Package Description - Linear Technology Analog Devices LT8708 Datasheet

PACKAGE DESCRIPTION

5.50 ±0.05
4.10 ±0.05
PIN 1
TOP MARK
8.00 ±0.10
0.75 ±0.05
15
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES IN DEGREES.
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
COPLANARITY SHALL NOT EXCEED 0.08MM.
3. WARPAGE SHALL NOT EXCEED 0.10MM.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
40-Lead Plastic QFN (5mm × 8mm)
(Reference LTC DWG # 05-08-1528 Rev Ø)
5.85 ±0.10
3.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 ±0.10
DETAIL A
0.20 REF
0.00 – 0.05
21
0.203 ±0.008
For more information
UHG Package
3.10 ±0.10
6.50 REF
7.10 ±0.05
8.50 ±0.05
1.00 TYP
34
33 33
0.75 TYP
× 4
5.85 ±0.10
0.675
22 22
REF
21
0.55
1.00 TYP
REF
BOTTOM VIEW—EXPOSED PAD
DETAIL A
0.203 +0.058, –0.008
TERMINAL THICKNESS
0.00 – 0.05
4. PACKAGE LENGTH / PACKAGE WIDTH ARE CONSIDERED AS SPECIAL CHARACTERISTIC(S).
5. REFER JEDEC M0-220.
www.analog.com
LT8708
0.70 ±0.05
PACKAGE
OUTLINE
C 0.35
40
0.40 ±0.05
1
0.25 ±0.05
0.50 BSC
3.10 ±0.10
14
DETAIL B
15
(UHG) QFN 0116 REV Ø
R = 0.125
TYP
DETAIL B
0.08 REF
0.31 REF
Rev 0
63