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This user's guide describes the characteristics, operation, and use of the TPD8S300 evaluation module
(EVM). This EVM is a TPD8S300 integrated chip set into a USB Type-C passthrough board to allow the
user to test the operation of the TPD8S300 overvoltage protection and ESD protection in their own
system. This user's guide includes setup instructions, schematic diagrams, a bill of materials, and printed-
circuit board layout drawings for the EVM.
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Bill of Materials
SLVUAU1 - October 2016
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Copyright © 2016, Texas Instruments Incorporated
TPD8S300 Evaluation Module
Contents
List of Figures
List of Tables
User's Guide
SLVUAU1 - October 2016
TPD8S300 Evaluation Module
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Summary of Contents for Texas Instruments TPD8S300
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Page 1: Table Of Contents
This user's guide describes the characteristics, operation, and use of the TPD8S300 evaluation module (EVM). This EVM is a TPD8S300 integrated chip set into a USB Type-C passthrough board to allow the user to test the operation of the TPD8S300 overvoltage protection and ESD protection in their own system. -
Page 2: Introduction
TPD8S300 to serve as either a UFP or a DFP port. To simulate a use case where the TPD8S300 will not function as a UFP, turn off the dead battery functionality by manually removing these resistors. -
Page 3: Esd Testing
ESD simulator in either contact or air-gap test mode to measure the ESD protection provided by the TPD8S300. Probe points one and two correspond to the SBU2 and SBU1 lines respectively. Probe points four and five correspond to the CC1 and CC2 lines respectively. To measure the ESD response on the D±... -
Page 4: Schematic
Schematic www.ti.com Schematic Figure 3. TPD8S300EVM Schematic TPD8S300 Evaluation Module SLVUAU1 – October 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 5: Board Layout
Board Layout www.ti.com Board Layout This section provides the TPD8S300EVM board layout. The TPD8S300 is an 8-layer board of FR-4 at 0.032" thickness. Figure 4. Top Layer Figure 5. Ground Plane 1 Figure 7. Ground Plane 2 Figure 6. Midlayer 1 SLVUAU1 –... -
Page 6: Power Plane
Board Layout www.ti.com Figure 9. Midlayer 2 Figure 8. Power Plane 1 Figure 10. Ground Plane 3 Figure 11. Bottom Layer TPD8S300 Evaluation Module SLVUAU1 – October 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 7: Bill Of Materials
5006 Keystone Black, TH Testpoint USB Type C Interface RUK0020B TPD8S300RUK Texas Protector: Short-to- Instruments VBUS Over Voltage and IEC 61000-4-2 ESD Protection, RUK0020b SLVUAU1 – October 2016 TPD8S300 Evaluation Module Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 8: Important Notice
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
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