Tektronix 2215 Instruction Manual page 5

Z-Axis A m p lifie r................................. 3-22
H O R IZ O N T A L ......................................... 3-23
Sweep S w itc h in g ................................. 3-24
H orizontal P re a m p lifie r....................3-24
X V A m p lifie r ...................................... 3-24
H orizontal O u tp u t A m p lifie r. . . . 3-24
POWER S U P P L Y ....................................3-25
Power In p u t......................................... 3-25
P reregulator......................................... 3-25
In v e rte r................................................. 3-26
CRT S u p p ly ......................................... 3-27
A u to Focus C ir c u it ............................3-27
Low-Voltage Supplies......................... 3-27
DC R estorer......................................... 3-27
SECTION 4 PERFORMANCE CHECK
PROCEDURE
IN T R O D U C T IO N ...................................... 4-1
PU R P O S E .............................................. 4-1
TEST EQUIPM ENT REQ UIRED . . .
LIM IT S A N D T O L E R A N C E S ...........4-1
P R E P A R A T IO N ................................... 4-1
IN D EX TO PERFORMANCE
CHECK STEPS...................................... 4-3
V E R T IC A L .................................................4-4
H O R IZ O N T A L ............................................4-6
T R IG G E R IN G ............................................4-9
E X T E R N A L Z -A X IS A ND
PROBE A DJU ST.........................................4-12
D IS P L A Y ...........................
V E R T IC A L ........................
H O R IZ O N T A L ...................
T R IG G E R IN G ...................
E X T E R N A L Z -A X IS A ND
PROBE A D JU S T................
SECTION 6 MAINTENANCE
S TA TIC -SENSITIVE COMPONENTS .
P R E V EN TIV E M A IN T E N A N C E ____
T R O U B LE S H O O T IN G ...........................
4-1
C O R RECTIVE M A IN T E N A N C E
IN T R O D U C T IO N ..............................
G E N E R A L C A R E ..............................
INSPECTION A N D C LE A N IN G . .
L U B R IC A T IO N .................................
SEMICONDUCTOR CHECKS . . . .
PERIO DIC R EAD JU STM EN T. . . .
IN T R O D U C T IO N ..............................
TR O U BLESH O O TIN G A I D S ____
TRO UBLESH O O TIN G
E Q U IP M E N T ......................................
TRO UBLESH O O TIN G
TECHNIQUES ....................................
IN T R O D U C T IO N ..............................
M A IN T E N A N C E PRECAUTIONS .
O B T A IN IN G R EPLACEM ENT
P A R T S .................................................
M A IN T E N A N C E A I D S ...................
IN T E R C O N N E C T IO N S ...................