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a : The dispensing quantity of whole of one head is adjusted.
See "4-5 Head Data" in the OPERATING MANUAL (For Engineers).
b : Adjust the dispensing quantity per dispensing code .
See "4-4 Code Data" in the OPERATING MANUAL (For Engineers).
c : The height of filament is lowered. (but dispensing tact decreases.)
See "4-5 Head Data" in the OPERATING MANUAL (For Engineers).
d : Nozzle height during X Y movement
See "4-5 Head Data" in the OPERATING MANUAL (For Engineers).
e : The adhesive is weakened to be easy to come for the bond out and prevent the filament.
See the instruction manual for the temperature control unit.
f : Correct the warp of board and attach the nozzle to the board precisely.
See "3-3 Setting the Support Pins" in the OPERATING MANUAL (For Engineers).
g : Discharge the air in the nozzle.
See "4-1 Checking the Dispensing Bond" in the OPERATING MANUAL (For Operators)
h : Remove the bond at the nozzle tip.
See "4-1 Checking the Dispensing Bond" in the OPERATING MANUAL (For Operators)
i : Adjust the bond
See "8-2 Dispensing Recognition Feedback" in the OPERATING MANUAL (For Engineers)
j : Enlarge the dispensing recognition judgment range.
See "4-5-1 Preparatory Dispensing Data" in the OPERATING MANUAL (For Engineers).
K : Make dispensing quantity steady by the preparatory dispensing before production.
See "1-2 Priming Shot Data" in the APPENDIX of BD30 Editor of PROGRAMMING
MANUAL.
l : Check that the nozzle touches to the plate during the preparatory dispensing.
See "3-3 Adjusting the Nozzle Height" in the MAINTENANCE MANUAL.
∗ If the height of preparatory dispensing part is not proper, make contact with us.
293C-E-EMA09-A01-00
Troubles in Bond Dispensing
9
Page 9-3
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