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Huawei MU509-65 HSDPA Hardware Manual

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HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
Issue
01
Date
2016-04-08

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Summary of Contents for Huawei MU509-65 HSDPA

  • Page 1 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Issue Date 2016-04-08...
  • Page 2 Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.
  • Page 3 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version 2016-04-08 - Initial release Huawei Proprietary and Confidential Issue 01 (2016-04-08) Copyright © Huawei Technologies Co., Ltd.

  • Page 4: Table Of Contents

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Contents Contents 1 Introduction............................ 7 2 Overall Description ........................8 2.1 About This Chapter ........................... 8 2.2 Function Overview ........................... 8 2.3 Circuit Block Diagram ........................9 3 Description of the Application Interfaces ................11 3.1 About This Chapter ..........................
  • Page 5 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Contents 4 RF Specifications ......................... 44 4.1 About This Chapter ......................... 44 4.2 Operating Frequencies ........................44 4.3 Conducted RF Measurement ......................44 4.3.1 Test Environment ........................44 4.3.2 Test Standards ........................45 4.4 Conducted Rx Sensitivity and Tx Power ..................
  • Page 6 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Contents 6.9.3 Removing of the Module......................65 6.9.4 Welding Area Treatment ......................66 6.9.5 Module Installation ......................... 66 6.9.6 Specifications of Rework ....................... 66 7 Certifications ..........................67 7.1 About This Chapter ......................... 67 7.2 Certifications ...........................

  • Page 7: Introduction

    Introduction This document describes the hardware application interfaces and air interfaces that are provided when the HUAWEI MU509-65 HSDPA LGA module (hereinafter referred to as the MU509-65 module) is used. This document helps hardware engineers to understand the interface specifications, electrical features, and related product information of the MU509-65 module.

  • Page 8: Overall Description

    RH5% to RH95% Power Voltage DC 3.3 V to 4.2 V (3.8 V is recommended.) AT Commands See the HUAWEI MU509-65 HSDPA LGA Module AT Command Interface Specification Application UART interface Interfaces One standard USIM (Class B and Class C) interface...

  • Page 9: Circuit Block Diagram

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Overall Description Feature Description USB 2.0 (Full speed) Microphone in Handset out Speaker out Power supply pins POWER_ON_OFF pin RESIN_N pin WAKEUP_IN pin WAKEUP_OUT pin LED_STATUS pin LED_MODE pin GPIO interface JTAG interface...
  • Page 10 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Overall Description Figure 2-1 Circuit block diagram of the MU509-65 module Huawei Proprietary and Confidential Issue 01 (2016-04-08) Copyright © Huawei Technologies Co., Ltd.

  • Page 11: Description Of The Application Interfaces

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter  LGA Interface  Power Interface  Signal Control Interface  UART Interface  USB Interface  USIM Card Interface ...
  • Page 12 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-1 Bottom view of sequence of LGA interface pins 31 32 33 34 35 36 37 38 39 40 41 42 89 90 91 92 93 94 95 96 97 98 99 100...
  • Page 13 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-2 Appearance of the module (Without Label) Table 3-1 Definitions of pins on the LGA interface Min. Typ. Max. Pin Name Description Parameter Comments Type Not connected...
  • Page 14 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Power supply VBAT input Power supply VBAT input Used for JTAG 1.17 interface PS_HOLD assigning a test –0.3 0.63 point for it.
  • Page 15 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Not connected USIM_VCC 1.65 1.95 =1.8 V Power supply for USIM_VCC USIM card USIM_VCC 2.85 =2.85 V VCOIN Coin cell input 3.25...
  • Page 16 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Purpose I/O pin 0.45 1.69 –0.3 0.91 Not connected Ground Do not design NOT USED pad. Ground 2.15 The function of these 0.45...
  • Page 17 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Not connected Not connected Not connected Not connected Not connected Module wakes 2.15 WAKEUP_OUT up the host. 0.45 1.35...
  • Page 18 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type USB Data – USB_DM USB_DP USB Data + 1.17 JTAG test data JTAG_TDI input –0.3 0.63 1.65/ 1.8/ 1.95/ USIM_VCC 2.85...
  • Page 19 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Positive pole of the output of SPKR_OUT_P speaker interface Negative pole of the output of SPKR_OUT_N speaker interface 1.17...
  • Page 20 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Purpose I/O pin of these 0.45 pins has not been 1.69 defined. –0.3 0.91 Ground Not connected Ground Not connected...
  • Page 21 For details, see "Antenna Interface Compatibility Design" in HUAWEI 30 mm x 30 mm LGA Module Hardware Migration Guide. I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates ...

  • Page 22: Power Interface

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces 3.3 Power Interface 3.3.1 Overview The power supply part of the MU509-65 module contains:  VBAT pins for the power supply  VCOIN pin for the standby power supply of the real-time clock (RTC) ...

  • Page 23: Input Power Supply Interface

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces 3.3.2 Input Power Supply Interface VBAT Interface When the MU509-65 module works normally, power is supplied through the VBAT pins and the voltage ranges from 3.3 V to 4.2 V (typical value: 3.8 V). The module provides VBAT pins and GND pins for external power input.

  • Page 24: Output Power Supply Interface

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Table 3-3 Coin cell characteristics Parameter Specifications HB-414 ML-series Nominal voltage Nominal capacity 0.3 mAh 3.4 mAh Continuous standard 5 mA 10 mA load –20° C to +60° C –20°...

  • Page 25: Signal Control Interface

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Pin Name Typ. (V) Typ. (mA) VCC_EXT2 USIM_VCC 1.8/2.85 Through the VCC_EXT1 and VCC_EXT2 interfaces, the MU509-65 module can supply 1.8 V and 2.6 V power externally with an output current of 20 mA (typical value) for external level conversion or other applications.

  • Page 26: Power_On_Off Pin

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type module into sleep or wakes up the –0.3 0.91 module from sleep. Module wakes up 2.15 WAKEUP_OUT the host.
  • Page 27 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-6 Power on timing sequence Table 3-6 Parameters description Parameter Comments Time Unit (Nominal values) POWER_ON_OFF turn on time. 0.5 < T < 1 POWER_ON_OFF Valid to USB D+ high...

  • Page 28: Resin_N Pin

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces 3.4.3 RESIN_N Pin The RESIN_N pin is used to reset the module's system. When the software stops responding, the RESIN_N pin can be pulled down to reset the hardware.

  • Page 29: Led Pin

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces 3.4.4 LED Pin The MU509-65 module provides a network status LED pin: LED_STATUS and LED_MODE pin. The pulse signal output through this pin controls the status LED on the user interface board to display the network status.
  • Page 30 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Blinking Fast Figure 3-11 Status when the indictor blinks fast Blinking Twice Each Time Figure 3-12 Status when the indictor blinks twice each time External Circuits Figure 3-13 shows the recommended circuits of the LED_MODE and LED_STATUS pins.
  • Page 31 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-13 Driving circuit Module VBAT (DCE) LED_MODE LED_STATUS For resistance of R placed on user board, choose the value such that it satisfies the following equation: *R+V...

  • Page 32: Wakeup_In Pin

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-14 LED Typical Electro-Optical Characteristics Curves 3.4.5 WAKEUP_IN Pin The DTE controls the sleep and wakeup status of the MU509-65 module through the WAKEUP_IN pin. The DTE can control the MU509-65 module to enter forced sleep status in following two cases: ...

  • Page 33: Wakeup_Out Pin

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-15 WAKEUP_IN sequence Rising edge Falling edge High WAKEUP_IN Normal status Forced sl eep status Forced sl eep sta the module status Power on Before power on 3.4.6 WAKEUP_OUT Pin...

  • Page 34: Uart Interface

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-17 Connections of the WAKEUP_IN and WAKEUP_OUT pins VCC_EXT2 2.2 kΩ WAKEUP_IN 2.2 kΩ Micro Control Module (DTE) 1 nF (DCE) 2.2 kΩ VCC_EXT 2.2 kΩ WAKEUP_OUT 1 nF 3.5 UART Interface...
  • Page 35 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type 2.15 UART_RING UART ring indicator 0.45 2.15 UART ready for UART_RTS receive 0.45 1.69 UART data terminal...

  • Page 36: Usb Interface

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces It is recommended to set the pins related to UART interface as test points on the DTE board  for debugging. The maximum level of UART interface signals is 2.9 V. If these signals are connected to a ...

  • Page 37: Usim Card Interface

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Since the USB interface of MU509-65 module supports USB 2.0 full speed, the TVS "D102  and D103" in the Figure 3-19 must be parasitic capacitor with small capacitance (RClamp0521P.TCT manufactured by SEMTECH or ESD0P2RF-02LRHE6327...
  • Page 38 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-20 Circuit of the USIM card interface  To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the USIM card socket should be placed near...

  • Page 39: Audio Interface

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces 3.8 Audio Interface 3.8.1 Analogue Audio The MU509-65 provides two audio I/O channels. The two audio I/O channels are completely different and thus have good performance of resisting RF interferences.

  • Page 40: Digital Audio

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-22 Circuit diagram of the interface of the second audio channel ferrite bead SPKR_OUT_P ferrite bead 100 pF SPKR_OUT_N 33 pF 33 pF Speaker Module (DCE) ferrite bead...

  • Page 41: General Purpose I/O Interface

    2.6 V CMOS logic levels. Customers can use AT command to control the state of logic levels of eight channels GPIO output signal, see the HUAWEI MU509-65 HSDPA LGA Module AT Command Interface Specification. Table 3-13 Signals on the GPIO interface Min.

  • Page 42: Rf Antenna Interface

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces protection measures. It is recommended that set the 9 pins related to JTAG interface as test points on the DTE for tracing and debugging. Table 3-14 Signals on the JTAG interface...

  • Page 43: Reserved Pins

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Description of the Application Interfaces 3.12 Reserved Pins The module provides some reserved pins. All reserved pins cannot be used by the customer. All of them should be Not Connected. Table 3-16 Reserved pins Min.

  • Page 44: Rf Specifications

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide RF Specifications RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the MU509-65 module, including:  Operating Frequencies  Conducted RF Measurement  Conducted Rx Sensitivity and Tx Power ...

  • Page 45: Test Standards

    The instrument compensation needs to be set according to the actual cable conditions. 4.3.2 Test Standards Huawei modules meet all 3GPP test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed.

  • Page 46: Antenna Design Requirements

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide RF Specifications 4.5 Antenna Design Requirements 4.5.1 Antenna Design Indicators Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna. The radiated power of an antenna is always lower than the input power due to the following antenna losses: return loss, material loss, and coupling loss.

  • Page 47: Interference

    Use an LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module.

  • Page 48: Electrical And Reliability Features

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features of the interfaces in the MU509-65 module, including:  Absolute Ratings  Operating and Storage Temperatures ...

  • Page 49: Operating And Storage Temperatures

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Electrical and Reliability Features 5.3 Operating and Storage Temperatures Table 5-2 lists the operating and storage temperatures the module. Table 5-2 Operating and storage temperatures for the MU509-65 module Specification Min. Max. Unit –30...

  • Page 50: Power Consumption

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Electrical and Reliability Features Table 5-4 Requirements for input current of the MU509-65 module Power Peak (Maximum) Normal (Maximum) 3.8 V 2750 mA 1100 mA 5.4.2 Power Consumption The power consumptions of MU509-65 in different scenarios are respectively listed in Table 5-5 to Table 5-7 .

  • Page 51: Reliability Features

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Electrical and Reliability Features Table 5-7 Averaged Data Transmission DC power consumption of MU509-65 module (HSDPA/WCDMA) Description Band Test Value (mA) Notes/Configuration Typical WCDMA Band 5 0 dBm Tx Power (850 M) 10 dBm Tx Power 23.5 dBm Tx Power...
  • Page 52 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample Results size Temperature: –40º C  Low-temperature IEC6006 3 pcs/group Visual inspection: ok operating 8-2-1  Operation mode: working Function test: ok with service connected RF specification: ok ...

  • Page 53: Emc And Esd Features

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample Results size  Sine vibration Frequency range: 5 Hz to JESD22- 3 pcs/group Visual inspection: ok 200 Hz B103-B Function test: ok  Acceleration: 1 Grms RF specification: ok ...
  • Page 54 Electrical and Reliability Features  Attention should be paid to static control in the manufacture, assembly, packaging, handling and storage process to reduce electrostatic damage to HUAWEI module.  Radiated Spurious Emission (RSE) may exceed the limit defined by EN301489 if the antenna port is protected by TVS (Transient Voltage Suppressor), which is resolved by making some adjustment on RF match circuit.
  • Page 55  Effective shielding measures must be taken on the ESD sensitive materials that are transported or stored outside the EPA. HUAWEI MU509-65 module does not include any protection against overvoltage. Huawei Proprietary and Confidential Issue 01 (2016-04-08) Copyright © Huawei Technologies Co., Ltd.

  • Page 56: Mechanical Specifications

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the process design and mechanical specifications:  Storage Requirement  Moisture Sensitivity  Dimensions  Packaging  Customer PCB Design  Thermal Design Solution ...

  • Page 57: Dimensions

    Figure 6-1 Dimensions (Unit: mm) Top view Bottom view 6.5 Packaging HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons. The tray specification complies with Jedec_Tray_DGuide4-10D. Huawei Proprietary and Confidential Issue 01 (2016-04-08) Copyright © Huawei Technologies Co., Ltd.
  • Page 58 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Mechanical Specifications Figure 6-2 ESD pallet (Unit: mm) Huawei Proprietary and Confidential Issue 01 (2016-04-08) Copyright © Huawei Technologies Co., Ltd.
  • Page 59 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Mechanical Specifications The following figure shows the packaging. Figure 6-3 The packaging Module quantity per tray: 4 x 9 = 36 pcs/tray Use vacuum packages; five trays per carton; module quantity per carton: 5 x 36 = 180 pcs/carton.

  • Page 60: Customer Pcb Design

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Mechanical Specifications 6.6 Customer PCB Design 6.6.1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel Immersion Gold (ENIG). Organic Solderability Preservative (OSP) may also be used, ENIG preferred. 6.6.2 PCB Pad Design...

  • Page 61: Thermal Design Solution

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Mechanical Specifications with 0.6 mm. The minimum distance between the LGA module and the PCB edge is 0.3 mm.  When the PCB layout is double sided, the LGA module must be placed on the second side for assembly;...
  • Page 62 HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Mechanical Specifications The recommended thermal conductivity of the thermal conductive material is − 1.0 W/m-k or higher (recommended manufacturers: Laird or Bergquist). Conductive material should obey the following rule: after the heat sink is −...

  • Page 63: Assembly Processes

    Figure 6-8 Recommended stencil design of LGA module (Unit: mm) The stencil design has been qualified for HUAWEI main board assembly, customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect.

  • Page 64: Reflow Profile

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Mechanical Specifications 6.8.3 Reflow Profile The LGA module must be reflowed on the top side of customer's development board. For the soldering temperature of the LGA module, see the following figure. Figure 6-9 Reflow profile °...

  • Page 65: Rework

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Mechanical Specifications 6.9 Rework 6.9.1 Process of Rework Component Soldering Component Installation Functional Preparation disassembly area handing installation inspection test Check components Check solder points Select tools Remove Remove debris Verify the obstacles...

  • Page 66: Welding Area Treatment

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Mechanical Specifications 6.9.4 Welding Area Treatment Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the solder. Step 2 Clean the pad and remove the flux residuals.

  • Page 67: Certifications

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Certifications Certifications 7.1 About This Chapter This chapter gives a general description of certifications for MU509-65. 7.2 Certifications Table 7-1 shows certifications the MU509-65 module has been implemented. For more demands, please contact us for more details about this information.

  • Page 68: Safety Information

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 About This Chapter  Interference ...

  • Page 69: Area With Inflammables And Explosives

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Safety Information  Some wireless devices may affect the performance of the hearing aids. For any such problems, consult your service provider.  Pacemaker manufacturers recommend that a minimum distance of 15 cm be maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker.

  • Page 70: Environment Protection

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Safety Information 8.8 Environment Protection Observe the local regulations regarding the disposal of your packaging materials, used wireless device and accessories, and promote their recycling. 8.9 WEEE Approval The wireless device is in compliance with the essential requirements and other relevant provisions of the Waste Electrical and Electronic Equipment Directive 2012/19/EU (WEEE Directive).

  • Page 71: Emergency Call

    Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Huawei Proprietary and Confidential Issue 01 (2016-04-08)

  • Page 72: Appendix A Circuit Of Typical Interface

    HUAWEI MU509-65 HSDPA LGA Module Hardware Guide Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface LGA Interface POWER SUPPLY U101 HPA00615DRVR 5V_P MAIN_ANT C104 **1.8p 10 7 O U T MA IN_ A N T EA R_ O U T _ N...

  • Page 73: Appendix B Acronyms And Abbreviations

    HUAWEI MU509-65 HSDPA LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP Third Generation Partnership Project 8PSK 8 Phase Shift Keying Analog To Digital Converter AMPR Additional Maximum Power Reduction...
  • Page 74 HUAWEI MU509-65 HSDPA LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Data Terminal Equipment Discontinuous Reception Development Kit Envelope Correlation Coefficient EDGE Enhanced Data Rate for GSM Evolution Electronic Industries Association Electromagnetic Compatibility ENIG Electroless Nickel Immersion Gold...
  • Page 75 HUAWEI MU509-65 HSDPA LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Liquid Crystal Polyester Low Dropout Regulator Light Emitting Diode Land Grid Array Low Pass Filter Long Term Evolution Multi Chip Package Modulation and Coding Scheme...
  • Page 76 HUAWEI MU509-65 HSDPA LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion RUIM Removable User Identity Module Receive Surface Acoustic Wave Slot Cycle Index SIMO Single Input Multiple Output Short Message Service Surface Mounting Technology To Be Determined...

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