Stm32Cubef2 Architecture Overview; Figure 2. Firmware Architecture - ST STM32F2 Series User Manual

STM32CubeF2 architecture overview

2 STM32CubeF2 architecture overview
The STM32Cube firmware solution is built around three independent levels that can easily
interact with each other as described in
Level 0: this level is divided into three sub-layers:

Board Support Package (BSP): this layer offers a set of APIs related to the hardware
components in the hardware boards (for example Audio codec, IO expander,
Touchscreen, SRAM driver, LCD drivers) and composed of two parts:
–
–
BSP is based on a modular architecture that allows it to be ported easily to any
hardware by just implementing the low-level routines.

Hardware Abstraction Layer (HAL): this layer provides the low-level drivers and the
hardware interfacing methods to interact with the upper layers (application, libraries
and stacks). It provides a generic, multi instance and function-oriented APIs which
allow to offload the user application implementation by providing ready-to-use
processes. As an example, for the communication peripherals (I2S, UART...) it
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Figure 2. Firmware architecture

Component: the driver related to the external device on the board and not related
to the STM32, the component driver provide specific APIs to the BSP driver
external components and can be ported on any other board.
BSP driver: it enables the component driver to be linked to a specific board and
provides a set of user-friendly APIs. The API naming rule is
BSP_FUNCT_Action(), for example BSP_LED_Init(),BSP_LED_On().
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Figure 2.
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