Package Description - Linear Technology Analog Devices LTC3882-1 Datasheet

LTC3882-1

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/
4.42 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
6.00 ±0.10
(4 SIDES)
PIN 1 TOP MARK
(SEE NOTE 6)
NOTE:
1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
106
UJ Package
40-Lead Plastic QFN (6mm × 6mm)
(Reference LTC DWG # 05-08-1728 Rev Ø)
0.70 ±0.05
4.50 ±0.05
(4 SIDES)
4.42 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
0.75 ±0.05
For more information
for the most recent package drawings.
6.50 ±0.05
5.10 ±0.05
R = 0.115
R = 0.10
TYP
4.42 ±0.10
4.50 REF
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
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TYP
39 40
PIN 1 NOTCH
R = 0.45 OR
0.35 × 45°
CHAMFER
4.42 ±0.10
0.25 ±0.05
0.50 BSC
0.40 ±0.10
1
2
(UJ40) QFN REV Ø 0406
Rev A