HP 15-cc000 Maintenance And Service Manual page 63

2. Remove the heat sink (2).
NOTE: Steps 3 and 4 apply to computer models equipped with a graphics subsystem with UMA
memory. See Steps 1 and 2 for heat sink removal information for computer models equipped with a
graphics subsystem with discrete memory.
3. Remove the four Phillips PM2.0×2.9 screws (1) that secure the heat sink to the system board.
4. Remove the heat sink (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with
the heat sink and system board spare part kits.
On computer models equipped with a graphics subsystem with discrete memory: Thermal paste is used on
the processor (1) and the heat sink section (2) that services it. Thermal paste is also used on the VGA
component (3) and the heat sink section (4) that services it.
Component replacement procedures 55