Examining The Installation Site; Temperature/Humidity; Cleanliness - HP FlexFabric 5980 48SFP+6QSFP28 Installation Manual

Flexfabric 5980 series
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Examining the installation site

The switch must be used indoors.
Make sure the installation site meets the following requirements:
Adequate clearance is reserved at the air inlet and outlet vents for ventilation.
The rack has a good ventilation system.
Identify the hot aisle and cold aisle at the installation site, and make sure ambient air flows into
the switch from the cold aisle and exhausts to the hot aisle.
Identify the airflow designs of neighboring devices, and prevent hot air flowing out of the
neighboring devices from entering the top device.
The rack is sturdy enough to support the switch and its accessories.
The rack is reliably grounded.
To ensure correct operation and long service life of your switch, install it in an environment that meets
the requirements described in the following subsections.

Temperature/humidity

Maintain the temperature and humidity in the equipment room in the acceptable range.
Lasting high relative humidity can cause poor insulation, electricity leakage, mechanical
property change of materials, and metal corrosion.
Lasting low relative humidity can cause washer contraction and ESD and cause problems
including loose mounting screws and circuit failure.
High temperature can accelerate the aging of insulation materials and significantly lower the
reliability and lifespan of the switch.
For the temperature and humidity requirements for the switch, see

Cleanliness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table 2 Dust concentration limit in the equipment room
Substance
Dust
NOTE:
Dust diameter ≥ 5 μm
The equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 3 Harmful gas limits in the equipment room
Gas
SO
2
H
S
2
Concentration limit (particles/m³)
≤ 3 x 10
4
(no visible dust on the tabletop over three days)
Table
2
"Technical
3.
Maximum concentration (mg/m
0.2
0.006
specifications."
3
)

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