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Telit Wireless Solutions SE250B4-NA Hardware Design Manual
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Telit Wireless Solutions SE250B4-NA Hardware Design Manual

Telit Wireless Solutions SE250B4-NA Hardware Design Manual

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SE250B4 Smart Module
Hardware Design Guide
1VV0301817 Rev 3
2024-02-07
Released
Public
Technical Documentation

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Summary of Contents for Telit Wireless Solutions SE250B4-NA

  • Page 1 SE250B4 Smart Module Hardware Design Guide 1VV0301817 Rev 3 2024-02-07 Released Public Technical Documentation...
  • Page 2 SE250B4 Smart Module Hardware Design Guide Contents Applicability Table .......................... 5 Introduction ............................ 6 Scope Audience Contact Information, Support Conventions Terms and Conditions Disclaimer General Product Description ......................8 Overview Product Variants and Frequency Bands Target Market Main Features Tx Output Power Mechanical Specifications Dimensions Temperature Range...
  • Page 3 SE250B4 Smart Module Hardware Design Guide Electrical Design Guidelines......................33 LDO Power Supply Guidelines Reference Design for Power Supply Thermal Design Guidelines RTC Bypass Out Battery Charge Battery charger PADS Charging LED Power On Power-On Sequence Power Off Unconditional Restart Communication Ports USB Interface Forced USB BOOT...
  • Page 4 SE250B4 Smart Module Hardware Design Guide Proximity and Ambient Pressure 10. Mechanical Design........................80 Drawing 11. APPLICATION PCB Design ......................82 Footprint Solder reflows 12. PACKAGING........................... 84 Tray Moisture Sensitivity MSL Rating Summary Baking Requirements 13. CONFORMITY ASSESTMENT ISSUES ..................88 Approvals Summary EMEA Approvals EU RED...
  • Page 5 SE250B4 Smart Module Hardware Design Guide 1. Applicability Table Table 1: Applicability Table Products SE250B4-NA SE250B4-EU 1VV0301817 Rev 3 Page 5 of 104 2024-02-07...
  • Page 6 SE250B4 Smart Module Hardware Design Guide 2. Introduction Scope This document describes electrical specifications, mechanical information, interfaces application and manufacturing information about Telit SE250B4 Smart module. With the help of this document and other application notes or user guides, users can understand Telit SE250B4 Smart module well and develop various products quickly.
  • Page 7 SE250B4 Smart Module Hardware Design Guide Terms and Conditions Refer to https://www.telit.com/hardware-terms-conditions/. Disclaimer THE MATERIAL IN THIS DOCUMENT IS FOR INFORMATIONAL PURPOSES ONLY. TELIT CINTERION RESERVES THE RIGHT TO MAKE CHANGES TO THE PRODUCTS DESCRIBED HEREIN. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT THE DISCRETION OF TELIT CINTERION WITHOUT PRIOR NOTICE.
  • Page 8 MANUFACTURER INFO The manufacturer of SE250 products Family is: Telit Communications S.p.A., via Stazione di Prosecco 5/b, 34010 Sgonico, Trieste, Italy. Product Variants and Frequency Bands The Telit SE250B4 Smart module is available in two variants. SE250B4-NA • SE250B4-EU • SE250B4-NA...
  • Page 9 SE250B4 Smart Module Hardware Design Guide Table 2 Product Variants and Frequency Bands Configuration SE250B4-NA SE250B4-EU 2.0GHz 2.0GHz Memory Flash 16GB 16GB Standards & bands 900MHz 1800M Hz WCDMA FDD-LTE B28A B28B WLAN 2.4G/5GHz; 802.11a/b/g/n/ac BT 5.0 + BR/EDR + BLE...
  • Page 10 SE250B4 Smart Module Hardware Design Guide Target Market The Telit SE250B4 Smart module provides tamper-resistance, confidential, secure, and authentic end-to-end connectivity for telematics applications. The Telit SE250B4 Smart module is one of the key component among the M2M applications, such as: CPE (Customer Premises-based Equipment) •...
  • Page 11 SE250B4 Smart Module Hardware Design Guide Voice codec support EVRC, -B, -WB; G.711; G.729A,-AB; GSM-FR,-EFR,-HR; ARM-NB,-WB; eAMR; BeAMR One USB 3.1 high-speed port One USB 2.0 compliant UART Supports up to 3*UART, up to 4 MHz Supports up to 6*I2C, used to cameras, sensors, TP, and so forth Supports up to 5*SPI, up to 50MHz.
  • Page 12 Power class EGSM 900 MHz Class 4 DCS 1800 Class 1 WCDMA/HSPA+ Class 3 LTE All Bands Class 3 Table 5 TX Maximum Conducted Output Power (dBm) Configuration SE250B4-NA SE250B4-EU 900MHz 34.5 1800M Hz 31.5 WCDMA 25.5 25.5 25.5 FDD-LTE 24.8...
  • Page 13 SE250B4 Smart Module Hardware Design Guide Note: the above values reppresent the worst conditions (modulation/operating mode) for each technology; further details are found in the confidential tune-up prodecure document. Mechanical Specifications Dimensions The overall dimensions of the Telit SE250B4 Smart module family are: Length: 43 mm, +/- 0.15 mm tolerance •...
  • Page 14 SE250B4 Smart Module Hardware Design Guide Block Diagram The following is the architecture block diagram. Figure 2 SE250B4 block diagram Numbers of GPIOs, and periprheral is configurable via SW and will be eventually strictly related to the customer application. As default settings the device supports: 2XUSB,2XSIM,2XUARTs, 1XDEBUG UART, 1X SD CARD, 33 GPIOs configured as alternate functions as follow: 8 for NFC, 3 for sensors , 1 reserved, 3 HDMI, 2 for PM8008 RST_N+ INTerrupt , 2 For CAM enable, 1 fopr SPL SHD_DW, 7 LCM (3EN+2ID+ 2BIAS) + 6 GPIO.
  • Page 15 SE250B4 Smart Module Hardware Design Guide 4. Pins Allocation LGA Pads Layout Top View Figure 3: LGA Pads Layout SE250B4 Pin color LEGEND UART AUDIO SENSORS VIDEO MISCELLANEOUS (SIM, NFC,SDcard,Key vol,LCM, GRFC,) GPIO RKEY 1VV0301817 Rev 3 Page 15 of 104 2024-02-07...
  • Page 16 SE250B4 Smart Module Hardware Design Guide PIN-out USB interface Table 7 PIN-out description Signal Function Comment Alternate Characteristics Function FORCED_USB_BOOT AI GPIO_95 AY15 USB0_HS_SM_DM AI/O USB 90Ω differential (- differential impedance AY13 USB0_HS_SM_DP AI/O USB with 10% tol; differential compliant to USB 2.0 standard AD1,...
  • Page 17 SE250B4 Smart Module Hardware Design Guide BA14 USB0_SS_RX1_P AI/O USB 3.1 channel 2 superspeed receive (+) BD22 USB0_SS_TX1_M AI/O USB 3.1 channel 2 superspeed transmit (+) BC21 USB0_SS_TX1_P AI/O USB 3.1 channel 2 superspeed transmit (-) BC15 USB_CC1 USB Type-C detect 1 BD16 USB_CC2 USB Type-C...
  • Page 18 SE250B4 Smart Module Hardware Design Guide 1.8 V (U)SIM: (U)SIM card Vmax = 1.85 V Vmin = 1.75 V supported. 2.95 V (U)SIM: Vmax = 3.1 V Vmin = 2.8 V UIM2_CLK (U)SIM2 GPIO_73 card clock UIM2_PRESENT (U)SIM2 VILmax = 0.63 Active low.
  • Page 19 SE250B4 Smart Module Hardware Design Guide VOHmin = 1.35 If unused, keep it open. UART_RX_N_SE5 UART1 VILmax = 0.63 V GPIO_17 receive VIHmin = 1.17 V UART_TX_N_SE5 Uart1 VOLmax = 0.45 GPIO_16 transmit VOHmin = 1.35 UART_DEBUG_RX DI DEBUG VILmax = 0.63 V GPIO_13 UART VIHmin = 1.17 V...
  • Page 20 SE250B4 Smart Module Hardware Design Guide Display Interface Table 11 Display Interface Signal Function QCM2290 GPIO AU49 MIPI_CSI0_A0_CLK_M AI MIPI CSI0 clock (+) AT50 MIPI_CSI0_NC_CLK_P AI MIPI CSI0 clock (-) AS49 MIPI_CSI0_C0_LN0_M AI MIPI CSI0 lane 0 data (- AR50 MIPI_CSI0_B0_LN0_P AI MIPI CSI0 lane 0 data AT47...
  • Page 21 SE250B4 Smart Module Hardware Design Guide AY25 MIPI_DSI0_L1_M LCD MIPI lane 1 data (-) - AY27 MIPI_DSI0_L1_P LCD MIPI lane 1 data AY23 MIPI_DSI0_L2_M LCD MIPI lane 2 data (-) - AY21 MIPI_DSI0_L2_P LCD MIPI lane 2 data BD26 MIPI_DSI0_L3_M LCD MIPI lane 3 data (-) - BD28 MIPI_DSI0_L3_P...
  • Page 22 SE250B4 Smart Module Hardware Design Guide Camera Interface Table 13 Camera Interface Signal Function QCM2290 GPIO AJ50 CAM_MCLK0 Master clock of camera GPIO_20 CAM0_PWDN Power down of camera GPIO_97 AF51 CAM0_RST_N Reset of camera 0 GPIO_18 AG50 CAM_MCLK1 Master clock of camera GPIO_21 AD45 CAM1_PWDN...
  • Page 23 SE250B4 Smart Module Hardware Design Guide SNSR_ACCL_INT Inerrupt for ACC sensor GPIO_32 SNSR_GYRO_INT Interrupt for gyro sensor GPIO_33 AD51 SNSR_ALPS_INT_N DI Interrupt for GPIO_35 Lux/proximity sensor SNSR_I2C_SCL I2C clock for external GPIO_110 sensors SNSR_I2C_SDA I2C data for external GPIO_109 sensors APPS_I2C_SDA For PM8008/MIPI DSI GPIO_4...
  • Page 24 SE250B4 Smart Module Hardware Design Guide CDC_IN3_P Microphone input for channel 3 (+) BC11 CDC_EAR_M Earpiece output (-) The typical output BD12 CDC_EAR_P Earpiece output (+) voltage is 2 Vrms. CDC_HPH_REF Headphone reference Ground CDC_HPH_L Headphone left channeloutput CDC_HPH_R Headphone right channel output CDC_HS_DET Headset hot-plug detect...
  • Page 25 SE250B4 Smart Module Hardware Design Guide PM8008_RST_N DIO Reset for GPIO_26 PM8008 PM8008_INT_N DIO Interrupt for GPIO_25 PM8008 VCOIN Power supply for GRFC_10 DIO Generic RF GPIO_47 controller GRFC_12 DIO Generic RF GPIO_49 controller GRFC_15 DIO Generic RF GPIO_52 controller PM_AMUX_2 ADC General-purpose ADC interface...
  • Page 26 SE250B4 Smart Module Hardware Design Guide NFC_CLKREQ reserved NFC GPIO_86 chip_SN100UUK connection NFC_RFCLK3 reserved NFC chip_SN100UUK connection Table 22 LED Signal Function QCM2290 GPIO LED_CHG_SINK Indicate the module's PM_GPIO_02 charging status LCM_WLED_PWM PWM output LED_FLASH Flash/torch driver output LED_FLASH Flash/torch driver output LED_GREEN PM4125 battery...
  • Page 27 SE250B4 Smart Module Hardware Design Guide BE47, VBAT Power supply for BB Can be routed in pair to VPH_PA or separately depends on customer application needes AB49. AH49 VREG_L15A_1P8 1.8 V output Vnom = 1.8 V IOmax = 200 mA AD49 VREG_L17A_3P0 3.0 V output...
  • Page 28 SE250B4 Smart Module Hardware Design Guide Table 24 GND Signal Function Comment A11, A15, A17, A21, A23, A27, A29 A31, A35, A39, A43, A7, AA5, AA47, AB45, AB51, AC50, AD7, AE5, AF3, AF45, AG2, AH1, AH51, AJ2, AJ47, AJ5, AK3, AK45, AK51, AL2, AL47, AM1, AM45, AN2, AN50, AP1, AP51, AR2, AS1, AT2, AU1, AU45, AU51, AV47, AV50, AW49, AY1, AY11, AY17, AY19,...
  • Page 29 SE250B4 Smart Module Hardware Design Guide Note: Reserved Pin’s must not be connected. PIN Description Table 26 Pin-type description Symbol Description Power input Power output Analog input Analog output Digital input output Digital input 1VV0301817 Rev 3 Page 29 of 104 2024-02-07...
  • Page 30 SE250B4 Smart Module Hardware Design Guide 5. Power Supply The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design. To ensure high power transmission, we recommend to use a power supply that supports up to 3A.
  • Page 31 SE250B4 Smart Module Hardware Design Guide Ch=18300 FDD B3 power@ 22dB BW=10MHZ 617.28 Ch=19575 FDD B5 power@ 22dB BW=10MHZ 474.04 Ch=20525 FDD B8 power@ 22dB BW=10MHZ 480.97 Ch=21625 TDD B38 power@ 23dB BW=10MHZ 292.15 Ch=37800 TDD B40 power@ 23dB BW=10MHZ 317.51 Ch=38700 TDD B41 power@ 23dB...
  • Page 32 C/N0 Tracking Recapture Cold start Cold Hot start sensitivity sensitivity capture start TTFF sensitivity TTFF Level GPS+ GLONASS Table 30 SE250B4-NA GPS Performances C/N0 Tracking Recapture Cold start Cold Hot start sensitivity sensitivity capture start TTFF sensitivity TTFF Level GPS+...
  • Page 33 SE250B4 Smart Module Hardware Design Guide 7. Electrical Design Guidelines The electrical design of the power supply strongly depends on a drained power source. The electrical design guidelines categories are: +5V input (typically PC internal regulator output) • +12V input (typically automotive) •...
  • Page 34 SE250B4 Smart Module Hardware Design Guide VBAT SE250B4 VBAT Figure 5 Reference design for power supply Reference Design for Power Supply As already mentioned the design of the power supply network is very important as the performance of the module largely depends on power supply source. The supply source should be able to provide at least 3A of current @3.8V.
  • Page 35 SE250B4 Smart Module Hardware Design Guide DC INPUT U101 VBAT VOUT R101 PW_CNTRL On/Off 100 K C101 C102 R103 100 uF MIC29302 C103 1 uF C104 470 R 330 uF 100 nF R102 43 K Figure 6 Reference design for non-battery solutions Note: To ensure proper behavior of the regulator under minimal load, an extra minimum load is required.
  • Page 36 SE250B4 Smart Module Hardware Design Guide RTC Bypass Out When the module is powered down and there is no power supply on VBAT the module can keep the RTC (real time clock) if an external coin cell is connected to the module VCOIN pad. If RTC support is needed when VBAT is removed, then a qualified coin cell or keep-alive capacitor needs to be connected to the VCOIN PIN.
  • Page 37 SE250B4 Smart Module Hardware Design Guide Figure 9 No-rechargeable Battery Figure 10 Rechargeable battery VRTC typical voltage is 3.0V, and the current consumption is about 7.5uA when VBAT is not present. Table 31 VCOIN Parameter Description Type Unit VCOIN-IN VCOIN input voltage 3.25 ICOIN-IN VCOIN current consumption...
  • Page 38 SE250B4 Smart Module Hardware Design Guide Trickle charging: this happens when the battery voltage is below 2.1V, then a constant • charging current of 90mA is applied to the battery. In the range between 2.1 and 3.4V the current is set up to 400mA as maximum value. Constant current mode (CC mode) happens when the battery voltage is between 3.2V •...
  • Page 39 SE250B4 Smart Module Hardware Design Guide Battery charger PADS Table 33 Battery Charger PADS Signal Function Comment BATT_ID Battery type detect Internally pulled down with a 100 kΩ resistor. If unused, keep it open. BATT_THERM Battery temperature Internal pull up by detect default.
  • Page 40 SE250B4 Smart Module Hardware Design Guide Mobile devices such as mobile phones or handheld POS systems are powered by batteries. For different batteries, you should modify the charging and discharging curve correspondingly to actieve the best performance. If the thermistor is not available in the battery, or an adapter is used to power the module, you need to connect the BAT_THERM pad to GND via a 47 KΩ...
  • Page 41 SE250B4 Smart Module Hardware Design Guide The following is the circuit diagram: Figure 13 LED Reference Circuit Note: While charging, the CHG_LED_SINK pin controls the LED indicator. If the LBC is not active, then the CHG_LED_SINK pin cannot control the LED indicator. (CHARGE_SEL is grounded).
  • Page 42 SE250B4 Smart Module Hardware Design Guide Figure 14 Power on/off using the power button 1.8V 10 K 4.7K MODULE Figure 15 Power On/Off using the transistor Power-On Sequence The following is the power on sequence diagram: Figure 16 Turn-on Timing Note: When the module is turned on for the first time the power on sequence may be different from the shown above.
  • Page 43 SE250B4 Smart Module Hardware Design Guide Power Off Users can turn off Telit SE250B4 Smart module by pulling down the KEY_PWR_ON PIN for more than 1 second. After the module detects that the KEY_PWR_ON is low level, a prompt window will pop up on the screen to confirm whether to execute the shutdown action. Module can also be forced to shut down by pulling down KEY_PWR_ON for more than 8 seconds.
  • Page 44 SE250B4 Smart Module Hardware Design Guide Communication Ports USB Interface The module provides USB interfaces which comply with both USB 3.1 and USB 2.0 specifications and supports the modules below: superspeed (5Gbps) • high-speed (480 Mbps) • full speed (12Mbps) •...
  • Page 45 SE250B4 Smart Module Hardware Design Guide BC19 USB0_SS_TX0_P AI/O USB 3.1 channel 1 90Ω differential impedance, superspeed transmit (-) compliant to USB 3.1stand BA16 USB0_SS_RX1_M AI/O USB 3.1 channel 2 superspeed receive (-) BA14 USB0_SS_RX1_P AI/O USB 3.1 channel 2 superspeed receive (+) BD22 USB0_SS_TX1_M AI/O USB 3.1 channel 2...
  • Page 46 SE250B4 Smart Module Hardware Design Guide Do not route signals traces under crystals, oscillators, magnetic devices, or RF signal • traces. Route the USB differential traces in the inner layer with ground on all four sides of the USB track (TOP, BOTTOM, and shield left and right with VIA grounding) → this means that a stack up with at least 4 layers should be used.
  • Page 47 SE250B4 Smart Module Hardware Design Guide Figure 19 Forced download circuit Table 39 Forced USB PIN name Description Note Forced_USB_BOOT USB forced download signal, short- Reserved test circuit to LDO5_1V8 at power-on to point enter forced download mode. VREG_L15A_1P8 AB49. 1.8V LDO output AH49 Uart Interfaces...
  • Page 48 SE250B4 Smart Module Hardware Design Guide UART_CTS_N_SE5 DCE clear VILmax = 0.63 V to send VIHmin = 1.17 V signal from UART_RTS_N_SE5 VOLmax = 0.45 V request to VOHmin = 1.35 V send signal to DTE The Telit SE250B4 Smart module provides several sets of GPIOs which are available as BLSP (BAM-enabled low-speed peripheral) interfaces that can be configured to support various interface combinations.
  • Page 49 SE250B4 Smart Module Hardware Design Guide 1.8V 3.3V VCCA VCCB TXD_1.8V UART_TX_N_SE5 TXD_3.3V DIN1 DOUT1 RTS_1.8V UART_RFR_N_SE5 RTS_3.3V DIN2 DOUT2 DIN3 DOUT3 R1OUTB UART_RX_N_SE5 RXD_1.8V RIN1 RXD_3.3V ROUT1 UART_CTS_N_SE5 CTS_1.8V CTS_3.3V ROUT2 RIN2 ROUT3 RIN3 FORCEON INVALID Voltage Translator MODULE FORCEOFF DB-9 Figure 21 RS-232 Level Match Circuit for UART0...
  • Page 50 SE250B4 Smart Module Hardware Design Guide (U)SIM card is supported. SIM1_VCC VREG_L18A_1P8 22 R UIM1_RESET SIM1_RESET 22 R UIM1_CLK SIM1_CLK 22 R UIM1_DATA SIM1_DATA 22 R UIM1_PRESENT SIM1_Present 22 R UIM2_RESET SIM2_RESET 22 R UIM2_CLK SIM2_CLK 22 R UIM2_DATA SIM2_DATA 22 R UIM2_PRESENT SIM2_Present...
  • Page 51 SE250B4 Smart Module Hardware Design Guide Add a TVS array for ensuring ESD protection on all lines and pay attention that • parasitic capacitance don’t exceed 10pF.Moreover 22 series resistor can be used to suppress EMI such spurious transmission. At least, 4-layer through-hole PCB should be chosen for good impedance control and •...
  • Page 52 SE250B4 Smart Module Hardware Design Guide VREG_L15A_1P8 VREG_L4A_2P96 VREG_L21A_2P96 SDC2_DATA_0 DAT0 SDC2_DATA_1 DAT1 SDC2_DATA_2 DAT2 SDC2_DATA_3 DAT3 SD_CARD_DET_N SD_CARD_DET SDC2_CLK SDC2_CMD MODULE Figure 23 Reference Circuit for the SD Card Interface VREG_L21A_2P96 is the power supply for SD card and provide up 841mA of output current. For this reason we recommend a trace width of at least 0.8/1mm on the PCB.
  • Page 53 SE250B4 Smart Module Hardware Design Guide General Purpose I/O The Telit SE250B4 Smart module has different GPIOs that can be configured depending on customer application. In the default configuration the Smart Module comes with few GPIO since a lot of signals are already dedicated to other functions as explained on the PINOUT section.
  • Page 54 SE250B4 Smart Module Hardware Design Guide ADC Converter The Telit SE250B4 supports TWO Analog-to-Digital Converter (ADC) interface. The ADC interface supports resolution up to 15 bits. The pin definition is shown below. Table 46 ADC converter Signal Function PM_AMUX_2 General-purpose ADC interface PM_AMUX_3 General-purpose ADC interface Table 47 ADC Performances...
  • Page 55 SE250B4 Smart Module Hardware Design Guide VBAT 1 uF VIBRATOR VIB_DRIVER MODULE Figure 24 Reference Circuit for Motor Connection When the motor stops working and the VIB_DRIER is disconnected, the redundant electricity on the motor can be discharged from the circuit loop formed by diodes, thus avoiding components damage.
  • Page 56 SE250B4 Smart Module Hardware Design Guide This may be considered as reference for general LCM driver and reflects the design of our EVB in which we have a socket for the LCM. Touchscreen_Socket Backlight driver I2C address:0x36 : 0x6C / 0x6D 10 uH 1800R 2.2 uF...
  • Page 57 SE250B4 Smart Module Hardware Design Guide I2C devices. TS_INT_N TP interrupt 1.8 V power domain. TS_RESET_N TP reset 1.8 V power domain. Active low. TS_3P0_EN TP Enable MODULE TP (touch panel) VREG_L17A_3P0 VREG_L15A_1P8 TS_I2C_SCL TS_I2C_SDA TS_INT_N TS_RESET_N RESET TS_3P0_EN Figure 26 Reference Circuit Design for the Touch Panel Interface Camera Interface Based on MIPI CSI standard, the module supports two cameras (4-lane+4-lane) or three cameras (4lane+2lane+1lane), and the maximum resolution is 35MPx.
  • Page 58 SE250B4 Smart Module Hardware Design Guide AL50 CAM_MCLK2 Master clock of camera 2 CAM2_PWDN Power down of camera 2 CAM2_RST_N Power down of camera 2 AG47 CAM_CCI_I2C_SCL0 I2C clock of camera 0 AE47 CAM_CCI_I2C_SDA0 I2C data of camera 0 AE50 CAM_CCI_I2C_SCL1 I2C clock of camera 1 AF49...
  • Page 59 SE250B4 Smart Module Hardware Design Guide CAM_2P8_EN 13 MPxl MODULE CAM_2P8_EN CAM_CCI_I2C_SDA0 CAM_CCI_I2C_SDA0 CAM_CCI_I2C_SCL0 CAM_CCI_I2C_SCL0 CAM0_RST_N CAM0_RST_N CAM0_PWDN CAM0_PWDN CAM_MCLK0 CAM_MCLK0 MIPI_CSI0_B2_LN3_P MIPI_CSI0_B2_LN3_P MIPI_CSI0_C2_LN3_M MIPI_CSI0_C2_LN3_M MIPI_CSI0_C1_LN2_P MIPI_CSI0_C1_LN2_P MIPI_CSI0_A2_LN2_M MIPI_CSI0_A2_LN2_M MIPI_CSI0_A1_LN1_P MIPI_CSI0_A1_LN1_P MIPI_CSI0_B1_LN1_M MIPI_CSI0_B1_LN1_M MIPI_CSI0_B0_LN0_P MIPI_CSI0_B0_LN0_P MIPI_CSI0_C0_LN0_M MIPI_CSI0_C0_LN0_M MIPI_CSI0_NC_CLK_P MIPI_CSI0_NC_CLK_P MIPI_CSI0_A0_CLK_M MIPI_CSI0_A0_CLK_M CAM_AF_VDD_EN 5 MPxl...
  • Page 60 SE250B4 Smart Module Hardware Design Guide MIPI Design Consideration Special attention is required on the pin definition on LCM and camera connections. Since MIPI lines are high-speed differential signal lines for both DSI and CSI. Please consider that DSI support maximum speed up 1.5 Gbps and CSI a data rate up to 2.5 Gbps. The differential impedence should be controllet to 100Ω±10%.
  • Page 61 SE250B4 Smart Module Hardware Design Guide MIPI_CSI1_B2_LN3_P 13.549 Sensor Interface The module supports communication with sensors via I2C interfaces, and it supports ALS/PS,BDS, accelerometer, gyroscope etc, our EVK already include some sensors but the module has also two general purpose pads that can be used for external sensor applications.
  • Page 62 SE250B4 Smart Module Hardware Design Guide BC11 CDC_EAR_M Earpiece output (-) The typical BD12 CDC_EAR_P Earpiece output (+) output voltage is 2 Vrms. CDC_HPH_REF Headphone reference Ground CDC_HPH_L Headphone left channeloutput CDC_HPH_R Headphone right channel output CDC_HS_DET Headset hot-plug detect CDC_AUX_P Audio line differential output CDC_AUX_M...
  • Page 63 SE250B4 Smart Module Hardware Design Guide Module MIC_BIAS1 MIC1_P MIC1_M ECM MIC Figure 28 Reference Circuit Design for ECM Microphone Interface The characteristics of audio signal are obviously affected by the microphone gain. • On the tables below you can find some reference measurements depending on the selected gain value.
  • Page 64 SE250B4 Smart Module Hardware Design Guide Table 58 Microphone amplifier gain = 24 dB (maximum gain) Parameter Test conditions Typical Units Input referred Single-ended, A-weighted, µVrms noise capless Signal-to-noise Single-ended, A-weighted, 87.5 ratio capless THD+N ratio f = 1.02 kHz; single-ended Analog input = - input;...
  • Page 65 SE250B4 Smart Module Hardware Design Guide MEMS MIC For Digital microphone please consider the reference design and the table below. Module MIC_BIAS3 MIC3_P MIC3_M Figure 29 Reference Circuit Design for MEMS Microphone Interface Table 61 Digital Microphone Input Performance Parameter Test conditions Typical Units...
  • Page 66 SE250B4 Smart Module Hardware Design Guide Module EAR_P EAR_M Figure 30 Reference Circuit Design for Earpiece Interface Table 62 Earpiece output performances Parameter Test conditions Typical Units Output power 32 Ω load f = 1.02 kHz, 6 dB 124.5 gain THD+N < 1% 16 Ω...
  • Page 67 SE250B4 Smart Module Hardware Design Guide 21.5 Mw with 16 Ω loads, 0 dBFS and -4.5 dB gain • 30.8 Mw with 32 Ω loads, 0 dBFS and 0 dB gain • A 100KΩ pull-down resistor is integrated at HPH_L PIN, which could be used for mechanical insertion or removal detection through HS_DET PIN.
  • Page 68 SE250B4 Smart Module Hardware Design Guide VPH_PWR Audio PA 10 K PA_EN 10 uF 100 K LINEOUT_P 10 uF 100 K LINEOUT_M Figure 32 Reference Circuit Design for Lineout Interface Table 64 Speaker Output Performance Parameter Test conditions Typical Units Output power (Pout) 15 μH + 8 Ω...
  • Page 69 SE250B4 Smart Module Hardware Design Guide Audio Signal Design Considerations It is recommended to use EMC microphone with dual build in shunt capacitors (e.g. 10pF and 33pF) to filter RF interference, thus TDD noise.. Without this capacitor the TDD noise could be heard during voice calls, please note that the resonant frequency point of a capacitor largely depends on its material and manufacturing technique.
  • Page 70 2570 – 2620 2570 – 2620 LTE-TDD B40 2300 – 2400 2300 – 2400 LTE-TDD B40 2496 – 2690 2496 – 2690 Table 67 SE250B4-Na Operating frequencies 3GPP Bands Downlink Uplink Unit LTE-FDD B2 1930 - 1990 1850 - 1910...
  • Page 71 SE250B4 Smart Module Hardware Design Guide LTE-FDD B26 859 - 894 814 - 849 LTE-FDD B66 2110 – 2200 1710 – 1780 LTE-FDD B71 617 – 652 663 – 698 LTE-TDD B41 2496 – 2690 2496 – 2690 Reference Design for Cellular Part A reference circuit design for the main and Rx-diversity antenna interface is shown below.
  • Page 72 SE250B4 Smart Module Hardware Design Guide Operating Frequencies for Wi-Fi/BT Part The following tables show the pin definition and frequency specification fot the W-iFi/BT antenna interface. Table 68 Wi-Fi/Bluetooth Pin Definition Signal Function Comment ANT_WIFI Wi-Fi/Bluetooth antenna interface 50W. Table 69 Wi-Fi/Bluetooth Frequencies Type Frequency Unit...
  • Page 73 SE250B4 Smart Module Hardware Design Guide Table 71 SE250B4 standard Wifi Performances @2.4GHz Item 802.11B (11M) 802.11G (54M) 802.11N(MCS7) Unit TX Output power 12.5 <20% <-25dB <-27dB RX sensitivity -73.5 Table 72 SE250B4 standard Wifi Performances @5 GHz Item 802.11G (54M) 802.11N(MCS7) Unit TX Output...
  • Page 74 SE250B4 Smart Module Hardware Design Guide Module NT_GPS C/L? C/L? Figure 35 Recommended RF connection circuit for GNSS part. For active antennas we need to also bring the power supply for the LNA integrated inside the antenna. Then we need to add just some other components, and basically a DC feed and DC block components to avoid the dispersion of received signals through the supply path.
  • Page 75 SE250B4 Smart Module Hardware Design Guide Module NT_GPS 100 pF Figure 36 Recommended connection circuit for GNSS active antenna. Note: We recommend using passive antennas. Active antennas can increase the signal, but an excessive gain can blind the receiver. Please make sure to follow the RF routing guideline for RF track routing.
  • Page 76 SE250B4 Smart Module Hardware Design Guide impedance of RF wiring. The following illustrations show the structure design of microstrip line and coplanar waveguide. The following is the structure diagram: Figure 37 Two Layers PCB microstrip structure Table 77 Impedance control of microstrip line structure Item Value PCB thickness...
  • Page 77 SE250B4 Smart Module Hardware Design Guide Figure 39 Four-layer PCB coplanar waveguide structure 1# Four-layer PCB coplanar waveguide structure 2# is shown in following figure. The fourth layer is reference layer. The following is the structure diagram: Figure 40 Four-layer PCB coplanar waveguide structure 2# 1VV0301817 Rev 3 Page 77 of 104 2024-02-07...
  • Page 78 SE250B4 Smart Module Hardware Design Guide 9. RECOMMENDED PERIPHERALS LIST Warning: The components listed in the recommended peripherals list are for information purpose only. For more information, see Terms of Use. Camera Table 79 Camera Peripheral List Items Part Vendor Resolution Number BF2257...
  • Page 79 SE250B4 Smart Module Hardware Design Guide Accelerometer & Gyroscope Table 81 Accelerometer and Gyroscope Peripheral List Item Part Number Vendor Accelerometer Gyroscope ICM-42670-N √ √ BMI320 Bosch √ SH3001-A SENODIA √ √ E-Compass Table 82 E-Compass Peripheral List Item Part Number Vendor QMC6308 MMC5603NJ...
  • Page 80 SE250B4 Smart Module Hardware Design Guide 10. Mechanical Design The following is the Top and bottom view of Telit SE250B4 Smart module. Drawing Figure 41 SE250B4 mechanical drawing (bottom view). 1VV0301817 Rev 3 Page 80 of 104 2024-02-07...
  • Page 81 SE250B4 Smart Module Hardware Design Guide Figure 42 SE250B4 mechanical drawing (top view). Figure 43 SE250B4 mechanical drawing (side view). 1VV0301817 Rev 3 Page 81 of 104 2024-02-07...
  • Page 82 SE250B4 Smart Module Hardware Design Guide 11. APPLICATION PCB Design Footprint The following is the footprint diagram: Figure 44 Footprint of the Telit SE250B4 Smart module Solder reflows The following is the SMT reflow of the Telit SE250B4 Smart module. 1VV0301817 Rev 3 Page 82 of 104 2024-02-07...
  • Page 83 SE250B4 Smart Module Hardware Design Guide Figure 45 SMT reflow of the Telit SE250B4 Smart module 1VV0301817 Rev 3 Page 83 of 104 2024-02-07...
  • Page 84 SE250B4 Smart Module Hardware Design Guide 12. PACKAGING Tray Telit SE250B4 Smart module supports tray packaging. The following is the packaging process: Figure 46 Tray Table 85 Tray dimensions Length (mm) Width (mm) Units per tray 322.6 135.9 1VV0301817 Rev 3 Page 84 of 104 2024-02-07...
  • Page 85 SE250B4 Smart Module Hardware Design Guide Figure 47 Tray Packaging 1VV0301817 Rev 3 Page 85 of 104 2024-02-07...
  • Page 86 SE250B4 Smart Module Hardware Design Guide Figure 48 multi-packaging Moisture Sensitivity Telit SE250B4 Smart module is susceptible to damage induced by absorbed moisture and high temperature. A package’s moisture-sensitivity level (MSL) indicates its ability to withstand exposure after it is removed from its shipment bag, while it is on the factory floor awaiting PCB installation.
  • Page 87 SE250B4 Smart Module Hardware Design Guide The MSM8909 device samples are currently classified as MSL4 at 255 (+5, -0)°C, following the latest IPC/JEDEC J-STD-020 standard revision for moisture-sensitivity qualification This qualification temperature (255°C) should not be confused with the peak temperature within the recommended solder reflow profile.
  • Page 88 Table 89 Americas Approvals summary Region Americas Country & Type Approval ISED ANATEL SE250B4-NA The equipment is compliant Type approval is in progress The equipment is not compliant EMEA Approvals EU RED EU Declaration of Conformity In accordance with the above Approval Compliance Summary table, where applicable (green ball), hereby, Telit Cinterion declares that the equipment is in compliance with the Directive 2014/53/EU.
  • Page 89 SE250B4 Smart Module Hardware Design Guide Table 90 RED Antenna used for testing Model Antenna Type SE250B4-EU 2G/3G/4G: Model: ZTX S50, Type: Monopole with SMA connector, 50ohm impedence WiFi/Bluetooth® : Model: ZTX TG2, Type: Monopole with SMA connector, 50ohm impedence Table 91 Licensed 2G/3G/4G Max antenna gain for RED Licensed 2G/3G/4G Max Gain for RED (dBi) Band...
  • Page 90 Applicable FCC Rules Table 93 List of applicable FCC rules Modèle Model Applicable FCC Rules SE250B4-NA 47 CFR Part 2, 22, 24, 27, 90 Part 15.247, 15.407 FCC Regulatory Notices This module is intended for OEM integrators only. Per FCC KDB 996369 D03 OEM Manual, the following conditions must be strictly followed when using this certified module.
  • Page 91 SE250B4 Smart Module Hardware Design Guide FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
  • Page 92 SE250B4 Smart Module Hardware Design Guide Limited module procedures Not applicable. Trace antenna designs Please, refer to Section 8 of this document for antenna connector trace layout design and to the Gerber files attached to this document. Note that only the unique antenna connectors as indicated in this manual can be used for all transmitter ports.
  • Page 93 List of unique antenna connectors RP-SMA Table 94 FCC Antenna used for testing Model Antenna Type SE250B4-NA 4G: Model: ZTX S50, Type: Monopole with SMA connector, 50ohm impedence WiFi/Bluetooth® : Model: ZTX TG2, Type: Monopole with RP SMA connector, 50ohm impedence...
  • Page 94 LTE FDD 66 2.06 LTE FDD 71 1.58 LTE TDD 41 2.83 Table 96 Unlicensed 2.5G/5G Max Gain for FCC (dBi) Unlicensed 2.5G/5G Max Gain for FCC (dBi) Band Sub-band SE250B4-NA 2.4G 2.400~2483.5MHz 3.757 5150~5250MHz 2.475 5250~5350MHz 1.879 5470~5725MHz 2.122 5725~5850MHz 1.672...
  • Page 95 Model Applicable ISED Rules Modèle Règles ISDE applicables SE250B4-NA RSS-130 Issue 2, RSS-132 Issue 4, RSS-133 Issue 6, RSS-139 Issue 4, RSS-140 Issue 1, RSS-199 Issue 4; RSS-247 Issue 3, RSS-Gen Issue 5, RSS-102 Issue 5 ISED Regulatory notices / Avis réglementaires de ISDE Déclaration de modification...
  • Page 96 SE250B4 Smart Module Hardware Design Guide fréquence radio (RF) ISED règles d'exposition. L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. L'antenne doit être installée de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps.
  • Page 97 SE250B4 Smart Module Hardware Design Guide L'antenne doit être installé et exploité avec plus de 20 cm entre l'antenne et les utilisateurs, et (if EUT is portable device, please delete this item) 2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires.
  • Page 98 Table 99 ISED Antenna used for testing Model Antenna Type Modèle Type d’Antenne SE250B4-NA 4G: Model: ZTX S50, Type: Monopole with SMA connector, 50ohm impedence WiFi/Bluetooth® : Model: ZTX TG2, Type: Monopole with RP SMA connector, 50ohm impedence 2G/3G/4G Gain maximum pour ISDE (dBi)
  • Page 99 Dans ce cas, XXXXXX-YYYYYYYYYYY est le numéro d'homologation du module. Étiquette ISED du périphérique hôte Table 102: Host device ISED Label / Modèle Model / IC ID SE250B4-NA SE250B4 Contains IC: 5131A- Contient des IC: 5131A-SE250B4 RoHS and REACH info RoHS info Any requests on information related to RoHS certifications can be addressed to Chemical.Certifications@telit.com.
  • Page 100 SE250B4 Smart Module Hardware Design Guide 1VV0301817 Rev 3 Page 100 of 104 2024-02-07...
  • Page 101 SE250B4 Smart Module Hardware Design Guide 14. Acronyms and Abbreviations Table 103: Acronyms and Abbreviations Acronym Definition TTSC Telit Technical Support Centre Universal Serial Bus High Speed Data Terminal Equipment UMTS Universal Mobile Telecommunication System WCDMA Wideband Code Division Multiple Access HSDPA High Speed Downlink Packet Access HSUPA...
  • Page 102 SE250B4 Smart Module Hardware Design Guide 15. Related Documents Refer to https://dz.telit.com/ for current documentation and downloads. Table 104: Related Documents S.no Book Code Document Title 1VV0301822 SE250B4 Smart EVB User Guide 1VV0301823 SE250B4 SDK User Guide 1VV0301817 Rev 3 Page 102 of 104 2024-02-07...
  • Page 103 SE250B4 Smart Module Hardware Design Guide 16. Document History Table 105: Document History Revision Date Changes 2023-05-23 Template Update 2023-05-15 First issue 2023-08-07 Release to Downloadzone 2024-02-07 Added Current Consumption table (table 27), added conformity assessment section 1VV0301817 Rev 3 Page 103 of 104 2024-02-07...
  • Page 104 SE250B4 Smart Module Hardware Design Guide © Telit 2023 All rights reserved. 1VV0301817 Rev 3 Page 104 of 104 2024-02-07 Technical Documentation...

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