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Telit Wireless Solutions HE910-EUG V2 Hardware User's Manual
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Telit Wireless Solutions HE910-EUG V2 Hardware User's Manual

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Summary of Contents for Telit Wireless Solutions HE910-EUG V2

  • Page 3 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable.
  • Page 4 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials.
  • Page 5 Contents 4.2.2. Hardware Shutdown...
  • Page 9 The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910-EU/EUG V2 HE910-NA/NAG V2 module. All the features and solutions detailed are applicable to all HE910 V2, whereas “HE910 V2” is intended the modules listed in the applicability table.
  • Page 10 This document contains the following chapters: Chapter 1: “Introduction” provides a scope for this document, target audience, contact and support information, and text conventions. Chapter 2: “General Product Description” gives an overview of the features of the product. Chapter 3: “HE910 V2 Module Connections” deals with the pin out configuration and layout.
  • Page 11 Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module. If these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information –...
  • Page 12 The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE10 V2 module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced.
  • Page 13 (Mbps) bands(MHz) Quad-band EMEA/APAC/Latin American markets ■ ■ ■ HE910-EU V2 5.76 14.4 900, 2100 ■ ■ ■ ■ HE910-EUG V2 5.76 14.4 900, 2100 North American markets ■ ■ ■ HE910-NA V2 5.76 14.4 850, 1900 ■ ■ ■...
  • Page 14 –40°C ~ +85°C Operating Temperature Range Storage and non-operating –40°C ~ +90°C Temperature Range As a part of Telit’s corporate policy of environmental protection, the HE910 V2 complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU).
  • Page 15 The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA modes are conformed to the 3GPP specifications. Mode Freq. TX (MHz) Freq. RX (MHz) Channels TX - RX offset GSM850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz 890.0 ~ 914.8 935.0 ~ 959.8 0 ~ 124...
  • Page 16 Signal Function Type USB HS 2.0 Communication Port USB_D+ USB differential Data(+) USB_D- USB differential Data(-) VBUS Power sense for the internal USB transceiver Asynchronous UART – Prog. / data +HW Flow Control C103/TXD Serial data input from DTE CMOS 1.8V C104/RXD Serial data output to DTE CMOS 1.8V...
  • Page 17 Signal Function Type RF Section ANTENNA CDMA Antenna (50Ohm) GPS Section ANT_GPS GPS Antenna (50Ohm) GPS_LNA_EN Output enable for External LNA supply CMOS 1.8V Miscellaneous Function CMOS 1.8V HW_SHUTDOWN* Hardware unconditional shutdown Open collector CMOS 1.8V ON_OFF* Input Command for Power ON/Software shutdown Open collector VRTC VRTC Backup Capacitor...
  • Page 18 Signal Function Type Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved...
  • Page 19 WARNING: Reserved pins must not be connected. NOTE: The following table is listing the main Pinout differences between the HE910 V2 variants. Product Notes HE910-EUG V2 HE910-EU V2 Reserved pads: R7, R9 HE910-NAG V2 HE910-NA V2 Reserved pads: R7, R9...
  • Page 20 NOTE: DTR pin must be connected in order to enter HE910 V2’s power saving mode. RI pin must be connected in order to wake up the host when a call is coming in sleep mode of host. NOTE: Almost all pins not in use must be left disconnected. The only exceptions are the following pins: Signal M1,M2,N1,N2,P1,P2...
  • Page 21 NOTE: The pin defined as must be considered RESERVED and not connected on any pin in the application. The related area on the application has to be kept empty.
  • Page 22 NOTE: The pin defined as must be considered RESERVED and not connected on any pin in the application. The related area on the application has to be kept empty.
  • Page 23 To turn on the HE910 V2, the pad ON_OFF* must be tied low for at least 1 second and then released. The maximum current that can be drained from the ON_OFF* pad is 0.1 mA. A simple circuit to power on the module is illustrated below: Upon turning on HE910 V2 module, the HE910 V2 module is not active yet because the boot sequence of HE910 V2 is still executing internally.
  • Page 24 During the Initialization state, any kind of AT-command is not available. DTE must wait for the Activation state to communicate with HE910 V2. To check if the HE910 V2 has powered on, the hardware line PWRMON must be monitored. When PWRMON goes high, the module has powered on. NOTE: Do not use any pull up resistor on the ON_OFF* line.
  • Page 25 2. To drive the ON_OFF* pad directly with an ON/OFF button: Turning off the device can be done in two ways:  By software command (see HE910 V2 Software User Guide)  By hardware shutdown (pad ON_OFF*) When the device is shut down by software command or by hardware shutdown, it issues a detach request to the network that informs the network that the device will no longer be reachable.
  • Page 26 The following flow chart shows the proper turnoff procedure: The HE910 V2 can be shut down by a software command. When a shutdown command is sent, the HE910 V2 goes into the finalization state and will shut down PWRMON at the end of this state. The period of the finalization state can vary according to the state of the HE910 V2 so it cannot be fixed definitely.
  • Page 27 TIP: To check if the device has powered off hardware line PWRMON must be monitored. When PWRMON goes low, the device has powered off. 4.2.2. Hardware Shutdown To turn OFF the HE910 V2 the pad ON_OFF* must be tied low for at least 2 seconds and then released.
  • Page 28 WARNING: The Hardware Reset must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure to be done in the rare case that the device gets stuck waiting for some network. To unconditionally shutdown the HE910 V2, the pad HW_SHUTDOWN* must be tied low for at least 200 milliseconds and then released.
  • Page 29 For example: To drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2): The chart below describes the overall sequences for turning the module ON and OFF.
  • Page 30 The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product’s overall performance. Read carefully the requirements and the guidelines that follow for a proper design. The external power supply must be connected to VBATT & VBATT_PA signals and must fulfill the following requirements: Power Supply 3.8V...
  • Page 31 Mode Average(mA) Mode Description GSM TX and RX mode Operating mode GSM850/GSM900, class33 GPRS 4TX/2RX DCS1800/PCS1900, class33 GSM850/GSM900, class33 EDGE 4TX/2RX DCS1800/PCS1900, class33 GSM peak current 1800 (*1) The off current is the total supply current from the main battery with the PMIC off and the 32 kHz XTAL oscillator on.
  • Page 32 The principal guidelines for the Power Supply Design embrace three different design steps:  the electrical design  the thermal design  the PCB layout The electrical design of the power supply depends strongly on the power source where this power is drained.
  • Page 33 An example of a linear regulator with 5V input:  The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and must not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by HE910 ...
  • Page 34  A protection diode must be inserted close to the power input, in order to save HE910 V2 from power polarity inversion. This can be the same diode as for spike protection. An example of switching regulator with 12V input is in the schematic below: The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V.
  • Page 35  A protection diode must be inserted close to the power input, in order to save HE910 V2 from power polarity inversion. Otherwise the battery connector must be done in a way to avoid polarity inversions when connecting the battery. ...
  • Page 36 conducted to the ground plane under the HE910 V2; you must ensure that your application can dissipate heat. In the WCDMA/HSPA mode, since HE910 V2 emits RF signals continuously during transmission, you must pay special attention how to dissipate the heat generated. The current consumption will be up to about 640mA in HSPA (630mA in WCDMA) continuously at the maximum TX output power (23dBm).
  • Page 37  The PCB traces connecting the Switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (usually 100-500 kHz).
  • Page 38 The antenna connection and board layout design are the most important parts in the full product design and they strongly reflect on the product’s overall performances. Read carefully and follow the requirements and the guidelines for a proper design. The antenna for a Telit HE910 V2 device must fulfill the following requirements: GSM / WCDMA Antenna Requirements Frequency Depending by frequency band(s) provided by the network operator, the...
  • Page 39 Furthermore if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application. In order to re-use the Telit FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.
  • Page 40  Install the antenna in a place covered by the GSM/WCDMA signal.  The Antenna shall be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter;...
  • Page 41 Depending on the characteristics and requirements unique to the customer’s designs, the use of an external LNA or an external active antenna may be required to achieve best performance. The optional external LNA should be dimensioned to avoid an excessive LNA gain that can introduce jamming, spurious, degrade IIP3, and saturate the receiver.
  • Page 42 The external active antenna for the Telit HE910 V2 device must fulfill the following requirements: ACTIVE GPS/GNSS Antenna Requirements GNSS(GPS L1 & GLONASS) : 1565 MHz ~ 1606 MHz GPS L1 : 1575.42MHz Frequency range GLONASS : 1597.55 – 1605.89MHz GPS L1 : +/- 1.023MHz Bandwidth GLONASS : 8.34MHz...
  • Page 43 This line of transmission shall fulfill the following requirements: Antenna Line on PCB Requirements 50Ohm Characteristic Impedance Max Attenuation 0.3dB Coupling with other signals shall be avoided Cold End (Ground Plane) of antenna shall be equipotential to the HE910 V2 ground pads Furthermore if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC requirements.
  • Page 44 The HE910 V2 module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480Mbits/sec). It is compliant with the USB 2.0 specification and can be used for diagnostic monitoring, control and data transfers. The table below describes the USB interface signals: Signal Function Type...
  • Page 45 The serial ports on the Telit HE910 V2 are the interface between the module and OEM hardware. 2 serial ports are available on the module:  Modem Serial Port 1 (Main)  Modem Serial Port 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware. The most common are: ...
  • Page 46 Serial port 1 on the HE910 V2 is a +1.8V UART with all 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Signal Function Type DCD - dcd_uart Data Carrier Detect 1.8V RXD - Tx_uart Transmit line *see Note 1.8V...
  • Page 47 WARNING: Consider a mechanical design and a low-capacitance ESD protection device to protect HE910 V2 or customer specific requirements from ESD event to UART port (M15, N15, P15 and L14). Serial port 2 on the HE910 V2 is a +1.8V UART with only the RX and TX signals. The signals of the HE910 V2 serial port are: Signal Function...
  • Page 48 level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator.
  • Page 49 The RS232 serial port lines are usually connected to a DB9 connector with the following layout:...
  • Page 50 The HE910 V2 module doesn’t support an analog audio interface and supports one Digital Audio bus. In order to develop an application including an Analog Audio it is necessary to add a dedicated CODEC on the Application design. For further information, please refer to the “Digital Voice Interface Application Note”. The product is providing one Digital Audio Interface (DVI) on the following Pins: Signal Function...
  • Page 51 The general-purpose I/O pads can be configured to act in three different ways:  Input  Output  Alternate function (internally controlled) Input pads can only be read and report the digital value (high or low) present on the pad at the read time.
  • Page 52 Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the HE910 V2 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.3V Operating Range - Interface levels (1.8V CMOS)
  • Page 53 The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device is connected with the GPIO input, the pad has interface levels different from the 1.8V CMOS.
  • Page 54 The Temperature Monitor is a function of the module that permits control of its internal temperature and if properly set (see the #TEMPMON command on AT Interface guide) raises to High Logic level a GPIO when the maximum temperature is reached. The STAT_LED pin status shows information on the network service availability and Call status.
  • Page 55 The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing only RTC to be active when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery.

  • Page 56: Power Saving

    The HE910 V2 module provides a Digital to Analog Converter. The signal (named DAC_OUT) is available on pin C13 of the HE910 V2 module and on pin 6 of PL302 on Interface Board (CS1467D). The on board DAC is in the range from 0 to 1023. However, an external low-pass filter is necessary.
  • Page 57 The on board ADC is 8-bit converter. It is able to read a voltage level in the range of 0 ~ 1.2 volts applied on the ADC pin input and store and convert it into 8 bit word. Parameter Units Input Voltage range Volt bits...
  • Page 58 The HE910 V2 has been designed in order to be compliant with a standard lead-free SMT process. Top view Bottom view (Dimensions in mm)
  • Page 59 144 pins < Top View > In order to easily rework the HE910 V2 it is suggested to consider having a 1.5 mm placement inhibit area around the module on the application. It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.
  • Page 60 Stencil’s apertures layout can be the same as the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm. Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
  • Page 61 The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm)
  • Page 62 It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself (see following figure). Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB Pad Surfaces: Finish Layer thickness (um)
  • Page 63 Lead free Sn/Ag/Cu Solder Paste We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly. Recommended solder reflow profile:...
  • Page 64 Profile Feature Pb-Free Assembly Average ramp-up rate(T to T 3℃/second max Preheat 150℃ Temperature Min(Tsmin) Temperature Max(Tsmax) 200℃ Time (min to max) (ts) 60 - 180 seconds Tsmax to TL Ramp-up Rate 3℃/second max Time maintained above: Temperature (TL) 217℃ Time(tL) 60 - 150 seconds Peak Temperature (Tp)
  • Page 65 The HE910 V2 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling. WARNING: These trays can withstand a maximum temperature of 65℃.
  • Page 67 The HE910 V2 is a Moisture Sensitive Device level 3, in accordance with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5.
  • Page 68 To test and debug the mounting of HE910 V2, we strongly recommend foreseeing test pads on the host PCB, in order to check the connection between the HE910 V2 itself and the application and to test the performance of the module connecting it with an external computer. Depending on the customer application, these pads include, but are not limited to the following signals: ...
  • Page 69 When a sudden voltage is asserted to or cut from the power supplies, The steep transition makes some reactions such as the overshoot and undershoot. This abrupt voltage transition can affect the device not to work or make it malfunction. The bypass capacitors are needed to alleviate this behavior and it can be affected differently according to the various applications.
  • Page 70 The resistor value on SIMIO pulled up to SIMVCC should be defined accordingly in order to be compliant to 3GPP specification. For HE910-EUG V2/NAG V2/EU V2/NA V2 contain an internal pull-up resistor on SIMIO. However, the un-mounted option in application design can be recommended in order to tune R1 if necessary.
  • Page 71  Telit_SIM_Integration_Design_Guide_Application_Note...
  • Page 72 One of the following options should be chosen in the design of host system in order to download or upgrade the Telit’s software and debug HE910 V2 when HE910 V2 is already mounted on a host system. Users who use both of UART and USB interfaces to communicate HE910 V2 Must implement a download method in a host system for upgrading HE910 V2 when it’s mounted.
  • Page 73 The HE910-EU V2 and HE910-EUG V2 modules have been assessed in order to satisfy the essential requirements of the R&TTE Directive 1999/05/EC (Radio Equipment & Telecommunications Terminal Equipments) to demonstrate the conformity against the harmonized standards with the final involvement of a Notified Body.
  • Page 74 The full declaration of conformity can be found on the following address: http://www.telit.com There is no restriction for the commercialization of the HE910-EU V2 and HE910-EUG V2 modules in all the countries of the European Union. Final product integrating this module must be assessed against essential requirements of the 1999/5/EC (R&TTE) Directive.
  • Page 75 Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
  • Page 76 FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.

  • Page 77: Read Carefully

    READ CAREFULLY Be sure about that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:  Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc.
  • Page 78 Revision Date Changes 2013-05-14 First issue 2013-11-08 Updated 6.1 GSM/WCDMA Antenna Requirements Updated 8.1 Modem Serial Port 1 Updated 10.5 Indication of Network Service Availability Updated 14.3 SIM Interface Updated 15 Conformity Assessment Issues 2013-11-27 Updated 2.5 Environmental requirements Updated 6.1 GSM/WCDMA Antenna Requirements Updated 15.2 FCC/IC Regulatory notices...

This manual is also suitable for:

He910-eu v2He910-na v2He910-nag v2