Telit Wireless Solutions GL865-DUAL V3 Hardware User's Manual
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Telit Wireless Solutions GL865-DUAL V3 Hardware User's Manual

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GL865-DUAL V3 Hardware User Guide
1vv0301018 Rev.5 – 2013-08-05

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Summary of Contents for Telit Wireless Solutions GL865-DUAL V3

  • Page 1 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05...
  • Page 2 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 APPLICABILITY TABLE PRODUCT GL865-DUAL V3 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 2 of 76 Mod. 0805 2011-07 Rev.2...
  • Page 3 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein.
  • Page 4 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

  • Page 5: Table Of Contents

    Antenna ........................ 31 7.1. GSM Antenna Requirements ..................31 7.1.1. GL865-DUAL V3 Antenna – PCB line Guidelines ............. 31 7.2. PCB Design Guidelines ....................33 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 5 of 76...
  • Page 6 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 7.2.1. Transmission line design ....................33 7.2.2. Transmission line measurements ..................34 7.3. GSM Antenna - Installation Guidelines................36 Logic level specifications ..................37 8.1. Reset signal ........................38 Serial Ports ......................39 9.1.
  • Page 7 12.2. ADC Converter ......................60 12.2.1. Description ........................60 12.2.2. Using ADC Converter....................... 60 Mounting the GL865-DUAL V3 on your Board ............61 General ........................61 13.1. 13.2. Module finishing & dimensions ................. 61 13.3. Recommended foot print for the application ............... 62 Stencil ........................

  • Page 8: Vv0301018 Rev.5 – 2013

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 8 of 76 Mod. 0805 2011-07 Rev.2...

  • Page 9: Introduction

    1.1. Scope The aim of this document is the description of some hardware solutions useful for developing a product with the Telit GL865-DUAL V3 module. 1.2. Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our GL865-DUAL V3 modules.

  • Page 10: Document Organization

    Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic levels for this module. Chapter 9: “Serial ports” The serial port on the Telit GL865-DUAL V3 is the core of the interface between the module and OEM hardware Chapter 10: “Audio Section overview”...

  • Page 11: Text Conventions

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 1.5. Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

  • Page 12: Overview

    Telit GL865-DUAL V3 module. For further hardware details that may not be explained in this document refer to the Telit GL865-DUAL V3 Product Description document where all the hardware information is reported.

  • Page 13: Gl865-Dual V3 Mechanical Dimensions

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 GL865-DUAL V3 Mechanical Dimensions The GL865-DUAL V3 overall dimensions are: • Length: 24.4 mm • Width: 24.4 mm • Thickness: 2.6 mm • Weight 2.8 g Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.

  • Page 14: Gl865-Dual V3 Module Connections

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 GL865-DUAL V3 module connections 4.1. PIN-OUT Signal Function Note Type Audio EAR- Earphone signal output, phase - Audio EAR+ Earphone signal output, phase + Audio MIC- Mic. signal input; phase- Audio MIC+ Mic.
  • Page 15 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Signal Function Note Type GPIO GPIO01 Configurable GPIO GPIO_01 / DVI_WA0 CMOS 1.8V / Digital Audio Interface (WA0) GPIO02 I/O pin GPIO_02 / JDR / / Jammer Detect Report CMOS 1.8V...
  • Page 16 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 NOTE: If not used, almost all pins should be left disconnected. The only exceptions are the following pins: signal 38, 37 VBATT & VBATT_PA 32, 33, 35, 36, 46 AGND V_AUX / PWRMON...

  • Page 17: Pin Layout

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 4.2. Pin Layout TOP VIEW NOTE: The pins defined as NC/RFU shall be considered RESERVED and must not be connected to any pin in the application. Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.

  • Page 18: Hardware Commands

    5.1. Auto-Turning ON the GL865-DUAL V3 To Auto-turn on the GL865-DUAL V3, the power supply must be applied on the power pins VBATT and VBATT_PA, after 1000 m-seconds, the V_AUX / PWRMON pin will be at the high logic level and the module can be considered fully operating.
  • Page 19 NOTE: In order to prevent a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the GL865-DUAL V3 when the module is powered OFF or during an ON/OFF transition.

  • Page 20: Turning Off The Gl865-Dual V3

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 5.2. Turning OFF the GL865-DUAL V3 Turning off of the device can be done in two ways: • General turn OFF • Processor turn OFF General turn OFF – disconnect the power supply from the both power pins VBATT and VBATT_PA at the same time.
  • Page 21 NOTE: In order to prevent a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the GL865-DUAL V3 when the module is powered off or during an ON/OFF transition.

  • Page 22: Resetting The Gl865-Dual V3

    Do not use any pull up resistor on the RESET* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the GL865-DUAL V3 power regulator and improper functioning of the module. The line RESET* must be connected only in open collector configuration;...
  • Page 23 NOTE: In order to prevent a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the GL865-DUAL V3 when the module is powered OFF or during an ON/OFF transition.

  • Page 24: Power Supply

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Power Supply The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performance, hence read the requirements carefully and the guidelines that will follow for a proper design.

  • Page 25: Power Consumption

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 6.2. Power Consumption The GL865-DUAL V3 power consumptions are: GL865-DUAL V3 Average Mode Mode description (mA) SWITCHED OFF Module power supplied only on VBATT_PA pin, the VBATT pin Typical 2uA Switched Off is not power supplied.

  • Page 26: General Design Rules

    • A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the GL865-DUAL V3, a 100μF tantalum capacitor is usually suited. • Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.
  • Page 27 • A protection diode should be inserted close to the power input, in order to save the GL865-DUAL V3 from power polarity inversion. This can be the same diode as for spike protection. An example of switching regulator with 12V input is in the below schematic: Reproduction forbidden without written authorization from Telit Communications S.p.A.
  • Page 28 GL865-DUAL V3 and damage it. NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GL865-DUAL V3. Their use can lead to overvoltage on the GL865-DUAL V3 and damage it. USE ONLY Li-Ion battery types. •...

  • Page 29: Thermal Design Guidelines

    For the heat generated by the GL865-DUAL V3, you can consider it to be during transmission 1W max during CSD/VOICE calls and 2W max during class10 GPRS upload.

  • Page 30: Power Supply Pcb Layout Guidelines

    If your application doesn't have audio interface but only uses the data feature of the Telit GL865-DUAL V3, then this noise is not so disturbing and power supply layout design can be more forgiving.

  • Page 31: Antenna

    In the case that the antenna is not directly developed on the same PCB, hence directly connected at the antenna pad of the GL865-DUAL V3, then a PCB line is needed in order to connect with it or with its connector.
  • Page 32 PCB and surround it with Ground planes, or shield it with a metal frame cover. • If you don't have EM noisy devices around the PCB of GL865-DUAL V3, by using a micro strip on the superficial copper layer for the antenna line, the line attenuation will be lower than a buried one;...

  • Page 33: Pcb Design Guidelines

    7.2.1. Transmission line design During the design of the GL865-DUAL V3 interface board, the placement of components has been chosen properly, in order to keep the line length as short as possible, thus leading to lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case.

  • Page 34: Transmission Line Measurements

    HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to GL865-DUAL V3 RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself.
  • Page 35 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure: Insertion Loss of G-CPW line plus SMA connector is shown below: Reproduction forbidden without written authorization from Telit Communications S.p.A.

  • Page 36: Gsm Antenna - Installation Guidelines

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 7.3. GSM Antenna - Installation Guidelines • Install the antenna in a place covered by the GSM signal. • Antenna shall not be installed inside metal cases • Antenna shall be installed also according to antenna manufacturer instructions.

  • Page 37: Logic Level Specifications

    1vv0301018 Rev.5 – 2013-08-05 Logic level specifications Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the GL865-DUAL V3 interface circuits: Absolute Maximum Ratings -Not Functional...

  • Page 38: Reset Signal

    RESET* is used to reset the GL865-DUAL V3. Whenever this signal is pulled low, the GL865-DUAL V3 is reset. When the device is reset it stops any operation. After the release of the reset GL865-DUAL V3 is unconditionally shut down, without doing any detach operation from the network where it is registered.

  • Page 39: Serial Ports

    The only configuration that doesn't need a level translation is the 1.8V UART. The serial port on the GL865-DUAL V3 is a +1.8V UART with all the 8 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. The levels...
  • Page 40 According to V.24, RX/TX signal names are referred to the application side, therefore on the GL865-DUAL V3 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named TXD/ rx_uart ) of the GL865-DUAL V3 serial port and vice versa for RX.

  • Page 41: Rs232 Level Translation

    1vv0301018 Rev.5 – 2013-08-05 9.2. RS232 level translation In order to interface the GL865-DUAL V3 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must: invert the electrical signal in both directions;...
  • Page 42 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218). In this case the chipset is capable to translate directly from 0/1.8V to the RS232 levels (Example done on 4 signals only).

  • Page 43: Audio Section Overview

    1vv0301018 Rev.5 – 2013-08-05 Audio Section Overview The Base Band Chip of the GL865-DUAL V3 provides one input for audio to be transmitted (Uplink) that can be connected directly to a microphone or an audio source. The bias for the microphone is already provided by the product; so the connection can be done in both following ways: 10.1.

  • Page 44: Line-In Connection

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Vmic 220n MIC/AF_IN+ INPUT 220n MIC/AF_IN- AGND MODULE Wire Or Ground Plane TIP: Since the J-FET transistor inside the microphone acts as RF-detector-amplifier, ask vendor for a microphone with anti-EMI capacitor (usually a 33pF or a 10pF capacitor placed across the output terminals inside the case).
  • Page 45 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Vmic 220n MIC/AF_IN+ INPUT 220n MIC/AF_IN- AF_IN+ Remote_GND AGND MODULE If the audio source is not a mike but a different device, the following connections can be done. Place a 1Kohm resistor to ground on the negative input, in order to get balanced the input;...

  • Page 46: Ear Connection

    EAR- TELIT MODULE The audio output of the GL865-DUAL V3 is balanced, this is helpful to double the level and to reject common mode (click and pop are common mode and therefore rejected); furthermore the output stage is class-D, so it can manage directly a loudspeaker with electrical impedance of at least 8Ohm.
  • Page 47 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 EAR+ OUTPUT EAR- TELIT MODULE L-C filtering for LOW impedance load. EAR+ OUTPUT EAR- TELIT MODULE HiZ CIRCUITRY R-C filtering for HIGH impedance load. Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.

  • Page 48: Electrical Characteristics

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 10.4. Electrical Characteristics 10.4.1. Input Lines Microphone/Line-in path Line Type Differential Coupling capacitor ≥ 100nF Differential input resistance 50kΩ Levels Differential input voltage To have 0 dBfs @1KHz MIC Gain = 0dB...

  • Page 49: Output Lines

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 10.4.2. Output Lines EAR/Line-out Output Direct connection (V =1.7÷2.1V) Differential line coupling output load resistance ≥ 8 Ω signal bandwidth 250÷3400Hz (@ -3dB with default filter) max. differential output voltage 1120 mV @3.14dBm0 (*)

  • Page 50: General Purpose I/O

    . Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the GL865-DUAL V3 firmware and acts depending on the function implemented. For Logic levels please refer to chapter 8.

  • Page 51: Gpio Logic Levels

    C106/CTS 11.1. GPIO Logic levels Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the GL865-DUAL V3 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Input level on any digital pin -0.3V...

  • Page 52: Using A Gpio Pad As Input

    NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the GL865-DUAL V3 when the module is powered OFF or during an ON/OFF transition.

  • Page 53: Using The Alarm Output Gpio6

    11.6. Using the Alarm Output GPIO6 The GPIO6 pad, when configured as Alarm Output, is controlled by the GL865-DUAL V3 module and will rise when the alarm starts and fall after the issue of a dedicated AT command. This output can be used to controlling microcontroller or application at the alarm time.

  • Page 54: Magnetic Buzzer Concepts

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 11.8. Magnetic Buzzer Concepts 11.8.1. Short Description A magnetic Buzzer is a sound-generating device with a coil located in the magnetic circuit consisting of a permanent magnet, an iron core, a high permeable metal disk and a vibrating diaphragm.

  • Page 55: Frequency Behavior

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 11.8.2. Frequency Behavior The frequency behavior represents the effectiveness of the reproduction of the applied signals. Because performance is related to a square driving waveform (whose amplitude varies from 0V to V...

  • Page 56: Stat Led Indication Of Network Service Availability

    The STAT_LED pin status shows information on the network service availability and Call status. In the GL865-DUAL V3 modules, the STAT_LED usually needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status.

  • Page 57: Simin Detect Function

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 11.10. SIMIN detect function All the GPIO pins can be used as SIM DETECT input. The AT Command used to enable the function is: AT#SIMINCFG Use the AT command AT#SIMDET=2 to enable the SIMIN detection Use the AT command AT&W0 and AT&P0 to store the SIMIN detection in the common...

  • Page 58: Dac And Adc Section

    12.1.1. Description The GL865-DUAL V3 provides a Digital to Analog Converter. The signal (named DAC_OUT) is available on pin 15 of the GL865-DUAL V3. The on board DAC is a 10 bit converter, able to generate an analogue value based on a specific input in the range from 0 up to 1023.

  • Page 59: Enabling Dac

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 12.1.2. Enabling DAC An AT command is available to use the DAC function. AT#DAC= [<enable> [, <value>]] The command is: <value> - scale factor of the integrated output voltage (0..1023 - 10 bit precision) it must be present if <enable>=1...

  • Page 60: Adc Converter

    0÷2 volts applied on the ADC pin input, store and convert it into 11 bit word. Units Input Voltage range Volt AD conversion bits Resolution > 1 The GL865-DUAL V3 module provides 2 Analog to Digital Converters. The input lines are: ADC_IN1 available on pin 13 ADC_IN2 available on pin 14 12.2.2. Using ADC Converter An AT command is available to use the ADC function.

  • Page 61: Mounting The Gl865-Dual V3 On Your Board

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Mounting the GL865-DUAL V3 on your Board 13.1. General The GL865-DUAL V3 modules have been designed to be compliant with a standard lead-free SMT process. 13.2. Module finishing & dimensions Pin 1...

  • Page 62: Recommended Foot Print For The Application

    13.3. Recommended foot print for the application In order to easily rework the GL865-DUAL V3 is suggested to consider on the application a 1.5 mm placement inhibited area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.

  • Page 63: Pcb Pad Design

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120µm. 13.5. PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
  • Page 64 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3 mm around the pads unless it carries the same signal of the pad itself (see following figure).

  • Page 65: Solder Paste

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 13.7. Solder paste Lead free Solder paste Sn/Ag/Cu We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly. 13.8. GL865-DUAL V3 Solder reflow...

  • Page 66: Debug Of The Gl865-Dual V3 In Production

    To test and debug the mounting of the GL865-DUAL V3, we strongly recommend foreseeing test pads on the host PCB, in order to check the connection between the GL865-DUAL V3 itself and the application and to test the performance of the module connecting it with an external computer.

  • Page 67: Packing System

    14.1. Packing on tray The GL865-DUAL V3 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling. Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
  • Page 68 GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 68 of 76 Mod. 0805 2011-07 Rev.2...

  • Page 69: Packing On Reel

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 14.2. Packing on reel The GL865 V3 can be packaged on reels of 200 pieces each. See figure below for details. Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.

  • Page 70: Carrier Tape Detail

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 14.2.1. Carrier tape detail 14.2.2. Carrier tape detail Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 70 of 76 Mod. 0805 2011-07 Rev.2...

  • Page 71: Moisture Sensibility

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 14.3. Moisture sensibility The level of moisture sensibility of the Product is “3” according with standard IPC/JEDEC J- STD-020, take care of all the relative requirements for using this kind of components.

  • Page 72: Conformity Assessment Issues

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Conformity Assessment Issues European Union - Directive 1999/5/EC GL865-DUAL V3 complies with the essential requirements of the 1999/5/EC Directive. Bulgarian С настоящето Telit Communications S.p.A. декларира, че Dual Band GSM/GPRS module отговаря...
  • Page 73 I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG. In order to satisfy the essential requirements of 1999/5/EC Directive, GL865-DUAL V3 module is compliant with the following standards: RF spectrum use (R&TTE art. 3.2) EN 301 511 V9.0.2...
  • Page 74 The full declaration of conformity can be found on the following address: http://www.telit.com/ There is no restriction for the commercialisation of the GL865-DUAL V3 module in all the countries of the European Union. Final product integrating this module must be assessed against essential requirements of the 1999/5/EC (R&TTE) Directive.

  • Page 75: Safety Recommendations

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Safety Recommendations READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: •...

  • Page 76: Document History

    GL865-DUAL V3 Hardware User Guide 1vv0301018 Rev.5 – 2013-08-05 Document History Revision Date Changes 2012-06-28 First issue 2012-11-09 Updated power consumption and audio section 2013-01-30 Updated power consumption and Conformity Assessment section, minor edits in Chapter 7 2013-04-04 Updated power consumption...

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