Package Description - Linear Technology Analog Devices LT8607B Datasheet

PACKAGE DESCRIPTION

(.074 ±.004)
5.10
(.201)
MIN
0.305 ± 0.038
(.0120 ±.0015)
TYP
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
GAUGE PLANE
0.18
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev I)
1.88 ±0.102
0.889 ±0.127
(.035 ±.005)
1.68 ±0.102 3.20 – 3.45
(.066 ±.004) (.126 – .136)
0.50
(.0197)
BSC
DETAIL "A"
0° – 6° TYP
0.53 ±0.152
(.021 ±.006)
DETAIL "A"
SEATING
PLANE
For more information
MSE Package
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.88
(.074)
1
DETAIL "B"
10
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
10 9 8 7 6
4.90 ±0.152
(.193 ±.006)
1 2 3 4 5
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
0.50
TYP
(.0197)
BSC
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LT8607/LT8607B
0.29
REF
1.68
(.066)
0.05 REF
DETAIL "B"
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.497 ±0.076
(.0196 ±.003)
REF
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
0.86
(.034)
REF
0.1016 ±0.0508
(.004 ±.002)
MSOP (MSE) 0213 REV I
Rev. C
19