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Summary of Contents for Infineon HybridPACK 2
- Page 1 Application Note AN 2010-08 V2.0, August 2010 HybridPACK™ 2 General Information and Mounting Instruction IFAG ATV OPEV...
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Page 2: Application Note An
Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life- support device or system, or to affect the safety or effectiveness of that device or system. -
Page 3: Table Of Contents
N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Table of Contents Introduction ...........................4 Proposal for Designing a Driver Board ..................4 Mounting a Driver Board onto the Module .................6 Application of the Liquid Cooling System .................9 Screws to Mount the Module to the Heat Sink.................12 Mounting the Module to the Heat Sink ..................13 Connecting the Bus Bars to the Power Terminals ..............14 Connecting the Power Terminals with Ideal Strain Relief ............15... -
Page 4: Introduction
N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Introduction The operation of high power modules results in power losses, which have to be dissipated via a heat sink so that the maximum permissible temperature specified in the data sheet will not be exceeded. - Page 5 N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Figure 1 Proposal for designing a driver board for HybridPACK™ 2 module.
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Page 6: Mounting A Driver Board Onto The Module
N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Mounting a Driver Board onto the Module The driver board could be mounted in two ways: through connectors (strongly recommended) or alternative directly soldering on the top of the module. When a driver board or module adapter board (PCB) is soldered directly on top of the module, the contact joints (=solder connections) between PCB and module auxiliary contacts should be mechanically relieved as much as possible. - Page 7 N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 The HybridPACK™ 2 offers two guidance holes marked on the Figure 2 with the colour blue. These guidance holes offer assistance by mounting the PCB on the module and allow automated assembly.
- Page 8 N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Figure 4 Technical drawing of the HybridPACK 2 auxiliary terminals (pin connectors). The picture above shows the dimension and the structure of the auxiliary terminals. Due to the specific requirements of the JST connector the auxiliary terminals have the following properties: •...
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Page 9: Application Of The Liquid Cooling System
N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Application of the Liquid Cooling System The power loss occurring in the module has to be dissipated in order not to exceed the maximum permissible temperature specified in the datasheet during switching (T = 150 vj_op °C) in operation. - Page 10 N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Figure 6 “X”- section Detail drawing of the HybridPACK 2 bottom side. The sealing surface corresponds to the O-ring holding groove. The suggested dimension of the tray holding the pin fin array is depicted in Figure 7a with specified tolerances.
- Page 11 N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Figure 7 A design example of fluid cooling system.
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Page 12: Screws To Mount The Module To The Heat Sink
N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 PLEASE NOTE. The heat sink design should be done in such manner in which the cooling fluid has reduced bypass possibility. The figure below presents the cross section view of HybridPACK 2 module and the heat sink. -
Page 13: Mounting The Module To The Heat Sink
N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Mounting the Module to the Heat Sink The clamping force of the module resulting from the assembly process to the heat sink depends on the torque applied and the condition of the heat sink material. The following torque values specified in the datasheet result from steel screws in aluminium heat sinks with a dry M6 thread and their typical friction factors of µ... -
Page 14: Connecting The Bus Bars To The Power Terminals
N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Connecting the Bus Bars to the Power Terminals The DC power side should be connected with a laminated DC bus bar in order to keep the switching overvoltage as low as possible by minimising the stray inductance. Adherence to the maximum permissible voltage at the power terminals and at the IGBT chip is to be assured according to the RBSOA data in the datasheet. -
Page 15: Connecting The Power Terminals With Ideal Strain Relief
N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Connecting the Power Terminals with Ideal Strain Relief To connect the power terminals with the best possible strain relief, a recommended assembly schematic is shown in Figure 11, in which a bus bar is connected to the power terminals in such a way that only a low force is applied to them, even during shock or vibration conditions. -
Page 16: Storage And Transport
N 2010-03 Application Note AN 2010-08 r 2009 V2.0, August 2010 Storage and Transport Storage of the module at the temperature limitations specified in the datasheet is possible but not recommended. The recommended storage conditions according to IEC60721-3-1, class 1K2 should be assured for the recommended storage time of max. -
Page 17: Data Matrix (Dmx) Part Marking
2009 V2.0, August 2010 Data Matrix (DMX) Part Marking Infineon Technologies as a part of the electronic industry is making gains by using Data Matrix part marking to transform the way of tracing HybridPACK products, both through the manufacturing process, and throughout the entire life of that product or component. Total traceability means dramatic improvements to process and quality control.
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