Thermal Design - Seco SBC-A62-J User Manual

Single board computer with nxp i.mx6 processor

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4.1 Thermal Design

Highly integrated systems, like the SBC-A62-J board, offer the user excellent performance in a much reduced space, therefore allowing the system's minimization.

On the other hand, the miniaturizing of IC's and the increase of clock frequencies of the processors lead to the generation of a big amount of heat that must be

dissipated to prevent critical operating conditions, system hang-off or failures.

It is extremely important to note that, for this reason, a critical design parameter always to be kept in very high consideration is the thermal design and analysis of

the final assembled system. It is necessary to carefully consider the heat generated by the module in the final assembled system and the application.

The customer must always ensure that the heatspreader/heatsink surface temperature remain within the declared operating tempe rature range at any

point of the cooling element.

SECO can provide the customer with SBC-A62-J specific passive heatsinks, which can be useful during the phase of development, in a laboratory, in free - air

conditions or just for software development and system tuning.

Please always keep in mind that heavy computational tasks will generate much heat, on all versions of the processor.

Therefore, it is always necessary that the customer studies and develops a specifically tailored cooling solution for the final system by evaluating processor's

workload, application environment, system enclosure, air flow and so on. Please remember that the use of SECO heat-dissipation components must be accurately

evaluated within the final system and that they should be part of a more comprehensive ad-hoc cooling solution.

Please contact SECO for ordering part numbers.

SBC-A62-J

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