mode;...

  • Page 23: Uart Interface

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.12 UART Interface The MU709s-2 module provides one UART interface (2-wire). Table 3-7 lists the signals of the UART interface. The UART has the following features:  Full-duplex ...

  • Page 24: Nc Pins

    The antenna connectors must be used with coaxial cables with characteristic impedance of 50 Ω. 3.14 NC Pins The MU709s-2 module has 17 NC pins. All of NC pins should not be connected. Please keep these pins open. Table 3-8 NC pins Pin No.

  • Page 25: Rf Specifications

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide RF Specifications RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the MU709s-2 module, including:  Operating Frequencies  Conducted RF Measurement  Conducted Rx Sensitivity and Tx Power ...

  • Page 26: Conducted Rf Measurement

    The instrument compensation needs to be set according to the actual cable conditions. 4.3.2 Test Standards Huawei modules meet 3GPP TS 51.010-1 and 3GPP TS 34.121-1 test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed.

  • Page 27: Conducted Transmit Power

    4.4.2 Conducted Transmit Power The conducted transmit power is another indicator that measures the performance of MU709s-2 module. The conducted transmit power refers to the maximum power that the module tested at the antenna connector can transmit. According to the 3GPP protocol, the required transmit power varies with the power class.
  • Page 28  Antenna direction The primary antenna must be placed as near as possible to the MU709s-2 module to minimize the cable length. The diversity antenna needs to be installed perpendicularly to the primary antenna. The diversity antenna can be placed farther away from the MU709s-2 module.
  • Page 29 The gain of an antenna takes both the directivity and the efficiency of the antenna into account. The appropriate antenna gain prolongs the service life of relevant batteries. The following antenna gain is recommended for MU709s-2 module. Gain of the primary/diversity antenna ≤ 2.5 dBi Huawei Proprietary and Confidential Issue 0.1 (2014-06-03)

  • Page 30: Interference

    RF transmission cable into account when measuring any of the preceding antenna indicators.  Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. 4.5.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module.

  • Page 31: Electrical And Reliability Features

     EMC and ESD Features 5.2 Absolute Ratings Table 5-1 lists the absolute ratings for the MU709s-2 module. Using the module beyond these conditions may result in permanent damage to the module. Table 5-1 Absolute ratings for the MU709s-2 module...

  • Page 32: Operating And Storage Temperatures

    –40 Ambient temperature for storage ° C [1]: When the MU709s-2 module works at this temperature, all its RF indexes comply with the 3GPP TS 45.005 and 3GPP TS 34.121-1 specifications. 5.4 Electrical Features of USIM Table 5-3 Electrical features of digital pins in the I/O supply domain of the USIM Interface...

  • Page 33: Power Consumption

    The power consumption listed in this section is tested when the power supply of the MU709s-2 module is 3.3 V, and all of test values are measured at room temperature. Table 5-6 Averaged standby DC power consumption of MU709s-2 module...
  • Page 34 USB is in active. Radio Off All bands Module is powered up. (idle) RF is disabled. USB is in active. Table 5-7 Averaged Data Transmission DC power consumption of MU709s-2 module (HSPA/WCDMA) Description Band Test Value (mA) Power (dBm) Typical WCDMA...
  • Page 35 Description Band Test Value (mA) Power (dBm) Typical (900 MHz) 10 dBm Tx Power 23.5 dBm Tx Power Table 5-8 Averaged DC power consumption of MU709s-2 module(GPRS/EDGE) Description Test Value (mA) Configuration Typical GPRS850 1 Up/1 Down 2 Up/1 Down...
  • Page 36 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Description Test Value (mA) Configuration Typical 4 Up/1 Down EDGE850 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down...

  • Page 37: Reliability Features

    Table 4-3 ; for Max. data throughput, see 2.2 Function Overview, which are listed in Table 2-1 . 5.6 Reliability Features Table 5-9 lists the test conditions and results of the reliability of the MU709s-2 module. Table 5-9 Test conditions and results of the reliability of the MU709s-2 module Item...
  • Page 38 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample size Results Low temperature: –40º Thermal shock  JESD22- 3 pcs/group Visual inspection: A106-B  High temperature: 85º C Function test: TBD ...
  • Page 39 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample size Results Shock test  Half-sine wave shock JESD-B1 3 pcs/group Visual inspection: 04-C  Peak acceleration: 30 Grms Function test: TBD ...

  • Page 40: Emc And Esd Features

    The following are the EMC design comments:  Attention should be paid to static control in the manufacture, assembly, packaging, handling, storage process to reduce electrostatic damage to HUAWEI module.  RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if the antenna port is protected by TVS (Transient Voltage Suppressor), which is resolved by making some adjustment on RF match circuit.
  • Page 41 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features  Resistors in parallel and a 10 nF capacitor should be added on RESIN_N signal to avoid shaking, and the distance between the capacitor and the related pin should be less than 100 mil.
  • Page 42 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features HUAWEI ME709s-2p module does not include any protection against overvoltage. Huawei Proprietary and Confidential Issue 0.1 (2014-06-03) Copyright © Huawei Technologies Co., Ltd.

  • Page 43: Mechanical Specifications

    Label 6.2 Dimensions and Interfaces The dimensions of the MU709s-2 module are 51 mm (length) × 30.4 mm (width) ×3.3 mm (height). Figure 6-1 shows the dimensions of MU709s-2 module in detail. Figure 6-1 shows the appearance of the interfaces on the MU709s-2 module.

  • Page 44: Dimensions Of The Mini Pci Express Connector

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Figure 6-1 Dimensions of the MU709s-2 module 6.3 Dimensions of the Mini PCI Express Connector The Mini PCIe Adapter adopts a standard Mini PCI Express connector that has 52 pins and complies with the...

  • Page 45: Specification Selection For Fasteners

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Figure 6-2 Dimensions of the Mini PCI Express connector 6.4 Specification Selection for Fasteners 6.4.1 Installing the Mini PCIe Adapter on the Main Board To install the Mini PCIe Adapter on the main board, do the following: Step 1 Insert the Mini PCIe Adapter into the Mini PCI Express connector on the main board.
  • Page 46 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Step 3 Use a screwdriver to fix the Mini PCIe Adapter on the main board with two screws provided in the Mini PCIe Adapter packing box. Step 4 Insert the connector of the main antenna into the MAIN antenna interface (M) of the Mini PCIe Adapter according to the indication on the label of the Mini PCIe Adapter.

  • Page 47: Romoving The Mini Pcie Adapter From The Main Board

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications  Insert the antenna connectors vertically into the antenna interfaces of the Mini PCIe Adapter. Do not press or squeeze the antenna cable or damage the connectors. Otherwise, the ...

  • Page 48: Label

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Step 3 Slide backwards the two clips to release the Mini PCIe Adapter from the slot. Then, lift up the Mini PCIe Adapter. 6.5 Label The label is made from fade-resistant, and is able to endure the high temperature of 149°...

  • Page 49: Certifications

    7.1 About This Chapter This chapter gives a general description of certifications of MU709s-2 module. 7.2 Certifications Table 7-1 shows certifications the MU709s-2 module will be implemented. For more demands, please contact us for more details about this information. Table 7-1 Product Certifications...

  • Page 50: Safety Information

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.

  • Page 51: Traffic Security

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Safety Information  Area indicated with the "Power off bi-direction wireless equipment" sign  Area where you are generally suggested to stop the engine of a vehicle 8.4 Traffic Security  Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving.

  • Page 52: Laws And Regulations Observance

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Safety Information 8.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 8.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device.

  • Page 53: Fcc Statement

    Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Huawei Proprietary and Confidential Issue 0.1 (2014-06-03)

  • Page 54: Appendix A Circuit Of Typical Interface

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Hardware Guide Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface Huawei Proprietary and Confidential Issue 0.1 (2014-06-03) Copyright © Huawei Technologies Co., Ltd.

  • Page 55: Appendix B Acronyms And Abbreviations

    HUAWEI MU709s-2p HSPA+ Mini PCIe Module Appendix B Acronyms and Hardware Guide Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP Third Generation Partnership Project Auxiliary China Compulsory Certification European Conformity Coding Scheme Circuit Switched Data Direct Current...
  • Page 56 HUAWEI MU709s-2p HSPA+ Mini PCIe Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Light-Emitting Diode Multi-chip Package Printed Circuit Board Radio Frequency Restriction of the Use of Certain Hazardous RoHS Substances Transient Voltage Suppressor UMTS Universal Mobile Telecommunications System...

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