Packaging; Uc20_Hardware_Design; Confidential / Released - Quectel UC20 Manual

It is suggested that peak reflow temperature is 235 ~ 245º C (for SnAg3.0Cu0.5 alloy). Absolute max
reflow temperature is 260º C. To avoid damage to the module when it was repeatedly heated, it is
suggested that the module should be mounted after the first panel has been reflowed. The following
picture is the actual diagram which we have operated.
º C
250
217
200
150
100
50
0 50

8.3. Packaging

UC20 is packaged in the tap and reel carriers. One reel is 11.53m length and contains 250pcs modules.
The figure below shows the package details, measured in mm.

UC20_Hardware_Design

Preheat
Liquids Temperature
160
º C
Between 1~3 /s
º C
100 150
Figure 46: Liquids Temperature

Confidential / Released

200
º C
70s~120s
200
Time
UMTS/HSPA Module Series
UC20 Hardware Design
Heating Cooling
40s~60s
250 300
s
75 / 84