Appendix B. Bill Of Materials (Bom); Bill Of Materials - Microchip Technology DIGITAL POWER User Manual

Appendix B. Bill of Materials (BOM)

This appendix contains the Bill of Materials (BOM) for the Digital Power Development
Board.
•

Bill of Materials

B.1 BILL OF MATERIALS
Table B-1
TABLE B-1: DIGITAL POWER DEV. BOARD BILL OF MATERIALS (BOM)
Qty. Designator
2 C1, C11 Capacitor, Ceramic, 10 µF, 16V,
20%, X7R, SMD, 0805
1 C2 Capacitor Aluminum, 33 µF,
10V, 20%, SMD, B
3 C3, C9, C10 Capacitor Ceramic, 1 µF, 50V,
10%, X7R, SMD, 0603
2 C4, C6 Capacitor Ceramic, 0.01 µF,
100V, 10%, X7R, SMD, 0603
3 C5, C7, C8 Capacitor, Aluminum, 10 µF,
16V, 20%, SMD, A
2 D1, D2 Diode, Rectifier, 1N4148,
855 mV, 300 mA, 75V, SOD-323
1 J1 Connector, Edge, MECF,
1.27 mm, 60P, Female, SMD,
Vertical
1 J2 Connector, USB 2.0, micro-B,
Female, TH/SMD, R/A
4 J3, J4, J5, J6 Connector Header-2.54, Male,
1x20, Gold, 5.84 MH, TH,
Vertical
1 J7 Connector, RF, Coaxial, BNC,
Female, 2P, TH, RA
1 J8 Connector Header-2.54, Male,
1x36, Gold, 5.84 MH, TH
1 J9 Connector, Modular, RJ25, TH,
R/A
2 J10 Socket, mikroBUS™, Host, DIP,
16, TH
1 J11 Connector Header-2.54, Male,
1x6, Gold, 5.84 MH, TH, R/A
1 L1 Inductor, 1 µH, 2.1A, 30%, SMD,
L3W3H1.5
1 LD1 Diode, LED, Green, 2V, 30 mA,
35 mcd, Clear, SMD, 0603
 2018 Microchip Technology Inc.
DIGITAL POWER DEVELOPMENT
shows the Bill of Materials for the Digital Power Development Board.
Description
BOARD USER'S GUIDE
Manufacturer
Taiyo Yuden Co., Ltd.
®
Panasonic - ECG
Taiyo Yuden Co., Ltd.
TDK Corporation
Nichicon Corporation
®
Diodes Incorporated
Samtec, Inc.
FCI
Samtec, Inc.
Amphenol Commercial
Sullins Connector
Solutions
Tyco Electronics (TE
Connectivity Ltd.)
Sullins Connector
Solutions
FCI
Taiyo Yuden Co., Ltd.
®
Lite-On , Inc.
Manufacturer Part Number
EMK212BB7106MG-T
EEE-1AA330WR
UMK107AB7105KA-T
C1608X7R2A103K080AA
UWX1C100MCL2GB
1N4148WS-7-F
MECF-30-01-L-DV-WT
10118194-0001LF
TSW-120-07-G-S
31-5431-2010
PBC36SAAN
5555165-1
PPTC081LFBN-RC
68016-106HLF
NR3015T1R0N
LTST-C190KGKT
DS50002814A-page 19